Datasheet
Table Of Contents
- 1 Device Overview
- Table of Contents
- 2 Revision History
- 3 Device Comparison
- 4 Terminal Configuration and Functions
- 4.1 PGE QFP Package Pinout (144-Pin)
- 4.2 ZWT BGA Package Ball-Map (337 Ball Grid Array)
- 4.3 Terminal Functions
- 4.3.1 PGE Package
- 4.3.1.1 Multibuffered Analog-to-Digital Converters (MibADC)
- 4.3.1.2 Enhanced High-End Timer Modules (N2HET)
- 4.3.1.3 Enhanced Capture Modules (eCAP)
- 4.3.1.4 Enhanced Quadrature Encoder Pulse Modules (eQEP)
- 4.3.1.5 Enhanced Pulse-Width Modulator Modules (ePWM)
- 4.3.1.6 General-Purpose Input / Output (GPIO)
- 4.3.1.7 Controller Area Network Controllers (DCAN)
- 4.3.1.8 Local Interconnect Network Interface Module (LIN)
- 4.3.1.9 Standard Serial Communication Interface (SCI)
- 4.3.1.10 Inter-Integrated Circuit Interface Module (I2C)
- 4.3.1.11 Standard Serial Peripheral Interface (SPI)
- 4.3.1.12 Multibuffered Serial Peripheral Interface Modules (MibSPI)
- 4.3.1.13 Ethernet Controller
- 4.3.1.14 USB Host and Device Port Controller Interface
- 4.3.1.15 System Module Interface
- 4.3.1.16 Clock Inputs and Outputs
- 4.3.1.17 Test and Debug Modules Interface
- 4.3.1.18 Flash Supply and Test Pads
- 4.3.1.19 Supply for Core Logic: 1.2V nominal
- 4.3.1.20 Supply for I/O Cells: 3.3V nominal
- 4.3.1.21 Ground Reference for All Supplies Except VCCAD
- 4.3.2 ZWT Package
- 4.3.2.1 Multibuffered Analog-to-Digital Converters (MibADC)
- 4.3.2.2 Enhanced High-End Timer Modules (N2HET)
- 4.3.2.3 Enhanced Capture Modules (eCAP)
- 4.3.2.4 Enhanced Quadrature Encoder Pulse Modules (eQEP)
- 4.3.2.5 Enhanced Pulse-Width Modulator Modules (ePWM)
- 4.3.2.6 General-Purpose Input / Output (GPIO)
- 4.3.2.7 Controller Area Network Controllers (DCAN)
- 4.3.2.8 Local Interconnect Network Interface Module (LIN)
- 4.3.2.9 Standard Serial Communication Interface (SCI)
- 4.3.2.10 Inter-Integrated Circuit Interface Module (I2C)
- 4.3.2.11 Standard Serial Peripheral Interface (SPI)
- 4.3.2.12 Multibuffered Serial Peripheral Interface Modules (MibSPI)
- 4.3.2.13 Ethernet Controller
- 4.3.2.14 USB Host and Device Port Controller Interface
- 4.3.2.15 External Memory Interface (EMIF)
- 4.3.2.16 System Module Interface
- 4.3.2.17 Clock Inputs and Outputs
- 4.3.2.18 Test and Debug Modules Interface
- 4.3.2.19 Flash Supply and Test Pads
- 4.3.2.20 Reserved
- 4.3.2.21 No Connects
- 4.3.2.22 Supply for Core Logic: 1.2V nominal
- 4.3.2.23 Supply for I/O Cells: 3.3V nominal
- 4.3.2.24 Ground Reference for All Supplies Except VCCAD
- 4.3.1 PGE Package
- 5 Specifications
- 5.1 Absolute Maximum Ratings Over Operating Free-Air Temperature Range
- 5.2 ESD Ratings
- 5.3 Power-On Hours (POH)
- 5.4 Device Recommended Operating Conditions
- 5.5 Switching Characteristics Over Recommended Operating Conditions for Clock Domains
- 5.6 Wait States Required
- 5.7 Power Consumption Over Recommended Operating Conditions
- 5.8 Input/Output Electrical Characteristics Over Recommended Operating Conditions
- 5.9 Thermal Resistance Characteristics
- 5.10 Output Buffer Drive Strengths
- 5.11 Input Timings
- 5.12 Output Timings
- 5.13 Low-EMI Output Buffers
- 6 System Information and Electrical Specifications
- 6.1 Device Power Domains
- 6.2 Voltage Monitor Characteristics
- 6.3 Power Sequencing and Power On Reset
- 6.4 Warm Reset (nRST)
- 6.5 ARM Cortex-R4F CPU Information
- 6.6 Clocks
- 6.7 Clock Monitoring
- 6.8 Glitch Filters
- 6.9 Device Memory Map
- 6.10 Flash Memory
- 6.11 Tightly Coupled RAM Interface Module
- 6.12 Parity Protection for Accesses to Peripheral RAMs
- 6.13 On-Chip SRAM Initialization and Testing
- 6.14 External Memory Interface (EMIF)
- 6.15 Vectored Interrupt Manager
- 6.16 DMA Controller
- 6.17 Real Time Interrupt Module
- 6.18 Error Signaling Module
- 6.19 Reset / Abort / Error Sources
