Datasheet
LM20333
SNVS558D –MAY 2008–REVISED APRIL 2013
www.ti.com
Electrical Characteristics (continued)
Unless otherwise stated, the following conditions apply: V
VIN
= 12V. Limits in standard type are for T
J
= 25°C only, limits in
bold face type apply over the junction temperature (T
J
) range of -40°C to +125°C. Minimum and maximum limits are
specified through test, design, or statistical correlation. Typical values represent the most likely parametric norm at
T
J
= 25°C, and are provided for reference purposes only.
Symbol Parameter Conditions Min Typ Max Units
F
OSCL
Minimum SYNC Frequency 250 kHz
V
IH_SYNC
SYNC pin Logic High 2 V
V
IL_SYNC
SYNC pin Logic Low 0.8 V
I
SYNC
SYNC pin input leakage V
SYNC
= 5V 10 nA
T
MIN
Minimum Off Time I
LOAD
= 3A 170 ns
Error Amplifier
I
FB
Feedback Pin Bias Current V
FB
= 1V 50 nA
I
COMP(SRC)
COMP Output Source Current V
FB
= 0V 200 400 µA
V
COMP
= 0V
I
COMP(SNK)
COMP Output Sink Current V
FB
= 1.6V 200 350 µA
V
COMP
= 1.6V
g
m
Error Amplifier DC Transconductance I
COMP
= -50 µA to +50 µA 450 515 600 µmho
A
VOL
Error Amplifier Voltage Gain COMP pin open 2000 V/V
GBW Error Amplifier Gain-Bandwidth Product COMP pin open 7 MHz
Current Limit
I
LIM
Cycle By Cycle Positive Current Limit 4.3 5.2 6.0 A
I
LIMNEG
Cycle By Cycle Negative Current Limit 2.8 A
T
ILIM
Cycle By Cycle Current Limit Delay 150 ns
Enable
V
EN(RISING)
EN Pin Rising Threshold 1.2 1.25 1.3 V
V
EN(HYS)
EN Pin Hysteresis 50 mV
I
EN
EN Source Current V
EN
= 0V, V
VIN
= 12V 2 µA
Thermal Shutdown
T
SD
Thermal Shutdown 170 °C
T
SD(HYS)
Thermal Shutdown Hysteresis 20 °C
Thermal Resistance
θ
JC
Junction to Case 5.6 °C/W
θ
JA
Junction to Ambient
(1)
0 LFM airflow 27 °C/W
(1) Measured on a 4 layer 2" x 2" PCB with 1 oz. copper weight inner layers and 2 oz. outer layers.
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