Datasheet

*All dimensions are nominal
Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)
LM2574HVMX-12/NOPB SOIC NPA 14 1000 367.0 367.0 38.0
LM2574HVMX-15/NOPB SOIC NPA 14 1000 367.0 367.0 38.0
LM2574HVMX-3.3/NOPB SOIC NPA 14 1000 367.0 367.0 38.0
LM2574HVMX-5.0 SOIC NPA 14 1000 367.0 367.0 38.0
LM2574HVMX-5.0/NOPB SOIC NPA 14 1000 367.0 367.0 38.0
LM2574HVMX-ADJ/NOPB SOIC NPA 14 1000 367.0 367.0 38.0
LM2574MX-12/NOPB SOIC NPA 14 1000 367.0 367.0 38.0
LM2574MX-3.3/NOPB SOIC NPA 14 1000 367.0 367.0 38.0
LM2574MX-5.0 SOIC NPA 14 1000 367.0 367.0 38.0
LM2574MX-5.0/NOPB SOIC NPA 14 1000 367.0 367.0 38.0
LM2574MX-ADJ SOIC NPA 14 1000 367.0 367.0 38.0
LM2574MX-ADJ/NOPB SOIC NPA 14 1000 367.0 367.0 38.0
PACKAGE MATERIALS INFORMATION
www.ti.com 23-Sep-2013
Pack Materials-Page 2