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8 PCB Layout
The PCB was manufactured with 2oz. copper outer layers, and 1oz. copper inner layers. Twenty 8 mil.
diameter vias placed underneath the device, along with additional vias placed throughout the ground plane
around the device, help improve the thermal dissipation of the board.
Figure 9. Top Layer (Copper planes outlined in grey)
12
AN-2130 LM21215 Evaluation Board SNVA476A–March 2011–Revised May 2013
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