Datasheet

TMS570LS1224
SPNS190B –OCTOBER 2012–REVISED FEBRUARY 2015 www.ti.com
Table 5-3. Thermal Resistance Characteristics (ZWT Package) (continued)
°C/W
Junction-to-package top, Still air (includes
Ψ
JT
5x5 thermal via cluster in 2s2p PCB 0.33
connected to 1st ground plane)
5.10 Output Buffer Drive Strengths
Table 5-4. Output Buffer Drive Strengths
LOW-LEVEL OUTPUT CURRENT,
I
OL
for V
I
=V
OLmax
or SIGNALS
HIGH-LEVEL OUTPUT CURRENT,
I
OH
for V
I
=V
OHmin
MIBSPI5CLK, MIBSPI5SOMI[0], MIBSPI5SOMI[1], MIBSPI5SOMI[2], MIBSPI5SOMI[3],
MIBSPI5SIMO[0], MIBSPI5SIMO[1], MIBSPI5SIMO[2], MIBSPI5SIMO[3],
TMS, TDI, TDO, RTCK,
SPI4CLK, SPI4SIMO, SPI4SOMI, nERROR,
N2HET2[1], N2HET2[3], N2HET2[5], N2HET2[7], N2HET2[9], N2HET2[11], N2HET2[13],
N2HET2[15]
8 mA
ECAP1, ECAP4, ECAP5, ECAP6
EQEP1I, EQEP1S, EQEP2I, EQEP2S
EPWM1A, EPWM1B, EPWM1SYNCO, ETPW2A, EPWM2B, EPWM3A, EPWM3B,
EPWM4A, EPWM4B, EPWM5A, EPWM5B, EPWM6A, EPWM6B, EPWM7A, EPWM7B
EMIF_ADDR[0:12], EMIF_BA[0:1], EMIF_CKE, EMIF_CLK, EMIF_DATA[0:15], EMIF_nCAS,
EMIF_nCS[0:4], EMIF_nDQM[0:1], EMIF_nOE, EMIF_nRAS, EMIF_nWAIT, EMIF_nWE,
EMIF_RNW
TEST,
MIBSPI3SOMI, MIBSPI3SIMO, MIBSPI3CLK, MIBSPI1SIMO, MIBSPI1SOMI, MIBSPI1CLK,
4 mA
ECAP2, ECAP3
nRST
AD1EVT,
CAN1RX, CAN1TX, CAN2RX, CAN2TX, CAN3RX, CAN3TX,
GIOA[0-7], GIOB[0-7],
LINRX, LINTX,
2 mA zero-dominant
MIBSPI1nCS[0], MIBSPI1nCS[1-3], MIBSPI1nENA, MIBSPI3nCS[0-3], MIBSPI3nENA,
MIBSPI5nCS[0-3], MIBSPI5nENA,
N2HET1[0-31], N2HET2[0], N2HET2[2], N2HET2[4], N2HET2[5], N2HET2[6], N2HET2[7],
N2HET2[8], N2HET2[9], N2HET2[10], N2HET2[11], N2HET2[12], N2HET2[13], N2HET2[14],
N2HET2[15], N2HET2[16], N2HET2[18],
SPI2nCS[0], SPI2nENA, SPI4nCS[0], SPI4nENA
ECLK,
selectable 8 mA / 2 mA
SPI2CLK, SPI2SIMO, SPI2SOMI
The default output buffer drive strength is 8 mA for these signals.
Table 5-5. Selectable 8 mA/2 mA Control
Signal Control Bit Address 8 mA 2 mA
ECLK SYSPC10[0] 0xFFFF FF78 0 1
SPI2CLK SPI2PC9[9] 0xFFF7 F668 0 1
SPI2SIMO SPI2PC9[10] 0xFFF7 F668 0 1
46 Specifications Copyright © 2012–2015, Texas Instruments Incorporated
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