Datasheet

TMS570LS1224
www.ti.com SPNS190B –OCTOBER 2012–REVISED FEBRUARY 2015
Table of Contents
1 Device Overview ......................................... 1 6.9 Device Memory Map ................................ 69
1.1 Features .............................................. 1 6.10 Flash Memory ....................................... 75
1.2 Applications........................................... 2 6.11 Tightly Coupled RAM Interface Module ............. 78
1.3 Description............................................ 2 6.12 Parity Protection for Accesses to Peripheral RAMs 78
1.4 Functional Block Diagram ............................ 4 6.13 On-Chip SRAM Initialization and Testing ........... 80
2 Revision History ......................................... 6 6.14 External Memory Interface (EMIF) .................. 82
3 Device Comparison ..................................... 8 6.15 Vectored Interrupt Manager ......................... 90
4 Terminal Configuration and Functions ............. 9 6.16 DMA Controller ...................................... 94
4.1 PGE QFP Package Pinout (144-Pin)................. 9 6.17 Real Time Interrupt Module ......................... 96
4.2 ZWT BGA Package Ball-Map (337 Ball Grid Array) 10 6.18 Error Signaling Module .............................. 98
4.3 Terminal Functions ................................. 11 6.19 Reset / Abort / Error Sources...................... 102
5 Specifications .......................................... 41 6.20 Digital Windowed Watchdog....................... 105
5.1 Absolute Maximum Ratings Over Operating Free-
6.21 Debug Subsystem ................................. 106
Air Temperature Range ............................ 41
7 Peripheral Information and Electrical
5.2 ESD Ratings ........................................ 41
Specifications ......................................... 111
5.3 Power-On Hours (POH)............................. 41
7.1 Enhanced Translator PWM Modules (ePWM) ..... 111
5.4 Device Recommended Operating Conditions....... 42
7.2 Enhanced Capture Modules (eCAP)............... 116
5.5 Switching Characteristics Over Recommended
7.3 Enhanced Quadrature Encoder (eQEP) ........... 118
Operating Conditions for Clock Domains ........... 43
7.4 Multibuffered 12bit Analog-to-Digital Converter.... 119
5.6 Wait States Required ............................... 43
7.5 General-Purpose Input/Output ..................... 131
5.7 Power Consumption Over Recommended
7.6 Enhanced High-End Timer (N2HET) .............. 132
Operating Conditions................................ 44
7.7 Controller Area Network (DCAN) .................. 136
5.8 Input/Output Electrical Characteristics Over
7.8 Local Interconnect Network Interface (LIN)........ 137
Recommended Operating Conditions............... 45
7.9 Serial Communication Interface (SCI) ............. 138
5.9 Thermal Resistance Characteristics ................ 45
7.10 Inter-Integrated Circuit (I2C) ....................... 139
5.10 Output Buffer Drive Strengths ...................... 46
7.11 Multibuffered / Standard Serial Peripheral
5.11 Input Timings........................................ 47
Interface............................................ 142
5.12 Output Timings ...................................... 47
8 Device and Documentation Support.............. 154
5.13 Low-EMI Output Buffers ............................ 49
8.1 Device and Development-Support Tool
6 System Information and Electrical
Nomenclature ...................................... 154
Specifications........................................... 50
8.2 Documentation Support............................ 156
6.1 Device Power Domains ............................. 50
8.3 Trademarks ........................................ 156
6.2 Voltage Monitor Characteristics ..................... 50
8.4 Electrostatic Discharge Caution ................... 156
6.3 Power Sequencing and Power On Reset ........... 52
8.5 Glossary............................................ 156
6.4 Warm Reset (nRST)................................. 54
8.6 Device Identification................................ 157
6.5 ARM Cortex-R4F CPU Information ................. 55
8.7 Module Certifications............................... 159
6.6 Clocks ............................................... 58
9 Mechanical Packaging and Orderable
6.7 Clock Monitoring .................................... 66
Information............................................. 164
6.8 Glitch Filters......................................... 68
9.1 Packaging Information ............................. 164
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