Datasheet

TMS570LS1224
www.ti.com SPNS190B –OCTOBER 2012–REVISED FEBRUARY 2015
• Changed EMIF t
h(EMOEH-EMCEH)
from +4 to +5 .................................................................................... 85
• Changed EMIF t
su(EMBAV-EMOEL)
from (RS)*E-5 to (RS)*E-6..................................................................... 85
• Changed EMIF t
h(EMOEH-EMBAIV)
from (RS)*E-4 to (RS)*E-3..................................................................... 85
• Changed EMIF t
su(EMAV-EMOEL)
from (RS)*E-5 to (RS)*E-6...................................................................... 85
• Changed EMIF t
h(EMOEH-EMAIV)
from (RS)*E-4 to (RS)*E-3...................................................................... 85
• Changed EMIF t
d(EMWAITH-EMOEH)
from 3E-3 to 3E+9 ............................................................................ 85
• Changed EMIF t
d(EMWAITH-EMOEH)
from 4E+30 to 4E+20......................................................................... 85
• Changed EMIF t
su(EMDQMV-EMOEL)
from (RS)*E-5 to (RS)*E-6................................................................... 85
• Changed EMIF t
h(EMOEH-EMDQMIV)
from (RS)*E-4 to (RS)*E-3................................................................... 85
• Changed EMIF t
su(EMCEL-EMWEL)
from (WS)*E -4 to (WS)*E -3 ................................................................. 86
• Changed EMIF t
su(EMCEL-EMWEL)
from -4 to -3 ..................................................................................... 86
• Changed EMIF t
h(EMWEH-EMCEH)
from (WS)*E -4 to (WS)*E -3.................................................................. 86
• Changed EMIF t
h(EMWEH-EMCEH)
from -4 to -3 ..................................................................................... 86
• Changed EMIF t
su(EMDQMV-EMWEL)
from (WS)*E -4 to (WS)*E -3................................................................ 86
• Changed EMIF t
h(EMWEH-EMDQMIV)
from (WS)*E -4 to (WS)*E -3................................................................ 86
• Changed EMIF t
su(EMBAV-EMWEL)
from (WS)*E -4 to (WS)*E -3 ................................................................. 86
• Changed EMIF t
h(EMWEH-EMBAIV)
from (WS)*E -4 to (WS)*E -3 ................................................................. 86
• Changed EMIF t
su(EMAV-EMWEL)
from (WS)*E -4 to (WS)*E -3................................................................... 86
• Changed EMIF t
h(EMWEH-EMAIV)
from (WS)*E -4 to (WS)*E -3................................................................... 86
• Changed EMIF t
d(EMWAITH-EMWEH)
from 3E-4 to 3E+11........................................................................... 86
• Changed EMIF t
d(EMWAITH-EMWEH)
from 4E+30 to 4E+24 ........................................................................ 86
• Changed EMIF t
su(EMDV-EMWEL)
from (WS)*E -4 to (WS)*E -3 .................................................................. 86
• Changed EMIF t
h(EMWEH-EMDIV)
from (WS)*E -4 to (WS)*E -3................................................................... 86
• Changed EMIF t
su(EMDQMV-EMWEL)
from (WS)*E -4 to (WS)*E -3................................................................ 86
• Changed EMIF t
h(EMWEH-EMDQMIV)
from (WS)*E -4 to (WS)*E -3................................................................ 86
• Added JTAG ID for revision C silicon .......................................................................................... 106
• Revised description of ePWM Trip Zone Timing Requirement t
w(TZ)
........................................................ 115
• Corrected SPI table note describing Master mode, phase = 0 condition .................................................. 146
• Added Device Identification code for revision C silicon ...................................................................... 157
• Changed address of die identification registers ............................................................................... 157
• Updated/Changed the section title to "Mechanical Packaging and Orderable Information" ............................. 164
• Section 9.1 (Packaging Information): Updated/Changed paragraph........................................................ 164
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