Datasheet

LM22672-ADJ
VIN
SS
SW
BOOT
FB
GND
VOUT
RT/SYNC
VIN 5.5V to 35V
R
FBB
2.55 k:
C4
120 PF
C2
22 PF
C3
10 nF
+
L1
10 PH
D1
60V 3A
VOUT -5V
C1
2.2 PF
C6
4.7 PF
R
FBT
7.32 k:
EN
LM22672
SNVS588L –SEPTEMBER 2008–REVISED APRIL 2013 www.ti.com
large continuous ground plane on the top or bottom PCB layer will provide the most effective heat dissipation.
The integrity of the solder connection from the IC exposed pad to the PC board is critical. Excessive voids will
greatly diminish the thermal dissipation capacity. The junction-to-ambient thermal resistance of the LM22672 SO
PowerPAD package is specified in the Electrical Characteristics table. See application note AN-2020 (SNVA419)
for more information.
PCB Layout Example
Figure 24. Inverting Regulator Application
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