Datasheet

LM25011, LM25011-Q1
SNVS617G –APRIL 2009–REVISED FEBRUARY 2013 www.ti.com
where R
L
is the inductor’s DC resistance, and the 1.1 factor is an approximation for the AC losses. If it is
expected that the internal dissipation of the LM25011 will produce excessive junction temperatures during normal
operation, good use of the PC board’s ground plane can help to dissipate heat. Additionally the use of wide PC
board traces, where possible, can help conduct heat away from the IC pins. Judicious positioning of the PC
board within the end product, along with the use of any available air flow (forced or natural convection) can help
reduce the junction temperature.
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