- 6.20 Digital Windowed Watchdog
- 6.21 Debug Subsystem
- 7 Peripheral Information and Electrical Specifications
- 7.1 Enhanced Translator PWM Modules (ePWM)
- 7.1.1 ePWM Clocking and Reset
- 7.1.2 Synchronization of ePWMx Time Base Counters
- 7.1.3 Synchronizing all ePWM Modules to the N2HET1 Module Time Base
- 7.1.4 Phase-Locking the Time-Base Clocks of Multiple ePWM Modules
- 7.1.5 ePWM Synchronization with External Devices
- 7.1.6 ePWM Trip Zones
- 7.1.7 Triggering of ADC Start of Conversion Using ePWMx SOCA and SOCB Outputs
- 7.1.8 Enhanced Translator-Pulse Width Modulator (ePWMx) Timings
- 7.2 Enhanced Capture Modules (eCAP)
- 7.3 Enhanced Quadrature Encoder (eQEP)
- 7.4 Multibuffered 12bit Analog-to-Digital Converter
- 7.5 General-Purpose Input/Output
- 7.6 Enhanced High-End Timer (N2HET)
- 7.7 Controller Area Network (DCAN)
- 7.8 Local Interconnect Network Interface (LIN)
- 7.9 Serial Communication Interface (SCI)
- 7.10 Inter-Integrated Circuit (I2C)
- 7.11 Multibuffered / Standard Serial Peripheral Interface
- 7.12 Ethernet Media Access Controller
- 7.13 Universal Serial Bus (USB) Host and Device Controllers
- 7.1 Enhanced Translator PWM Modules (ePWM)
- 8 Device and Documentation Support
- 9 Mechanical Packaging and Orderable Information
- Important Notice
- 1518515_DS2.pdf
RM46L852
SPNS185C –SEPTEMBER 2012 –REVISED JUNE 2015
www.ti.com
6.10 Flash Memory
6.10.1 Flash Memory Configuration
Flash Bank: A separate block of logic consisting of 1 to 16 sectors. Each flash bank normally has a
customer-OTP and a TI-OTP area. These flash sectors share input/output buffers, data paths, sense
amplifiers, and control logic.
Flash Sector: A contiguous region of flash memory which must be erased simultaneously due to physical
construction constraints.
Flash Pump: A charge pump which generates all the voltages required for reading, programming, or
erasing the flash banks.
Flash Module: Interface circuitry required between the host CPU and the flash banks and pump module.
Table 6-23. Flash Memory Banks and Sectors
Memory Arrays (or Banks) Sector Segment Low Address High Address
No.
BANK0 (1.25MBytes)
(1)
0 16K Bytes 0x0000_0000 0x0000_3FFF
1 16K Bytes 0x0000_4000 0x0000_7FFF
2 16K Bytes 0x0000_8000 0x0000_BFFF
3 16K Bytes 0x0000_C000 0x0000_FFFF
4 16K Bytes 0x0001_0000 0x0001_3FFF
5 16K Bytes 0x0001_4000 0x0001_7FFF
6 32K Bytes 0x0001_8000 0x0001_FFFF
7 128K Bytes 0x0002_0000 0x0003_FFFF
8 128K Bytes 0x0004_0000 0x0005_FFFF
9 128K Bytes 0x0006_0000 0x0007_FFFF
10 128K Bytes 0x0008_0000 0x0009_FFFF
11 128K Bytes 0x000A_0000 0x000B_FFFF
12 128K Bytes 0x000C_0000 0x000D_FFFF
13 128K Bytes 0x000E_0000 0x000F_FFFF
14 128K Bytes 0x0010_0000 0x0011_FFFF
15 128K Bytes 0x0012_0000 0x0013_FFFF
BANK7 (64KBytes) for EEPROM emulation
(2)(3)
0 16K Bytes 0xF020_0000 0xF020_3FFF
1 16K Bytes 0xF020_4000 0xF020_7FFF
2 16K Bytes 0xF020_8000 0xF020_BFFF
3 16K Bytes 0xF020_C000 0xF020_FFFF
(1) The Flash banks are 144-bit wide bank with ECC support.
(2) The flash bank7 can be programmed while executing code from flash bank0.
(3) Code execution is not allowed from flash bank7.
6.10.2 Main Features of Flash Module
• Support for multiple flash banks for program and/or data storage
• Simultaneous read access on a bank while performing program or erase operation on any other bank
• Integrated state machines to automate flash erase and program operations
• Pipelined mode operation to improve instruction access interface bandwidth
• Support for Single Error Correction Double Error Detection (SECDED) block inside Cortex-R4F CPU
– Error address is captured for host system debugging
• Support for a rich set of diagnostic features
88 System Information and Electrical Specifications Copyright © 2012–2015, Texas Instruments Incorporated
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