Datasheet
LM25066I, LM25066IA
www.ti.com
SNVS824C –JUNE 2012–REVISED MARCH 2013
Electrical Characteristics (continued)
Limits in standard type are for T
J
= 25°C only; limits in boldface type apply over the junction temperature (T
J
) range of -40°C
to +85°C unless otherwise stated. Minimum and Maximum limits are specified through test, design, or statistical correlation.
Typical values represent the most likely parametric norm at T
J
= 25°C, and are provided for reference purposes only. Unless
otherwise stated the following conditions apply: VIN = 12V. See
(1)
and
Symbol Parameter Conditions Min Typ Max Unit
Telemetry Accuracy LM25066IA
IIN
ACC
Input Current Accuracy VIN – SENSE = 25mV, CL = GND -1 +1 %
T
J
= 10°C to 85°C
VIN – SENSE = 25mV, CL = GND -1.2 +1
VIN – SENSE = 50mV, CL = VDD -1.8 +1.8
VIN- SENSE= 5mV, CL= GND -5 +5
T
J
= 10°C to 85°C
V
ACC
VAUX, VIN, VOUT Accuracy VIN, VOUT = 12V -1 +1 %
VAUX = 1V
T
J
= 10°C to 85°C
VIN, VOUT = 12V -1 +1.2
VAUX = 1V
PIN
ACC
Input Power Accuracy VIN = 12V, VIN – SENSE = 25mV, -2.0 +2.0 %
CL = GND
Telemetry Accuracy LM25066I
IIN
ACC
Input Current Accuracy VIN – SENSE = 25mV, CL = GND -2.7 +2.4 %
VIN – SENSE = 25mV, CL = GND -2.4 +2.4
T
J
= 10°C to 85°C
V
ACC
VAUX, VIN, VOUT Accuracy VIN, VOUT = 12V -1.6 +1.4 %
VAUX = 1V
VIN, VOUT = 12V -1.4 +1.4
VAUX = 1V
T
J
= 10°C to 85°C
PIN
ACC
Input Power Accuracy VIN = 12V, VIN – SENSE = 25mV, -3.0 +3.0 %
CL = GND
Remote Diode Temperature Sensor
T
ACC
Temperature Accuracy Using Local T
A
= 10°C to 85°C 2 10 °C
Diode
Remote Diode Resolution 9 bits
I
DIODE
External Diode Current Source High level 250 300 µA
Low level 9.4 µA
Diode Current Ratio 26
PMBus Pin Thresholds (SMBA, SDA, SCL)
V
IL
Data, Clock Input Low Voltage 0.8 V
V
IH
Data, Clock Input High Voltage 2.1 5.5 V
V
OL
Data Output Low Voltage I
PULLUP
= 4mA 0 0.4 V
I
LEAK
Input Leakage Current SDA, SMBA, SCL = 5V 1 µA
CL Pin Capacitance SDA, SCL 5 pF
Configuration Pin Thresholds (CB, CL, RETRY)
V
IH
Threshold Voltage 3 V
I
LEAK
Input Leakage Current CL, CB, RETRY = 5V 1 mA
Thermal
(3)
θ
JA
Junction to Ambient 42.3 °C/W
θ
JC
Junction to Case 9.5 °C/W
(3) Junction-to-ambient thermal resistance is highly application and board layout dependent. Specified thermal resistance values for the
package specified is based on a 4-layer, 4"x3", 2/1/1/2 oz. Cu board as per JEDEC standards is used.
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