Datasheet
TMS570LS0432
TMS570LS0332
www.ti.com
SPNS186A –OCTOBER 2012–REVISED SEPTEMBER 2013
Table 6-1. Device ID Bit Allocation Register Field Descriptions
Bit Field Value Description
31 CP15 Indicates the presence of coprocessor 15
1 CP15 present
30-17 UNIQUE ID 100100
Silicon version (revision) bits.
This bitfield holds a unique number for a dedicated device configuration (die).
16-13 TECH Process technology on which the device is manufactured.
0101 F021
12 I/O VOLTAGE I/O voltage of the device.
0 I/O are 3.3v
11 PERIPHERAL Peripheral Parity
PARITY
1 Parity on peripheral memories
10-9 FLASH ECC Flash ECC
10 Program memory with ECC
8 RAM ECC Indicates if RAM memory ECC is present.
1 ECC implemented
7-3 REVISION 0 Revision of the Device.
2-0 FAMILY ID 101 The platform family ID is always 0b101
6.2.2 Die Identification Registers
The four die ID registers at addresses 0xFFFFE1F0, 0xFFFFE1F4, 0xFFFFE1F8 and FFFFE1FC form a
128-bit dieid with the information as shown in Table Table 6-2.
Table 6-2. Die-ID Registers
Item # of Bits Bit Location
X Coord. on Wafer 12 0xFFFFE1F0[11:0]
Y Coord. on Wafer 12 0xFFFFE1F0[23:12]
Wafer # 8 0xFFFFE1F0[31:24]
Lot # 24 0xFFFFE1F4[23:0]
Reserved 72 0xFFFFE1F4[31:24], 0xFFFFE1F8[31:0],
0xFFFFE1FC[31:0]
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see TI's Terms of Use.
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At e2e.ti.com, you can ask questions, share knowledge, explore ideas and help solve
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6.4 Module Certifications
The following communications modules have received certification of adherence to a standard.
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