Datasheet
Table Of Contents
- 1 Device Overview
- Table of Contents
- 2 Revision History
- 3 Device Comparison
- 4 Terminal Configuration and Functions
- 4.1 PGE QFP Package Pinout (144-Pin)
- 4.2 ZWT BGA Package Ball-Map (337 Ball Grid Array)
- 4.3 Terminal Functions
- 4.3.1 PGE Package
- 4.3.1.1 Multibuffered Analog-to-Digital Converters (MibADC)
- 4.3.1.2 Enhanced High-End Timer Modules (N2HET)
- 4.3.1.3 Enhanced Capture Modules (eCAP)
- 4.3.1.4 Enhanced Quadrature Encoder Pulse Modules (eQEP)
- 4.3.1.5 Enhanced Pulse-Width Modulator Modules (ePWM)
- 4.3.1.6 General-Purpose Input / Output (GPIO)
- 4.3.1.7 Controller Area Network Controllers (DCAN)
- 4.3.1.8 Local Interconnect Network Interface Module (LIN)
- 4.3.1.9 Standard Serial Communication Interface (SCI)
- 4.3.1.10 Inter-Integrated Circuit Interface Module (I2C)
- 4.3.1.11 Standard Serial Peripheral Interface (SPI)
- 4.3.1.12 Multibuffered Serial Peripheral Interface Modules (MibSPI)
- 4.3.1.13 Ethernet Controller
- 4.3.1.14 USB Host and Device Port Controller Interface
- 4.3.1.15 System Module Interface
- 4.3.1.16 Clock Inputs and Outputs
- 4.3.1.17 Test and Debug Modules Interface
- 4.3.1.18 Flash Supply and Test Pads
- 4.3.1.19 Supply for Core Logic: 1.2V nominal
- 4.3.1.20 Supply for I/O Cells: 3.3V nominal
- 4.3.1.21 Ground Reference for All Supplies Except VCCAD
- 4.3.2 ZWT Package
- 4.3.2.1 Multibuffered Analog-to-Digital Converters (MibADC)
- 4.3.2.2 Enhanced High-End Timer Modules (N2HET)
- 4.3.2.3 Enhanced Capture Modules (eCAP)
- 4.3.2.4 Enhanced Quadrature Encoder Pulse Modules (eQEP)
- 4.3.2.5 Enhanced Pulse-Width Modulator Modules (ePWM)
- 4.3.2.6 General-Purpose Input / Output (GPIO)
- 4.3.2.7 Controller Area Network Controllers (DCAN)
- 4.3.2.8 Local Interconnect Network Interface Module (LIN)
- 4.3.2.9 Standard Serial Communication Interface (SCI)
- 4.3.2.10 Inter-Integrated Circuit Interface Module (I2C)
- 4.3.2.11 Standard Serial Peripheral Interface (SPI)
- 4.3.2.12 Multibuffered Serial Peripheral Interface Modules (MibSPI)
- 4.3.2.13 Ethernet Controller
- 4.3.2.14 USB Host and Device Port Controller Interface
- 4.3.2.15 External Memory Interface (EMIF)
- 4.3.2.16 System Module Interface
- 4.3.2.17 Clock Inputs and Outputs
- 4.3.2.18 Test and Debug Modules Interface
- 4.3.2.19 Flash Supply and Test Pads
- 4.3.2.20 Reserved
- 4.3.2.21 No Connects
- 4.3.2.22 Supply for Core Logic: 1.2V nominal
- 4.3.2.23 Supply for I/O Cells: 3.3V nominal
- 4.3.2.24 Ground Reference for All Supplies Except VCCAD
- 4.3.1 PGE Package
- 5 Specifications
- 5.1 Absolute Maximum Ratings Over Operating Free-Air Temperature Range
- 5.2 ESD Ratings
- 5.3 Power-On Hours (POH)
- 5.4 Device Recommended Operating Conditions
- 5.5 Switching Characteristics Over Recommended Operating Conditions for Clock Domains
- 5.6 Wait States Required
- 5.7 Power Consumption Over Recommended Operating Conditions
- 5.8 Input/Output Electrical Characteristics Over Recommended Operating Conditions
