Datasheet
LM22675
SNVS591K –SEPTEMBER 2008–REVISED MARCH 2013
www.ti.com
Electrical Characteristics
Limits in standard type are for T
J
= 25°C only; limits in boldface type apply over the junction temperature (T
J
) range of -40°C
to +125°C. Minimum and Maximum limits are ensured through test, design, or statistical correlation. Typical values represent
the most likely parametric norm at T
A
= T
J
= 25°C, and are provided for reference purposes only. Unless otherwise specified:
V
IN
= 12V.
Min Typ Max
Parameter Test Conditions Units
(1) (2) (1)
LM22675-5.0
V
FB
Feedback Voltage V
IN
= 8V to 42V 4.925/4.9 5.0 5.075/5.1 V
LM22675-ADJ
V
FB
Feedback Voltage V
IN
= 4.7V to 42V 1.266/1.259 1.285 1.304/1.311 V
All Output Voltage Versions
I
Q
Quiescent Current V
FB
= 5V 3.4 6 mA
I
STDBY
Standby Quiescent Current EN Pin = 0V 25 40 µA
I
CL
Current Limit 1.3/1.2 1.5 1.7/1.8 A
I
L
Output Leakage Current V
IN
= 42V, EN Pin = 0V, V
SW
= 0V 0.2 2 µA
V
SW
= -1V 0.1 3 µA
R
DS(ON)
Switch On-Resistance 0.2 0.24/0.32 Ω
f
O
Oscillator Frequency 400 500 600 kHz
T
OFFMIN
Minimum Off-time 100 200 300 ns
T
ONMIN
Minimum On-time 100 ns
I
BIAS
Feedback Bias Current V
FB
= 1.3V (ADJ Version Only) 230 nA
V
EN
Enable Threshold Voltage Falling 1.3 1.6 1.9 V
V
ENHYST
Enable Voltage Hysteresis 0.6 V
I
EN
Enable Input Current EN Input = 0V 6 µA
T
SD
Thermal Shutdown Threshold 150 °C
θ
JA
Thermal Resistance MR package, Junction to ambient 60 °C/W
thermal resistance
(3)
(1) Min and Max limits are 100% production tested at 25°C. Limits over the operating temperature range are ensured through correlation
using Statistical Quality Control (SQC) methods. Limits are used to calculate Ti's Average Outgoing Quality Level (AOQL).
(2) Typical values represent most likely parametric norms at the conditions specified and are not ensured.
(3) The value of θ
JA
for the SO PowerPAD-8 exposed pad package of 60°C/W is valid if package is mounted to 1 square inch of copper.
The θ
JA
value can range from 42 to 115°C/W depending on the amount of PCB copper dedicated to heat transfer.
4 Submit Documentation Feedback Copyright © 2008–2013, Texas Instruments Incorporated
Product Folder Links: LM22675