Datasheet

6
RM57L843
SPNS215C –FEBRUARY 2014–REVISED JUNE 2016 www.ti.com
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Table of Contents Copyright © 2014–2016, Texas Instruments Incorporated
Table of Contents
1 Device Overview ......................................... 1
1.1 Features .............................................. 1
1.2 Applications........................................... 2
1.3 Description............................................ 3
1.4 Functional Block Diagram ............................ 5
2 Revision History ......................................... 7
3 Device Comparison ..................................... 8
4 Terminal Configuration and Functions.............. 9
4.1 ZWT BGA Package Ball-Map (337 Terminal Grid
Array) ................................................. 9
4.2 Terminal Functions .................................. 10
5 Specifications .......................................... 54
5.1 Absolute Maximum Ratings ......................... 54
5.2 ESD Ratings ........................................ 54
5.3 Power-On Hours (POH)............................. 54
5.4 Device Recommended Operating Conditions....... 55
5.5 Switching Characteristics over Recommended
Operating Conditions for Clock Domains ........... 56
5.6 Wait States Required - L2 Memories ............... 56
5.7 Power Consumption Summary...................... 58
5.8 Input/Output Electrical Characteristics Over
Recommended Operating Conditions............... 59
5.9 Thermal Resistance Characteristics for the BGA
Package (ZWT) ..................................... 60
5.10 Timing and Switching Characteristics ............... 60
6 System Information and Electrical
Specifications........................................... 63
6.1 Device Power Domains ............................. 63
6.2 Voltage Monitor Characteristics ..................... 64
6.3 Power Sequencing and Power-On Reset ........... 65
6.4 Warm Reset (nRST)................................. 67
6.5 ARM Cortex-R5F CPU Information ................. 68
6.6 Clocks ............................................... 75
6.7 Clock Monitoring .................................... 86
6.8 Glitch Filters......................................... 88
6.9 Device Memory Map ................................ 89
6.10 Flash Memory...................................... 100
6.11 L2RAMW (Level 2 RAM Interface Module) ........ 103
6.12 ECC / Parity Protection for Accesses to Peripheral
RAMs .............................................. 103
6.13 On-Chip SRAM Initialization and Testing .......... 104
6.14 External Memory Interface (EMIF)................. 108
6.15 Vectored Interrupt Manager........................ 115
6.16 ECC Error Event Monitoring and Profiling ......... 119
6.17 DMA Controller..................................... 121
6.18 Real-Time Interrupt Module........................ 125
6.19 Error Signaling Module............................. 127
6.20 Reset / Abort / Error Sources...................... 132
6.21 Digital Windowed Watchdog....................... 136
6.22 Debug Subsystem ................................. 137
7 Peripheral Information and Electrical
Specifications ......................................... 154
7.1 Enhanced Translator PWM Modules (ePWM) ..... 154
7.2 Enhanced Capture Modules (eCAP)............... 159
7.3 Enhanced Quadrature Encoder (eQEP) ........... 162
7.4 12-bit Multibuffered Analog-to-Digital Converter
(MibADC)........................................... 164
7.5 General-Purpose Input/Output ..................... 177
7.6 Enhanced High-End Timer (N2HET) .............. 178
7.7 Controller Area Network (DCAN) .................. 183
7.8 Local Interconnect Network Interface (LIN)........ 184
7.9 Serial Communication Interface (SCI) ............. 185
7.10 Inter-Integrated Circuit (I2C) ....................... 186
7.11 Multibuffered / Standard Serial Peripheral
Interface............................................ 189
7.12 Ethernet Media Access Controller ................. 203
8 Applications, Implementation, and Layout ...... 207
8.1 TI Design or Reference Design.................... 207
9 Device and Documentation Support.............. 208
9.1 Device Support..................................... 208
9.2 Documentation Support............................ 210
9.3 Trademarks ........................................ 210
9.4 Electrostatic Discharge Caution ................... 210
9.5 Glossary............................................ 210
9.6 Device Identification................................ 211
9.7 Module Certifications............................... 213
10 Mechanical Data ...................................... 218
10.1 Packaging Information ............................. 218