Datasheet
R M 5 7 L 8 4 3 B Z W T T R
Prefix:
X = Experimental Device
P = Prototype Device
(Removed when Qualified)
RM = Real Time Microcontroller
CPU:
5 = ARM Cortex-R5F
Flash / RAM Size:
8 = 4MB flash, 512KB RAM
Network Interfaces:
Frequency:
Series Number:
Architecture:
L = Dual CPUs in Lockstep With Caches
Shipping Options:
R = Tape and Reel
Temperature Range:
T = –40 C to 105 C
o o
Package Type:
ZWT = 337-Pin Plastic BGA With Pb-Free Solder Ball
Die Revision:
Blank = Die Revision A
B = Die Revision B
4 = Ethernet
3 = 330 MHz
209
RM57L843
www.ti.com
SPNS215C –FEBRUARY 2014–REVISED JUNE 2016
Submit Documentation Feedback
Product Folder Links: RM57L843
Device and Documentation SupportCopyright © 2014–2016, Texas Instruments Incorporated
Figure 9-1. RM57L843 Device Numbering Conventions