Datasheet

27
CC2650
www.ti.com SWRS158B –FEBRUARY 2015–REVISED JULY 2016
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SpecificationsCopyright © 2015–2016, Texas Instruments Incorporated
DC Characteristics (continued)
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
(1) Each GPIO is referenced to a specific VDDS pin. See the technical reference manual listed in Section 8.3 for more details.
T
A
= 25°C, V
DDS
= 3.0 V
GPIO VOH at 8-mA load IOCURR = 2, high-drive GPIOs only 2.68 V
GPIO VOL at 8-mA load IOCURR = 2, high-drive GPIOs only 0.33 V
GPIO VOH at 4-mA load IOCURR = 1 2.72 V
GPIO VOL at 4-mA load IOCURR = 1 0.28 V
T
A
= 25°C, V
DDS
= 3.8 V
GPIO pullup current Input mode, pullup enabled, Vpad = 0 V 277 µA
GPIO pulldown current Input mode, pulldown enabled, Vpad = VDDS 113 µA
GPIO high/low input transition,
no hysteresis
IH = 0, transition between reading 0 and reading 1 1.67 V
GPIO low-to-high input transition,
with hysteresis
IH = 1, transition voltage for input read as 0 → 1 1.94 V
GPIO high-to-low input transition,
with hysteresis
IH = 1, transition voltage for input read as 1 → 0 1.54 V
GPIO input hysteresis IH = 1, difference between 0 → 1 and 1 → 0 points 0.4 V
T
A
= 25°C
VIH
Lowest GPIO input voltage reliably interpreted as a
«High»
0.8 VDDS
(1)
VIL
Highest GPIO input voltage reliably interpreted as a
«Low»
0.2 VDDS
(1)
(1) °C/W = degrees Celsius per watt.
(2) These values are based on a JEDEC-defined 2S2P system (with the exception of the Theta JC [Rθ
JC
] value, which is based on a
JEDEC-defined 1S0P system) and will change based on environment as well as application. For more information, see these
EIA/JEDEC standards:
• JESD51-2, Integrated Circuits Thermal Test Method Environmental Conditions - Natural Convection (Still Air).
• JESD51-3, Low Effective Thermal Conductivity Test Board for Leaded Surface Mount Packages.
• JESD51-7, High Effective Thermal Conductivity Test Board for Leaded Surface Mount Packages.
• JESD51-9, Test Boards for Area Array Surface Mount Package Thermal Measurements.
Power dissipation of 2 W and an ambient temperature of 70ºC is assumed.
5.26 Thermal Resistance Characteristics
NAME DESCRIPTION RSM (°C/W)
(1) (2)
RHB (°C/W)
(1) (2)
RGZ (°C/W)
(1) (2)
Rθ
JA
Junction-to-ambient thermal resistance 36.9 32.8 29.6
Rθ
JC(top)
Junction-to-case (top) thermal resistance 30.3 24.0 15.7
Rθ
JB
Junction-to-board thermal resistance 7.6 6.8 6.2
Psi
JT
Junction-to-top characterization parameter 0.4 0.3 0.3
Psi
JB
Junction-to-board characterization parameter 7.4 6.8 6.2
Rθ
JC(bot)
Junction-to-case (bottom) thermal resistance 2.1 1.9 1.9