Datasheet
Table Of Contents
- 1 Device Overview
- Table of Contents
- 2 Revision History
- 3 Device Comparison
- 4 Terminal Configuration and Functions
- 4.1 PGE QFP Package Pinout (144-Pin)
- 4.2 ZWT BGA Package Ball-Map (337 Ball Grid Array)
- 4.3 Terminal Functions
- 4.3.1 PGE Package
- 4.3.1.1 Multibuffered Analog-to-Digital Converters (MibADC)
- 4.3.1.2 Enhanced High-End Timer Modules (N2HET)
- 4.3.1.3 Enhanced Capture Modules (eCAP)
- 4.3.1.4 Enhanced Quadrature Encoder Pulse Modules (eQEP)
- 4.3.1.5 Enhanced Pulse-Width Modulator Modules (ePWM)
- 4.3.1.6 General-Purpose Input / Output (GPIO)
- 4.3.1.7 Controller Area Network Controllers (DCAN)
- 4.3.1.8 Local Interconnect Network Interface Module (LIN)
- 4.3.1.9 Standard Serial Communication Interface (SCI)
- 4.3.1.10 Inter-Integrated Circuit Interface Module (I2C)
- 4.3.1.11 Standard Serial Peripheral Interface (SPI)
- 4.3.1.12 Multibuffered Serial Peripheral Interface Modules (MibSPI)
- 4.3.1.13 Ethernet Controller
- 4.3.1.14 USB Host and Device Port Controller Interface
- 4.3.1.15 System Module Interface
- 4.3.1.16 Clock Inputs and Outputs
- 4.3.1.17 Test and Debug Modules Interface
- 4.3.1.18 Flash Supply and Test Pads
- 4.3.1.19 Supply for Core Logic: 1.2V nominal
- 4.3.1.20 Supply for I/O Cells: 3.3V nominal
- 4.3.1.21 Ground Reference for All Supplies Except VCCAD
- 4.3.2 ZWT Package
- 4.3.2.1 Multibuffered Analog-to-Digital Converters (MibADC)
- 4.3.2.2 Enhanced High-End Timer Modules (N2HET)
- 4.3.2.3 Enhanced Capture Modules (eCAP)
- 4.3.2.4 Enhanced Quadrature Encoder Pulse Modules (eQEP)
- 4.3.2.5 Enhanced Pulse-Width Modulator Modules (ePWM)
- 4.3.2.6 General-Purpose Input / Output (GPIO)
- 4.3.2.7 Controller Area Network Controllers (DCAN)
- 4.3.2.8 Local Interconnect Network Interface Module (LIN)
- 4.3.2.9 Standard Serial Communication Interface (SCI)
- 4.3.2.10 Inter-Integrated Circuit Interface Module (I2C)
- 4.3.2.11 Standard Serial Peripheral Interface (SPI)
- 4.3.2.12 Multibuffered Serial Peripheral Interface Modules (MibSPI)
- 4.3.2.13 Ethernet Controller
- 4.3.2.14 USB Host and Device Port Controller Interface
- 4.3.2.15 External Memory Interface (EMIF)
- 4.3.2.16 System Module Interface
- 4.3.2.17 Clock Inputs and Outputs
- 4.3.2.18 Test and Debug Modules Interface
- 4.3.2.19 Flash Supply and Test Pads
- 4.3.2.20 Reserved
- 4.3.2.21 No Connects
- 4.3.2.22 Supply for Core Logic: 1.2V nominal
- 4.3.2.23 Supply for I/O Cells: 3.3V nominal
- 4.3.2.24 Ground Reference for All Supplies Except VCCAD
- 4.3.1 PGE Package
- 5 Specifications
- 5.1 Absolute Maximum Ratings Over Operating Free-Air Temperature Range
- 5.2 ESD Ratings
- 5.3 Power-On Hours (POH)
- 5.4 Device Recommended Operating Conditions
- 5.5 Switching Characteristics Over Recommended Operating Conditions for Clock Domains
- 5.6 Wait States Required
- 5.7 Power Consumption Over Recommended Operating Conditions
- 5.8 Input/Output Electrical Characteristics Over Recommended Operating Conditions
- 5.9 Thermal Resistance Characteristics
- 5.10 Output Buffer Drive Strengths
- 5.11 Input Timings
- 5.12 Output Timings
- 5.13 Low-EMI Output Buffers
- 6 System Information and Electrical Specifications
- 6.1 Device Power Domains
- 6.2 Voltage Monitor Characteristics
- 6.3 Power Sequencing and Power On Reset
- 6.4 Warm Reset (nRST)
- 6.5 ARM Cortex-R4F CPU Information
- 6.6 Clocks
- 6.7 Clock Monitoring
- 6.8 Glitch Filters
- 6.9 Device Memory Map
- 6.10 Flash Memory
- 6.11 Tightly Coupled RAM Interface Module
- 6.12 Parity Protection for Accesses to Peripheral RAMs
- 6.13 On-Chip SRAM Initialization and Testing
- 6.14 External Memory Interface (EMIF)
- 6.15 Vectored Interrupt Manager
- 6.16 DMA Controller
- 6.17 Real Time Interrupt Module
- 6.18 Error Signaling Module
- 6.19 Reset / Abort / Error Sources
- 6.20 Digital Windowed Watchdog
