Datasheet

37
TMS320F28379S , TMS320F28377S
TMS320F28376S, TMS320F28375S, TMS320F28374S
www.ti.com SPRS881C –AUGUST 2014–REVISED MAY 2016
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Terminal Configuration and FunctionsCopyright © 2014–2016, Texas Instruments Incorporated
Table 4-1. Signal Descriptions (continued)
TERMINAL
I/O/Z
(1)
DESCRIPTION
NAME
MUX
POSITION
ZWT
BALL
NO.
PTP
PIN
NO.
PZP
PIN
NO.
V
SS
L10
PWR
PAD
PWR
PAD
Analog and digital ground. For Quad Flatpacks (QFPs),
the PowerPAD on the bottom of the package must be
soldered to the ground plane of the PCB.
L11
L12
L18
M8
M9
M10
M11
M12
M14
M15
N1
N5
N6
P7
P8
P11
P12
P14
P15
R7
R8
R14
R15
W7
W19
V
SSOSC
H18 122 67 Crystal oscillator (X1 and X2) ground pin. When using an
external crystal, do not connect this pin to the board
ground. Instead, connect it to the ground reference of the
external crystal oscillator circuit.
If an external crystal is not used, this pin may be
connected to the board ground.
H19 – –
V
SSA
P1 34 17
Analog module ground pins.
On the PZP package, pin 17 is double-bonded to V
SSA
and V
REFLOA
. This pin must be connect to V
SSA
.
P5 52 35
R5 – 36
V7 – –
W1 – –