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7 PCB Layout
The PCB was manufactured with 2oz. copper outer layers, and 1oz. copper inner layers. Twenty 8 mil.
diameter vias placed underneath the device, along with addional vias placed throughout the ground plane
around the device, help improve the thermal dissipation of the board.
Figure 9. Top Layer (Copper planes outlined in grey) Figure 10. Mid Layer1
Figure 11. Mid Layer2 Figure 12. Bottom Layer
11
SNVA467B–February 2011–Revised May 2013 AN-2107 LM21212-1 Evaluation Board
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