Datasheet

Exposed Pad
Connect to GND
5 NC
6 FB
3 BOOT
1 SW
2 VIN
4 GND
7 EN
Exposed Pad
Connect to GND
NC
3
FB
4
BOOT
1
NC
2
8
SW
7
VIN
6
GND
5
EN
LM22676
LM22676-Q1
SNVS587K –SEPTEMBER 2008–REVISED APRIL 2013 www.ti.com
Connection Diagram
Figure 1. 8-Lead Plastic SO PowerPAD Package
Package Number DDA0008B
Figure 2. 7-Lead Plastic PFM Package
Package Number NDR0007A
PIN DESCRIPTIONS
Pin Numbers
Pin Numbers
SO PowerPAD Name Description Application Information
PFM Package
Package
1 3 BOOT Bootstrap input Provides the gate voltage for the high side NFET.
2, 3 5 NC Not Connected Pins are not electrically connected inside the chip. Pins do
function as thermal conductor.
4 6 FB Feedback pin Feedback input to regulator.
5 7 EN Enable input Used to control regulator start-up and shutdown. See
Precision Enable and UVLO section of data sheet.
6 4 GND Ground input to System ground pin.
regulator; system
common
7 2 VIN Input Voltage Input supply to regulator
8 1 SW Switch pin Switching output of regulator
EP EP EP Exposed Pad Connect to ground. Provides thermal connection to PCB.
See Application Information.
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
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Product Folder Links: LM22676 LM22676-Q1