Datasheet

LM1084
www.ti.com SNVS037F –SEPTEMBER 1999–REVISED MARCH 2013
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
Absolute Maximum Ratings
(1)(2)
Maximum Input to Output Voltage Differential
LM1084-ADJ 29V
LM1084-12 18V
LM1084-3.3 27V
LM1084-5.0 25V
Power Dissipation
(3)
Internally Limited
Junction Temperature (T
J
)
(4)
150°C
Storage Temperature Range -65°C to 150°C
Lead Temperature 260°C, to 10 sec
ESD Tolerance
(5)
2000V
(1) Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for
which the device is intended to be functional, but specific performance is not ensured. For ensured specifications and the test
conditions, see the Electrical Characteristics.
(2) If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office/Distributors for availability and
specifications.
(3) Power dissipation is kept in a safe range by current limiting circuitry. Refer to Overload Recovery in Application Notes.
(4) The maximum power dissipation is a function of T
J(max)
, θ
JA
, and T
A
. The maximum allowable power dissipation at any ambient
temperature is P
D
= (T
J(max)
–T
A
)/θ
JA
. All numbers apply for packages soldered directly into a PC board. Refer to THERMAL
CONSIDERATIONS in the Application Note.
(5) For testing purposes, ESD was applied using human body model, 1.5kΩ in series with 100pF.
Operating Ratings
(1)
Junction Temperature Range (T
J
)
(2)
Control Section −40°C to 125°C
Output Section −40°C to 150°C
(1) Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for
which the device is intended to be functional, but specific performance is not ensured. For ensured specifications and the test
conditions, see the Electrical Characteristics.
(2) The maximum power dissipation is a function of T
J(max)
, θ
JA
, and T
A
. The maximum allowable power dissipation at any ambient
temperature is P
D
= (T
J(max)
–T
A
)/θ
JA
. All numbers apply for packages soldered directly into a PC board. Refer to THERMAL
CONSIDERATIONS in the Application Note.
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