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An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,

intellectual property matters and other important disclaimers. PRODUCTION DATA.

CC2650

SWRS158B –FEBRUARY 2015–REVISED JULY 2016

CC2650 SimpleLink™ Multistandard Wireless MCU

1 Device Overview

1.1 Features

• Microcontroller

– Powerful ARM

Cortex

-M3

– EEMBC CoreMark

Score: 142

– Up to 48-MHz Clock Speed

– 128KB of In-System Programmable Flash

– 8KB of SRAM for Cache

– 20KB of Ultralow-Leakage SRAM

– 2-Pin cJTAG and JTAG Debugging

– Supports Over-The-Air Upgrade (OTA)

• Ultralow-Power Sensor Controller

– Can Run Autonomous From the Rest of the

System

– 16-Bit Architecture

– 2KB of Ultralow-Leakage SRAM for Code and

Data

• Efficient Code Size Architecture, Placing Drivers,

Bluetooth

Low Energy Controller, IEEE 802.15.4

MAC, and Bootloader in ROM

• RoHS-Compliant Packages

– 4-mm × 4-mm RSM VQFN32 (10 GPIOs)

– 5-mm × 5-mm RHB VQFN32 (15 GPIOs)

– 7-mm × 7-mm RGZ VQFN48 (31 GPIOs)

• Peripherals

– All Digital Peripheral Pins Can Be Routed to

Any GPIO

– Four General-Purpose Timer Modules

(Eight 16-Bit or Four 32-Bit Timers, PWM Each)

– 12-Bit ADC, 200-ksamples/s, 8-Channel Analog

MUX

– Continuous Time Comparator

– Ultralow-Power Analog Comparator

– Programmable Current Source

– UART

– 2× SSI (SPI, MICROWIRE, TI)

– I2C

– I2S

– Real-Time Clock (RTC)

– AES-128 Security Module

– True Random Number Generator (TRNG)

– 10, 15, or 31 GPIOs, Depending on Package

Option

– Support for Eight Capacitive-Sensing Buttons

– Integrated Temperature Sensor

• External System

– On-Chip internal DC-DC Converter

– Very Few External Components

– Seamless Integration With the SimpleLink™

CC2590 and CC2592 Range Extenders

– Pin Compatible With the SimpleLink CC13xx in

4-mm × 4-mm and 5-mm × 5-mm VQFN

Packages

• Low Power

– Wide Supply Voltage Range

• Normal Operation: 1.8 to 3.8 V

• External Regulator Mode: 1.7 to 1.95 V

– Active-Mode RX: 5.9 mA

– Active-Mode TX at 0 dBm: 6.1 mA

– Active-Mode TX at +5 dBm: 9.1 mA

– Active-Mode MCU: 61 µA/MHz

– Active-Mode MCU: 48.5 CoreMark/mA

– Active-Mode Sensor Controller: 8.2 µA/MHz

– Standby: 1 µA (RTC Running and RAM/CPU

Retention)

– Shutdown: 100 nA (Wake Up on External

Events)

• RF Section

– 2.4-GHz RF Transceiver Compatible With

Bluetooth Low Energy (BLE) 4.2 Specification

and IEEE 802.15.4 PHY and MAC

– Excellent Receiver Sensitivity (–97 dBm for BLE

and –100 dBm for 802.15.4), Selectivity, and

Blocking Performance

– Link budget of 102 dB/105 dB (BLE/802.15.4)

– Programmable Output Power up to +5 dBm

– Single-Ended or Differential RF Interface

– Suitable for Systems Targeting Compliance With

Worldwide Radio Frequency Regulations

• ETSI EN 300 328 (Europe)

• EN 300 440 Class 2 (Europe)

• FCC CFR47 Part 15 (US)

• ARIB STD-T66 (Japan)

• Tools and Development Environment

– Full-Feature and Low-Cost Development Kits

– Multiple Reference Designs for Different RF

Configurations

– Packet Sniffer PC Software

– Sensor Controller Studio

– SmartRF™ Studio

– SmartRF Flash Programmer 2

– IAR Embedded Workbench

for ARM

– Code Composer Studio™

Summary of content (71 pages)

