Datasheet

Full Part # TMS 570 LS 12 2 4 B ZWT Q Q1 R
Orderable Part # TMX 570 12 2 4 B ZWT Q Q1 R
Prefix: TM
TMS = Fully Qualified
TMP = Prototype
TMX = Samples
Core Technology:
570 = Cortex R4F
Architecture:
LS = Dual CPUs in Lockstep
(not included in orderable part #)
Flash Memory Size:
12 = 1.25MB
RAM MemorySize:
2 = 192kB
Peripheral Set:
4 = no FlexRay, no Ethernet
Die Revision:
A = Die Revision A
B = Die Revision B
Package Type:
ZWT = 337-Pin Plastic BGA with pb-free solder ball
PGE = 144 Pin Plastic Quad Flatpack
Temperature Range:
Q = -40...+125 C
o
Quality Designator:
Q1 = Automotive
Shipping Options:
R = Tape and Reel
TMS570LS1224
www.ti.com SPNS190B –OCTOBER 2012–REVISED FEBRUARY 2015
Figure 8-1. TMS570LS1224 Device Numbering Conventions
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Product Folder Links: TMS570LS1224