Datasheet
Table Of Contents
- 1 Device Overview
- Table of Contents
- 2 Revision History
- 3 Device Comparison
- 4 Terminal Configuration and Functions
- 4.1 PGE QFP Package Pinout (144-Pin)
- 4.2 ZWT BGA Package Ball-Map (337 Ball Grid Array)
- 4.3 Terminal Functions
- 4.3.1 PGE Package
- 4.3.1.1 Multibuffered Analog-to-Digital Converters (MibADC)
- 4.3.1.2 Enhanced High-End Timer Modules (N2HET)
- 4.3.1.3 Enhanced Capture Modules (eCAP)
- 4.3.1.4 Enhanced Quadrature Encoder Pulse Modules (eQEP)
- 4.3.1.5 Enhanced Pulse-Width Modulator Modules (ePWM)
- 4.3.1.6 General-Purpose Input / Output (GPIO)
- 4.3.1.7 Controller Area Network Controllers (DCAN)
- 4.3.1.8 Local Interconnect Network Interface Module (LIN)
- 4.3.1.9 Standard Serial Communication Interface (SCI)
- 4.3.1.10 Inter-Integrated Circuit Interface Module (I2C)
- 4.3.1.11 Standard Serial Peripheral Interface (SPI)
- 4.3.1.12 Multibuffered Serial Peripheral Interface Modules (MibSPI)
- 4.3.1.13 Ethernet Controller
- 4.3.1.14 USB Host and Device Port Controller Interface
- 4.3.1.15 System Module Interface
- 4.3.1.16 Clock Inputs and Outputs
- 4.3.1.17 Test and Debug Modules Interface
- 4.3.1.18 Flash Supply and Test Pads
- 4.3.1.19 Supply for Core Logic: 1.2V nominal
- 4.3.1.20 Supply for I/O Cells: 3.3V nominal
- 4.3.1.21 Ground Reference for All Supplies Except VCCAD
- 4.3.2 ZWT Package
- 4.3.2.1 Multibuffered Analog-to-Digital Converters (MibADC)
- 4.3.2.2 Enhanced High-End Timer Modules (N2HET)
- 4.3.2.3 Enhanced Capture Modules (eCAP)
- 4.3.2.4 Enhanced Quadrature Encoder Pulse Modules (eQEP)
- 4.3.2.5 Enhanced Pulse-Width Modulator Modules (ePWM)
- 4.3.2.6 General-Purpose Input / Output (GPIO)
- 4.3.2.7 Controller Area Network Controllers (DCAN)
- 4.3.2.8 Local Interconnect Network Interface Module (LIN)
- 4.3.2.9 Standard Serial Communication Interface (SCI)
- 4.3.2.10 Inter-Integrated Circuit Interface Module (I2C)
- 4.3.2.11 Standard Serial Peripheral Interface (SPI)
- 4.3.2.12 Multibuffered Serial Peripheral Interface Modules (MibSPI)
- 4.3.2.13 Ethernet Controller
- 4.3.2.14 USB Host and Device Port Controller Interface
- 4.3.2.15 External Memory Interface (EMIF)
- 4.3.2.16 System Module Interface
- 4.3.2.17 Clock Inputs and Outputs
- 4.3.2.18 Test and Debug Modules Interface
- 4.3.2.19 Flash Supply and Test Pads
- 4.3.2.20 Reserved
- 4.3.2.21 No Connects
- 4.3.2.22 Supply for Core Logic: 1.2V nominal
- 4.3.2.23 Supply for I/O Cells: 3.3V nominal
- 4.3.2.24 Ground Reference for All Supplies Except VCCAD
- 4.3.1 PGE Package
- 5 Specifications
- 5.1 Absolute Maximum Ratings Over Operating Free-Air Temperature Range
- 5.2 ESD Ratings
- 5.3 Power-On Hours (POH)
- 5.4 Device Recommended Operating Conditions
- 5.5 Switching Characteristics Over Recommended Operating Conditions for Clock Domains
- 5.6 Wait States Required
- 5.7 Power Consumption Over Recommended Operating Conditions
- 5.8 Input/Output Electrical Characteristics Over Recommended Operating Conditions
- 5.9 Thermal Resistance Characteristics
- 5.10 Output Buffer Drive Strengths
- 5.11 Input Timings
- 5.12 Output Timings
- 5.13 Low-EMI Output Buffers
- 6 System Information and Electrical Specifications
- 6.1 Device Power Domains
- 6.2 Voltage Monitor Characteristics
- 6.3 Power Sequencing and Power On Reset
- 6.4 Warm Reset (nRST)
- 6.5 ARM Cortex-R4F CPU Information
- 6.6 Clocks
- 6.7 Clock Monitoring
- 6.8 Glitch Filters
- 6.9 Device Memory Map
- 6.10 Flash Memory
- 6.11 Tightly Coupled RAM Interface Module
- 6.12 Parity Protection for Accesses to Peripheral RAMs
- 6.13 On-Chip SRAM Initialization and Testing
- 6.14 External Memory Interface (EMIF)
- 6.15 Vectored Interrupt Manager
- 6.16 DMA Controller
