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8 PCB Layout
The PCB was manufactured with 2oz. copper outer layers, and 1oz. copper inner layers. Twenty 8 mil.
diameter vias placed underneath the device, along with additional vias placed throughout the ground plane
around the device, help improve the thermal dissipation of the board.
Figure 8. Top Layer (Copper planes outlined in grey) Figure 9. Mid Layer1
Figure 10. Mid Layer2 Figure 11. Bottom Layer
11
SNVA480A–May 2011–Revised May 2013 AN-2140 LM21212-2 Evaluation Board
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