- 5.9 Thermal Resistance Characteristics
- 5.10 Output Buffer Drive Strengths
- 5.11 Input Timings
- 5.12 Output Timings
- 5.13 Low-EMI Output Buffers
- 6 System Information and Electrical Specifications
- 6.1 Device Power Domains
- 6.2 Voltage Monitor Characteristics
- 6.3 Power Sequencing and Power On Reset
- 6.4 Warm Reset (nRST)
- 6.5 ARM Cortex-R4F CPU Information
- 6.6 Clocks
- 6.7 Clock Monitoring
- 6.8 Glitch Filters
- 6.9 Device Memory Map
- 6.10 Flash Memory
- 6.11 Tightly Coupled RAM Interface Module
- 6.12 Parity Protection for Accesses to Peripheral RAMs
- 6.13 On-Chip SRAM Initialization and Testing
- 6.14 External Memory Interface (EMIF)
- 6.15 Vectored Interrupt Manager
- 6.16 DMA Controller
- 6.17 Real Time Interrupt Module
- 6.18 Error Signaling Module
- 6.19 Reset / Abort / Error Sources
- 6.20 Digital Windowed Watchdog
- 6.21 Debug Subsystem
- 7 Peripheral Information and Electrical Specifications
- 7.1 Enhanced Translator PWM Modules (ePWM)
- 7.1.1 ePWM Clocking and Reset
- 7.1.2 Synchronization of ePWMx Time Base Counters
- 7.1.3 Synchronizing all ePWM Modules to the N2HET1 Module Time Base
- 7.1.4 Phase-Locking the Time-Base Clocks of Multiple ePWM Modules
- 7.1.5 ePWM Synchronization with External Devices
- 7.1.6 ePWM Trip Zones
- 7.1.7 Triggering of ADC Start of Conversion Using ePWMx SOCA and SOCB Outputs
- 7.1.8 Enhanced Translator-Pulse Width Modulator (ePWMx) Timings
- 7.2 Enhanced Capture Modules (eCAP)
- 7.3 Enhanced Quadrature Encoder (eQEP)
- 7.4 Multibuffered 12bit Analog-to-Digital Converter
- 7.5 General-Purpose Input/Output
- 7.6 Enhanced High-End Timer (N2HET)
- 7.7 Controller Area Network (DCAN)
- 7.8 Local Interconnect Network Interface (LIN)
- 7.9 Serial Communication Interface (SCI)
- 7.10 Inter-Integrated Circuit (I2C)
- 7.11 Multibuffered / Standard Serial Peripheral Interface
- 7.12 Ethernet Media Access Controller
- 7.13 Universal Serial Bus (USB) Host and Device Controllers
- 7.1 Enhanced Translator PWM Modules (ePWM)
- 8 Device and Documentation Support
- 9 Mechanical Packaging and Orderable Information
- Important Notice
- 1518515_DS2.pdf

RM46L852
SPNS185C –SEPTEMBER 2012 –REVISED JUNE 2015
www.ti.com
7.11.4 MibSPI/SPI Master Mode I/O Timing Specifications
Table 7-33. SPI Master Mode External Timing Parameters (CLOCK PHASE = 0, SPICLK = output, SPISIMO
= output, and SPISOMI = input)
(1)(2)(3)
NO. Parameter MIN MAX Unit
1 t
c(SPC)M
Cycle time, SPICLK
(4)
40 256t
c(VCLK)
ns
2
(5)
t
w(SPCH)M
Pulse duration, SPICLK high (clock 0.5t
c(SPC)M
– t
r(SPC)M
– 3 0.5t
c(SPC)M
+ 3 ns
polarity = 0)
t
w(SPCL)M
Pulse duration, SPICLK low (clock 0.5t
c(SPC)M
– t
f(SPC)M
– 3 0.5t
c(SPC)M
+ 3
polarity = 1)
3
(5)
t
w(SPCL)M
Pulse duration, SPICLK low (clock 0.5t
c(SPC)M
– t
f(SPC)M
– 3 0.5t
c(SPC)M
+ 3 ns
polarity = 0)
t
w(SPCH)M
Pulse duration, SPICLK high (clock 0.5t
c(SPC)M
– t
r(SPC)M
– 3 0.5t
c(SPC)M
+ 3
polarity = 1)
