Datasheet

LDC1000

SNOSCX2 –SEPTEMBER 2013

www.ti.com

ABSOLUTE MAXIMUM RATINGS

(1)

Human Body Model 1kV

ESD Tolerance

(2)

Charge Device Model 250V

Analog Supply Voltage (VDD – GND) 6V

IO Supply Voltage (VIO – GND) 6V

Voltage on any Analog Pin -0.3V to VDD + 0.3V

Voltage on any Digital Pin -0.3V to VIO + 0.3V

Input Current on INA and INB 8mA

Junction Temperature, TJ

(3)

+150°C

Storage Temperature Range , T

stg

-65°C to +150°C

(1) Absolute Maximum Ratings are limits beyond which damage to the device may occur. Exposure to absolute-maximum-rated conditions

for extended periods may affect device reliability. Operating Ratings are conditions under which operation of the device is intended to be

functional. For ensured specifications and test conditions, see the Electrical Characteristics.

(2) The human body model is a 100pF capacitor discharged through a 1.5kΩ resistor into each pin.

(3) The maximum power dissipation is a function of TJ(MAX), θJA, and the ambient temperature, TA. The maximum allowable power

dissipation at any ambient temperature is PDMAX = (TJ(MAX) - TA)/ θJA. All numbers apply for packages soldered directly onto a PC

board. The package thermal impedance is calculated in accordance with JESD 51-7.

RECOMMENDED OPERATING CONDITIONS

(1)

MIN MAX UNIT

Analog Supply Voltage (VDD – GND) 4.75 5.25 V

IO Supply Voltage (VIO – GND) 1.8 5.25 V

VDD-VIO >=0 V

Operating Temperature, TA -40 125 °C

Package Thermal Resistance

(2)

SON (θ

) 28 °C/W

(1) Absolute Maximum Ratings are limits beyond which damage to the device may occur. Exposure to absolute-maximum-rated conditions

for extended periods may affect device reliability. Operating Ratings are conditions under which operation of the device is intended to be

functional. For ensured specifications and test conditions, see the Electrical Characteristics.

(2) The maximum power dissipation is a function of TJ(MAX), θJA, and the ambient temperature, TA. The maximum allowable power

dissipation at any ambient temperature is PDMAX = (TJ(MAX) - TA)/ θJA. All numbers apply for packages soldered directly onto a PC

board. The package thermal impedance is calculated in accordance with JESD 51-7.

Product Folder Links: LDC1000