Datasheet
Table Of Contents
- 1 Device Overview
- Table of Contents
- 2 Revision History
- 3 Device Comparison
- 4 Terminal Configuration and Functions
- 4.1 PGE QFP Package Pinout (144-Pin)
- 4.2 ZWT BGA Package Ball-Map (337 Ball Grid Array)
- 4.3 Terminal Functions
- 4.3.1 PGE Package
- 4.3.1.1 Multibuffered Analog-to-Digital Converters (MibADC)
- 4.3.1.2 Enhanced High-End Timer Modules (N2HET)
- 4.3.1.3 Enhanced Capture Modules (eCAP)
- 4.3.1.4 Enhanced Quadrature Encoder Pulse Modules (eQEP)
- 4.3.1.5 Enhanced Pulse-Width Modulator Modules (ePWM)
- 4.3.1.6 General-Purpose Input / Output (GPIO)
- 4.3.1.7 Controller Area Network Controllers (DCAN)
- 4.3.1.8 Local Interconnect Network Interface Module (LIN)
- 4.3.1.9 Standard Serial Communication Interface (SCI)
- 4.3.1.10 Inter-Integrated Circuit Interface Module (I2C)
- 4.3.1.11 Standard Serial Peripheral Interface (SPI)
- 4.3.1.12 Multibuffered Serial Peripheral Interface Modules (MibSPI)
- 4.3.1.13 Ethernet Controller
- 4.3.1.14 USB Host and Device Port Controller Interface
- 4.3.1.15 System Module Interface
- 4.3.1.16 Clock Inputs and Outputs
- 4.3.1.17 Test and Debug Modules Interface
- 4.3.1.18 Flash Supply and Test Pads
- 4.3.1.19 Supply for Core Logic: 1.2V nominal
- 4.3.1.20 Supply for I/O Cells: 3.3V nominal
- 4.3.1.21 Ground Reference for All Supplies Except VCCAD
- 4.3.2 ZWT Package
- 4.3.2.1 Multibuffered Analog-to-Digital Converters (MibADC)
- 4.3.2.2 Enhanced High-End Timer Modules (N2HET)
- 4.3.2.3 Enhanced Capture Modules (eCAP)
- 4.3.2.4 Enhanced Quadrature Encoder Pulse Modules (eQEP)
- 4.3.2.5 Enhanced Pulse-Width Modulator Modules (ePWM)
- 4.3.2.6 General-Purpose Input / Output (GPIO)
- 4.3.2.7 Controller Area Network Controllers (DCAN)
- 4.3.2.8 Local Interconnect Network Interface Module (LIN)
- 4.3.2.9 Standard Serial Communication Interface (SCI)
- 4.3.2.10 Inter-Integrated Circuit Interface Module (I2C)
- 4.3.2.11 Standard Serial Peripheral Interface (SPI)
- 4.3.2.12 Multibuffered Serial Peripheral Interface Modules (MibSPI)
- 4.3.2.13 Ethernet Controller
- 4.3.2.14 USB Host and Device Port Controller Interface
- 4.3.2.15 External Memory Interface (EMIF)
- 4.3.2.16 System Module Interface
- 4.3.2.17 Clock Inputs and Outputs
- 4.3.2.18 Test and Debug Modules Interface
- 4.3.2.19 Flash Supply and Test Pads
- 4.3.2.20 Reserved
- 4.3.2.21 No Connects
- 4.3.2.22 Supply for Core Logic: 1.2V nominal
- 4.3.2.23 Supply for I/O Cells: 3.3V nominal
- 4.3.2.24 Ground Reference for All Supplies Except VCCAD
- 4.3.1 PGE Package
- 5 Specifications
- 5.1 Absolute Maximum Ratings Over Operating Free-Air Temperature Range
- 5.2 ESD Ratings
- 5.3 Power-On Hours (POH)
- 5.4 Device Recommended Operating Conditions
- 5.5 Switching Characteristics Over Recommended Operating Conditions for Clock Domains
- 5.6 Wait States Required
- 5.7 Power Consumption Over Recommended Operating Conditions
- 5.8 Input/Output Electrical Characteristics Over Recommended Operating Conditions
- 5.9 Thermal Resistance Characteristics
- 5.10 Output Buffer Drive Strengths
- 5.11 Input Timings
- 5.12 Output Timings
- 5.13 Low-EMI Output Buffers
- 6 System Information and Electrical Specifications
- 6.1 Device Power Domains
- 6.2 Voltage Monitor Characteristics
- 6.3 Power Sequencing and Power On Reset
- 6.4 Warm Reset (nRST)
- 6.5 ARM Cortex-R4F CPU Information
- 6.6 Clocks
- 6.7 Clock Monitoring
- 6.8 Glitch Filters
- 6.9 Device Memory Map
- 6.10 Flash Memory
- 6.11 Tightly Coupled RAM Interface Module
- 6.12 Parity Protection for Accesses to Peripheral RAMs
- 6.13 On-Chip SRAM Initialization and Testing
- 6.14 External Memory Interface (EMIF)
- 6.15 Vectored Interrupt Manager
- 6.16 DMA Controller
- 6.17 Real Time Interrupt Module
- 6.18 Error Signaling Module
- 6.19 Reset / Abort / Error Sources
- 6.20 Digital Windowed Watchdog
- 6.21 Debug Subsystem
- 7 Peripheral Information and Electrical Specifications