- 6.17 Real Time Interrupt Module
- 6.18 Error Signaling Module
- 6.19 Reset / Abort / Error Sources
- 6.20 Digital Windowed Watchdog
- 6.21 Debug Subsystem
- 7 Peripheral Information and Electrical Specifications
- 7.1 Enhanced Translator PWM Modules (ePWM)
- 7.1.1 ePWM Clocking and Reset
- 7.1.2 Synchronization of ePWMx Time Base Counters
- 7.1.3 Synchronizing all ePWM Modules to the N2HET1 Module Time Base
- 7.1.4 Phase-Locking the Time-Base Clocks of Multiple ePWM Modules
- 7.1.5 ePWM Synchronization with External Devices
- 7.1.6 ePWM Trip Zones
- 7.1.7 Triggering of ADC Start of Conversion Using ePWMx SOCA and SOCB Outputs
- 7.1.8 Enhanced Translator-Pulse Width Modulator (ePWMx) Timings
- 7.2 Enhanced Capture Modules (eCAP)
- 7.3 Enhanced Quadrature Encoder (eQEP)
- 7.4 Multibuffered 12bit Analog-to-Digital Converter
- 7.5 General-Purpose Input/Output
- 7.6 Enhanced High-End Timer (N2HET)
- 7.7 Controller Area Network (DCAN)
- 7.8 Local Interconnect Network Interface (LIN)
- 7.9 Serial Communication Interface (SCI)
- 7.10 Inter-Integrated Circuit (I2C)
- 7.11 Multibuffered / Standard Serial Peripheral Interface
- 7.12 Ethernet Media Access Controller
- 7.13 Universal Serial Bus (USB) Host and Device Controllers
- 7.1 Enhanced Translator PWM Modules (ePWM)
- 8 Device and Documentation Support
- 9 Mechanical Packaging and Orderable Information
- Important Notice
- 1518515_DS2.pdf
RM46L852
SPNS185C –SEPTEMBER 2012 –REVISED JUNE 2015
www.ti.com
6.13.2 On-Chip SRAM Auto Initialization
This microcontroller allows some of the on-chip memories to be initialized through the Memory Hardware
Initialization mechanism in the System module. This hardware mechanism allows an application to
program the memory arrays with error detection capability to a known state based on their error detection
scheme (odd/even parity or ECC).
The MINITGCR register enables the memory initialization sequence, and the MSINENA register selects
the memories that are to be initialized.
For more information on these registers see RM46x Technical Reference Manual (SPNU514).
The mapping of the different on-chip memories to the specific bits of the MSINENA registers is shown in
Table 6-27.
Table 6-27. Memory Initialization
ADDRESS RANGE
CONNECTING MODULE MSINENA REGISTER BIT #
BASE ADDRESS ENDING ADDRESS
RAM (PD#1) 0x08000000 0x0800FFFF 0
(1)
RAM (RAM_PD#1) 0x08010000 0x0801FFFF 0
(1)
RAM (RAM_PD#2) 0x08020000 0x0802FFFF 0
(1)
MIBSPI5 RAM 0xFF0A0000 0xFF0BFFFF 12
(2)
MIBSPI3 RAM 0xFF0C0000 0xFF0DFFFF 11
(2)
MIBSPI1 RAM 0xFF0E0000 0xFF0FFFFF 7
(2)
DCAN3 RAM 0xFF1A0000 0xFF1BFFFF 10
DCAN2 RAM 0xFF1C0000 0xFF1DFFFF 6
DCAN1 RAM 0xFF1E0000 0xFF1FFFFF 5
MIBADC2 RAM 0xFF3A0000 0xFF3BFFFF 14
MIBADC1 RAM 0xFF3E0000 0xFF3FFFFF 8
N2HET2 RAM 0xFF440000 0xFF45FFFF 15
N2HET1 RAM 0xFF460000 0xFF47FFFF 3
HTU2 RAM 0xFF4C0000 0xFF4DFFFF 16
HTU1 RAM 0xFF4E0000 0xFF4FFFFF 4
DMA RAM 0xFFF80000 0xFFF80FFF 1
VIM RAM 0xFFF82000 0xFFF82FFF 2
USB Device RAM RAM is not CPU-Addressable n/a
Ethernet RAM (CPPI Memory
0xFC520000 0xFC521FFF n/a
Slave)
(1) The TCM RAM interface module has separate control bits to select the RAM power domain that is to be auto-initialized.
(2) The MibSPIx modules perform an initialization of the transmit and receive RAMs as soon as the module is released from its local reset..
This is independent of whether the application chooses to initialize the MibSPIx RAMs using the system module auto-initialization
method. The MibSPIx module must be first brought out of its local reset in order to use the system module auto-initialization method.
94 System Information and Electrical Specifications Copyright © 2012–2015, Texas Instruments Incorporated
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