- 6.21 Debug Subsystem
- 7 Peripheral Information and Electrical Specifications
- 7.1 Enhanced Translator PWM Modules (ePWM)
- 7.1.1 ePWM Clocking and Reset
- 7.1.2 Synchronization of ePWMx Time Base Counters
- 7.1.3 Synchronizing all ePWM Modules to the N2HET1 Module Time Base
- 7.1.4 Phase-Locking the Time-Base Clocks of Multiple ePWM Modules
- 7.1.5 ePWM Synchronization with External Devices
- 7.1.6 ePWM Trip Zones
- 7.1.7 Triggering of ADC Start of Conversion Using ePWMx SOCA and SOCB Outputs
- 7.1.8 Enhanced Translator-Pulse Width Modulator (ePWMx) Timings
- 7.2 Enhanced Capture Modules (eCAP)
- 7.3 Enhanced Quadrature Encoder (eQEP)
- 7.4 Multibuffered 12bit Analog-to-Digital Converter
- 7.5 General-Purpose Input/Output
- 7.6 Enhanced High-End Timer (N2HET)
- 7.7 Controller Area Network (DCAN)
- 7.8 Local Interconnect Network Interface (LIN)
- 7.9 Serial Communication Interface (SCI)
- 7.10 Inter-Integrated Circuit (I2C)
- 7.11 Multibuffered / Standard Serial Peripheral Interface
- 7.12 Ethernet Media Access Controller
- 7.13 Universal Serial Bus (USB) Host and Device Controllers
- 7.1 Enhanced Translator PWM Modules (ePWM)
- 8 Device and Documentation Support
- 9 Mechanical Packaging and Orderable Information
- Important Notice
- 1518515_DS2.pdf

RM46L852
SPNS185C –SEPTEMBER 2012 –REVISED JUNE 2015
www.ti.com
7.11.5 SPI Slave Mode I/O Timings
Table 7-35. SPI Slave Mode External Timing Parameters (CLOCK PHASE = 0, SPICLK = input, SPISIMO =
input, and SPISOMI = output)
(1)(2)(3)(4)
NO. Parameter MIN MAX Unit
1 t
c(SPC)S
Cycle time, SPICLK
(5)
40 ns
2
(6)
t
w(SPCH)S
Pulse duration, SPICLK high (clock polarity = 0) 14 ns
t
w(SPCL)S
Pulse duration, SPICLK low (clock polarity = 1) 14
3
(6)
t
w(SPCL)S
Pulse duration, SPICLK low (clock polarity = 0) 14 ns
t
w(SPCH)S
Pulse duration, SPICLK high (clock polarity = 1) 14
4
(6)
t
d(SPCH-SOMI)S
Delay time, SPISOMI valid after SPICLK high (clock t
rf(SOMI)
+ 20 ns
polarity = 0)
t
d(SPCL-SOMI)S
Delay time, SPISOMI valid after SPICLK low (clock polarity t
rf(SOMI)
+ 20
= 1)
5
(6)
t
h(SPCH-SOMI)S
Hold time, SPISOMI data valid after SPICLK high (clock 2 ns
polarity =0)
t
h(SPCL-SOMI)S
Hold time, SPISOMI data valid after SPICLK low (clock 2
polarity =1)
6
(6)
t
su(SIMO-SPCL)S
Setup time, SPISIMO before SPICLK low (clock polarity = 4 ns
0)
t
su(SIMO-SPCH)S
Setup time, SPISIMO before SPICLK high (clock polarity = 4
1)
7
(6)
t
h(SPCL-SIMO)S
Hold time, SPISIMO data valid after SPICLK low (clock 2 ns
polarity = 0)
t
h(SPCH-SIMO)S
Hold time, SPISIMO data valid after S PICLK high (clock 2
polarity = 1)
8 t
d(SPCL-SENAH)S
Delay time, SPIENAn high after last SPICLK low (clock 1.5t
c(VCLK)
2.5t
c(VCLK)
+t
r(ENAn)
+ ns
polarity = 0) 22
t
d(SPCH-SENAH)S
Delay time, SPIENAn high after last SPICLK high (clock 1.5t
c(VCLK)
2.5t
c(VCLK)
+ t
r(ENAn)
+
polarity = 1) 22
9 t
d(SCSL-SENAL)S
Delay time, SPIENAn low after SPICSn low (if new data t
f(ENAn)
t
c(VCLK)
+t
f(ENAn)
+27 ns
has been written to the SPI buffer)
(1) The MASTER bit (SPIGCR1.0) is cleared and the CLOCK PHASE bit (SPIFMTx.16) is cleared.
(2) If the SPI is in slave mode, the following must be true: t
c(SPC)S
≥ (PS + 1) t
c(VCLK)
, where PS = prescale value set in SPIFMTx.[15:8].
(3) For rise and fall timings, see Table 5-7.
(4) t
c(VCLK)
= interface clock cycle time = 1 /f
(VCLK)
(5) When the SPI is in Slave mode, the following must be true:
For PS values from 1 to 255: t
c(SPC)S
≥ (PS +1)t
c(VCLK)
≥ 40ns, where PS is the prescale value set in the SPIFMTx.[15:8] register bits.
For PS values of 0: t
c(SPC)S
= 2t
c(VCLK)
≥ 40ns.
(6) The active edge of the SPICLK signal referenced is controlled by the CLOCK POLARITY bit (SPIFMTx.17).
164 Peripheral Information and Electrical Specifications Copyright © 2012–2015, Texas Instruments Incorporated
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