Datasheet

LM1117-N, LM1117I
www.ti.com SNOS412M –FEBRUARY 2000–REVISED MARCH 2013
Table 1. θ
JA
Different Heatsink Area (continued)
Layout Copper Area Thermal Resistance
14 0.284 0.284 83 61
15 0.392 0.392 75 55
16 0.5 0.5 70 53
Figure 25. θ
JA
vs. 1oz Copper Area for SOT-223
Figure 26. θ
JA
vs. 2oz Copper Area for PFM
Figure 27. Maximum Allowable Power Dissipation vs. Ambient Temperature for SOT-223
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