Datasheet
8
TMS320F28379S
,
TMS320F28377S
TMS320F28376S, TMS320F28375S, TMS320F28374S
SPRS881C –AUGUST 2014–REVISED MAY 2016
www.ti.com
Submit Documentation Feedback
Product Folder Links: TMS320F28379S TMS320F28377S TMS320F28376S TMS320F28375S TMS320F28374S
Device Comparison Copyright © 2014–2016, Texas Instruments Incorporated
Table 3-1. Device Comparison (continued)
FEATURE
(1)
28379S 28377S 28376S 28375S 28374S
Package Type
(ZWT is an nFBGA package.
PTP is an HLQFP package.
PZP is an HTQFP package.)
337-
Ball
ZWT
176-
Pin
PTP
100-
Pin
PZP
337-
Ball
ZWT
176-
Pin
PTP
100-
Pin
PZP
337-
Ball
ZWT
176-
Pin
PTP
100-
Pin
PZP
337-
Ball
ZWT
176-
Pin
PTP
100-
Pin
PZP
337-
Ball
ZWT
176-
Pin
PTP
100-
Pin
PZP
Control Peripherals
(3)
eCAP inputs – Type 0 6
Enhanced Pulse Width Modulator (ePWM)
channels – Type 4
24 15 24 15 24 15 24 15 24 15
eQEP modules – Type 0 3 2 3 2 3 2 3 2 3 2
High-resolution ePWM channels – Type 4 16 9 16 9 16 9 16 9 16 9
SDFM channels – Type 0 8 6 8 6 8 6 8 6 8 6
Communication Peripherals
(3)
Controller Area Network (CAN) – Type 0
(4)
2
Inter-Integrated Circuit (I
2
C) – Type 0
2
Multichannel Buffered Serial Port (McBSP) –
Type 1
2
Serial Communications Interface (SCI) –
Type 0
4 3 4 3 4 3 4 3 4 3
Serial Peripheral Interface (SPI) – Type 2 3
Universal Serial Bus (USB) – Type 0 1
uPP – Type 0 1
Temperature and Qualification
Junction
Temperature (T
J
)
T: –40°C to 105°C Yes
S: –40°C to 125°C Yes
Q: –40°C to 150°C
(5)
No Yes No No Yes No
Free-Air
Temperature (T
A
)
Q: –40°C to 125°C
(5)
No Yes No No Yes No
(1) A type change represents a major functional feature difference in a peripheral module. Within a peripheral type, there may be minor
differences between devices that do not affect the basic functionality of the module. For more information, see the C2000 Real-Time
Control Peripherals Reference Guide.
(2) Time between start of sample-and-hold window to start of sample-and-hold window of the next conversion.
(3) For devices that are available in more than one package, the peripheral count listed in the smaller package is reduced because the
smaller package has less device pins available. The number of peripherals internally present on the device is not reduced compared to
the largest package offered within a part number. See Section 4 to identify which peripheral instances are accessible on pins in the
smaller package.
(4) The CAN module uses the IP known as D_CAN. This document uses the names CAN and D_CAN interchangeably to reference this
peripheral.
(5) The letter Q refers to Q100 qualification for automotive applications.