- 7.1 Enhanced Translator PWM Modules (ePWM)
- 7.1.1 ePWM Clocking and Reset
- 7.1.2 Synchronization of ePWMx Time Base Counters
- 7.1.3 Synchronizing all ePWM Modules to the N2HET1 Module Time Base
- 7.1.4 Phase-Locking the Time-Base Clocks of Multiple ePWM Modules
- 7.1.5 ePWM Synchronization with External Devices
- 7.1.6 ePWM Trip Zones
- 7.1.7 Triggering of ADC Start of Conversion Using ePWMx SOCA and SOCB Outputs
- 7.1.8 Enhanced Translator-Pulse Width Modulator (ePWMx) Timings
- 7.2 Enhanced Capture Modules (eCAP)
- 7.3 Enhanced Quadrature Encoder (eQEP)
- 7.4 Multibuffered 12bit Analog-to-Digital Converter
- 7.5 General-Purpose Input/Output
- 7.6 Enhanced High-End Timer (N2HET)
- 7.7 Controller Area Network (DCAN)
- 7.8 Local Interconnect Network Interface (LIN)
- 7.9 Serial Communication Interface (SCI)
- 7.10 Inter-Integrated Circuit (I2C)
- 7.11 Multibuffered / Standard Serial Peripheral Interface
- 7.12 Ethernet Media Access Controller
- 7.13 Universal Serial Bus (USB) Host and Device Controllers
- 7.1 Enhanced Translator PWM Modules (ePWM)
- 8 Device and Documentation Support
- 9 Mechanical Packaging and Orderable Information
- Important Notice
- 1518515_DS2.pdf

RM46L852
www.ti.com
SPNS185C –SEPTEMBER 2012–REVISED JUNE 2015
6.3 Power Sequencing and Power On Reset
6.3.1 Power-Up Sequence
There is no timing dependency between the ramp of the VCCIO and the VCC supply voltage. The power-
up sequence starts with the I/O voltage rising above the minimum I/O supply threshold, (see Table 6-4 for
more details), core voltage rising above the minimum core supply threshold and the release of power-on
reset. The high frequency oscillator will start up first and its amplitude will grow to an acceptable level. The
oscillator start up time is dependent on the type of oscillator and is provided by the oscillator vendor. The
different supplies to the device can be powered up in any order.
The device goes through the following sequential phases during power up.
Table 6-3. Power-Up Phases
Oscillator start-up and validity check 1032 oscillator cycles
eFuse autoload 1160 oscillator cycles
Flash pump power-up 688 oscillator cycles
Flash bank power-up 617 oscillator cycles
Total 3497 oscillator cycles
The CPU reset is released at the end of the above sequence and fetches the first instruction from address
0x00000000.
6.3.2 Power-Down Sequence
The different supplies to the device can be powered down in any order.
6.3.3 Power-On Reset: nPORRST
This is the power-on reset. This reset must be asserted by an external circuitry whenever the I/O or core
supplies are outside the specified recommended range. This signal has a glitch filter on it. It also has an
internal pulldown.
6.3.3.1 nPORRST Electrical and Timing Requirements
Table 6-4. Electrical Requirements for nPORRST
NO Parameter MIN MAX Unit
V
CCPORL
V
CC
low supply level when nPORRST must be active during power- 0.5 V
up
V
CCPORH
V
CC
high supply level when nPORRST must remain active during 1.14 V
power-up and become active during power down
V
CCIOPORL
V
CCIO
/ V
CCP
low supply level when nPORRST must be active during 1.1 V
power-up
V
CCIOPORH
V
CCIO
/ V
CCP
high supply level when nPORRST must remain active 3.0 V
during power-up and become active during power down
V
IL(PORRST)
Low-level input voltage of nPORRST V
CCIO
> 2.5V 0.2 * V
CCIO
V
Low-level input voltage of nPORRST V
CCIO
< 2.5V 0.5 V
3 t
su(PORRST)
Setup time, nPORRST active before V
CCIO
and V
CCP
> V
CCIOPORL
0 ms
during power-up
6 t
h(PORRST)
Hold time, nPORRST active after V
CC
> V
CCPORH
1 ms
7 t
su(PORRST)
Setup time, nPORRST active before V
CC
< V
CCPORH
during power 2 µs
down
8 t
h(PORRST)
Hold time, nPORRST active after V
CCIO
and V
CCP
> V
CCIOPORH
1 ms
9 t
h(PORRST)
Hold time, nPORRST active after V
CC
< V
CCPORL
0 ms
Copyright © 2012–2015, Texas Instruments Incorporated System Information and Electrical Specifications 63
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