4
(5)
t
d(SPCH-SIMO)M
Delay time, SPISIMO valid before 0.5t
c(SPC)M
– 6 ns
SPICLK low (clock polarity = 0)
t
d(SPCL-SIMO)M
Delay time, SPISIMO valid before 0.5t
c(SPC)M
– 6
SPICLK high (clock polarity = 1)
5
(5)
t
v(SPCL-SIMO)M
Valid time, SPISIMO data valid after 0.5t
c(SPC)M
– t
f(SPC)
– 4 ns
SPICLK low (clock polarity = 0)
t
v(SPCH-SIMO)M
Valid time, SPISIMO data valid after 0.5t
c(SPC)M
– t
r(SPC)
– 4
SPICLK high (clock polarity = 1)
6
(5)
t
su(SOMI-SPCL)M
Setup time, SPISOMI before SPICLK t
f(SPC)
+ 2.2 ns
low (clock polarity = 0)
t
su(SOMI-SPCH)M
Setup time, SPISOMI before SPICLK t
r(SPC)
+ 2.2
high (clock polarity = 1)
7
(5)
t
h(SPCL-SOMI)M
Hold time, SPISOMI data valid after 10 ns
SPICLK low (clock polarity = 0)
t
h(SPCH-SOMI)M
Hold time, SPISOMI data valid after 10
SPICLK high (clock polarity = 1)
8
(6)
t
C2TDELAY
Setup time CS active CSHOLD = 0 C2TDELAY*t
c(VCLK)
+ 2*t
c(VCLK)
(C2TDELAY+2) * t
c(VCLK)
- ns
until SPICLK high - t
f(SPICS)
+ t
r(SPC)
– 7 t
f(SPICS)
+ t
r(SPC)
+ 5.5
(clock polarity = 0)
CSHOLD = 1 C2TDELAY*t
c(VCLK)
+ 3*t
c(VCLK)
(C2TDELAY+3) * t
c(VCLK)
-
- t
f(SPICS)
+ t
r(SPC)
– 7 t
f(SPICS)
+ t
r(SPC)
+ 5.5
Setup time CS active CSHOLD = 0 C2TDELAY*t
c(VCLK)
+ 2*t
c(VCLK)
(C2TDELAY+2) * t
c(VCLK)
- ns
until SPICLK low - t
f(SPICS)
+ t
f(SPC)
– 7 t
f(SPICS)
+ t
f(SPC)
+ 5.5
(clock polarity = 1)
CSHOLD = 1 C2TDELAY*t
c(VCLK)
+ 3*t
c(VCLK)
(C2TDELAY+3) * t
c(VCLK)
-
- t
f(SPICS)
+ t
f(SPC)
– 7 t
f(SPICS)
+ t
f(SPC)
+ 5.5
9
(6)
t
T2CDELAY
Hold time SPICLK low until CS inactive 0.5*t
c(SPC)M
+ 0.5*t
c(SPC)M
+ ns
(clock polarity = 0) T2CDELAY*t
c(VCLK)
+ t
c(VCLK)
- T2CDELAY*t
c(VCLK)
+ t
c(VCLK)
-
t
f(SPC)
+ t
r(SPICS)
- 7 t
f(SPC)
+ t
r(SPICS)
+ 11
Hold time SPICLK high until CS 0.5*t
c(SPC)M
+ 0.5*t
c(SPC)M
+ ns
inactive (clock polarity = 1) T2CDELAY*t
c(VCLK)
+ t
c(VCLK)
- T2CDELAY*t
c(VCLK)
+ t
c(VCLK)
-
t
r(SPC)
+ tr(SPICS) - 7 t
r(SPC)
+ t
r(SPICS)
+ 11
10 t
SPIENA
SPIENAn Sample point (C2TDELAY+1) * t
c(VCLK)
- (C2TDELAY+1)*t
c(VCLK)
ns
t
f(SPICS)
– 29
11 t
SPIENAW
SPIENAn Sample point from write to (C2TDELAY+2)*t
c(VCLK)
ns
buffer
(1) The MASTER bit (SPIGCR1.0) is set and the CLOCK PHASE bit (SPIFMTx.16) is cleared.
(2) t
c(VCLK)
= interface clock cycle time = 1 / f
(VCLK)
(3) For rise and fall timings, see Table 5-7.
(4) When the SPI is in Master mode, the following must be true:
For PS values from 1 to 255: t
c(SPC)M
≥ (PS +1)t
c(VCLK)
≥ 40ns, where PS is the prescale value set in the SPIFMTx.[15:8] register bits.
For PS values of 0: t
c(SPC)M
= 2t
c(VCLK)
≥ 40ns.
The external load on the SPICLK pin must be less than 60pF.
(5) The active edge of the SPICLK signal referenced is controlled by the CLOCK POLARITY bit (SPIFMTx.17).
(6) C2TDELAY and T2CDELAY is programmed in the SPIDELAY register
160 Peripheral Information and Electrical Specifications Copyright © 2012–2015, Texas Instruments Incorporated
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