Datasheet

54
TMS320F28379S , TMS320F28377S
TMS320F28376S, TMS320F28375S, TMS320F28374S
SPRS881C –AUGUST 2014–REVISED MAY 2016 www.ti.com
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Specifications Copyright © 2014–2016, Texas Instruments Incorporated
(1) These values are based on a JEDEC-defined 2S2P system (with the exception of the Theta JC [RΘ
JC
] value, which is based on a
JEDEC-defined 1S0P system) and will change based on environment as well as application. For more information, see these
EIA/JEDEC standards:
• JESD51-2, Integrated Circuits Thermal Test Method Environmental Conditions - Natural Convection (Still Air)
• JESD51-3, Low Effective Thermal Conductivity Test Board for Leaded Surface Mount Packages
• JESD51-7, High Effective Thermal Conductivity Test Board for Leaded Surface Mount Packages
• JESD51-9, Test Boards for Area Array Surface Mount Package Thermal Measurements
(2) lfm = linear feet per minute
5.6 Thermal Resistance Characteristics
5.6.1 ZWT Package
°C/W
(1)
AIR FLOW (lfm)
(2)
RΘ
JC
Junction-to-case thermal resistance 8.3 N/A
RΘ
JB
Junction-to-board thermal resistance 11.6 N/A
RΘ
JA
(High k PCB) Junction-to-free air thermal resistance 21.5 0
RΘ
JMA
Junction-to-moving air thermal resistance
19.0 150
17.8 250
16.5 500
Psi
JT
Junction-to-package top
0.2 0
0.3 150
0.4 250
0.5 500
Psi
JB
Junction-to-board
11.4 0
11.3 150
11.2 250
11.0 500
(1) These values are based on a JEDEC-defined 2S2P system (with the exception of the Theta JC [RΘ
JC
] value, which is based on a
JEDEC-defined 1S0P system) and will change based on environment as well as application. For more information, see these
EIA/JEDEC standards:
• JESD51-2, Integrated Circuits Thermal Test Method Environmental Conditions - Natural Convection (Still Air)
• JESD51-3, Low Effective Thermal Conductivity Test Board for Leaded Surface Mount Packages
• JESD51-7, High Effective Thermal Conductivity Test Board for Leaded Surface Mount Packages
• JESD51-9, Test Boards for Area Array Surface Mount Package Thermal Measurements
(2) lfm = linear feet per minute
5.6.2 PTP Package
°C/W
(1)
AIR FLOW (lfm)
(2)
RΘ
JC
Junction-to-case thermal resistance 6.97 N/A
RΘ
JB
Junction-to-board thermal resistance 6.05 N/A
RΘ
JA
(High k PCB) Junction-to-free air thermal resistance 17.8 0
RΘ
JMA
Junction-to-moving air thermal resistance
12.8 150
11.4 250
10.1 500
Psi
JT
Junction-to-package top
0.11 0
0.24 150
0.33 250
0.42 500
Psi
JB
Junction-to-board
6.1 0
5.5 150
5.4 250
5.3 500