PAGE 1
Product Folder Sample & Buy Technical Documents Tools & Software Support & Community Reference Design CC2650 SWRS158B – FEBRUARY 2015 – REVISED JULY 2016 CC2650 SimpleLink™ Multistandard Wireless MCU 1 Device Overview 1.
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CC2650 SWRS158B – FEBRUARY 2015 – REVISED JULY 2016 1.2 • • • • • • Applications Consumer Electronics Mobile Phone Accessories Sports and Fitness Equipment HID Applications Home and Building Automation Lighting Control 1.3 www.ti.com • • • • • • Alarm and Security Electronic Shelf Labeling Proximity Tags Medical Remote Controls Wireless Sensor Networks Description The CC2650 device is a wireless MCU targeting Bluetooth, ZigBee® and 6LoWPAN, and ZigBee RF4CE remote control applications.
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CC2650 www.ti.com 1.4 SWRS158B – FEBRUARY 2015 – REVISED JULY 2016 Functional Block Diagram Figure 1-1 shows a block diagram for the CC2650.
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CC2650 SWRS158B – FEBRUARY 2015 – REVISED JULY 2016 www.ti.com Table of Contents 1 Device Overview ......................................... 1 1.1 Features .............................................. 1 1.2 Applications ........................................... 2 1.3 Description ............................................ 2 1.4 Functional Block Diagram ............................ 3 2 3 Revision History ......................................... 5 Device Comparison ..........................
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CC2650 www.ti.com SWRS158B – FEBRUARY 2015 – REVISED JULY 2016 2 Revision History NOTE: Page numbers for previous revisions may differ from page numbers in the current version. Changes from October 16, 2015 to July 5, 2016 • • • • • • • • • • Page Added split VDDS supply rail feature .............................................................................................. 1 Added 2-Mbps Bluetooth low energy.............................................................................................
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CC2650 SWRS158B – FEBRUARY 2015 – REVISED JULY 2016 www.ti.com 3 Device Comparison Table 3-1. Device Family Overview DEVICE PHY SUPPORT FLASH (KB) RAM (KB) GPIO PACKAGE (1) CC2650F128xxx Multi-Protocol (2) 128 20 31, 15, 10 RGZ, RHB, RSM CC2640F128xxx Bluetooth low energy (Normal) 128 20 31, 15, 10 RGZ, RHB, RSM CC2630F128xxx IEEE 802.15.4 Zigbee(/6LoWPAN) 128 20 31, 15, 10 RGZ, RHB, RSM CC2620F128xxx IEEE 802.15.4 (RF4CE) 128 20 31, 10 RGZ, RSM (1) (2) 3.
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CC2650 www.ti.com SWRS158B – FEBRUARY 2015 – REVISED JULY 2016 4 Terminal Configuration and Functions 25 JTAG_TCKC 26 DIO_16 27 DIO_17 28 DIO_18 29 DIO_19 30 DIO_20 31 DIO_21 32 DIO_22 33 DCDC_SW 34 VDDS_DCDC 35 RESET_N Pin Diagram – RGZ Package 36 DIO_23 4.
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CC2650 SWRS158B – FEBRUARY 2015 – REVISED JULY 2016 www.ti.com Table 4-1. Signal Descriptions – RGZ Package (continued) NAME NO.
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CC2650 www.ti.com 17 DCDC_SW 18 VDDS_DCDC 19 RESET_N 20 DIO_7 21 DIO_8 22 DIO_9 23 DIO_10 Pin Diagram – RHB Package 24 DIO_11 4.3 SWRS158B – FEBRUARY 2015 – REVISED JULY 2016 DIO_12 25 16 DIO_6 DIO_13 26 15 DIO_5 DIO_14 27 14 JTAG_TCKC VDDS 28 13 JTAG_TMSC VDDR 29 12 DCOUPL X24M_N 30 11 VDDS2 X24M_P 31 10 DIO_4 Note: 1 2 3 4 5 6 7 8 RF_N RX_TX X32K_Q1 X32K_Q2 DIO_0 DIO_1 DIO_2 9 RF_P VDDR_RF 32 DIO_3 I/O pins marked in bold have high drive capabilities.
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CC2650 SWRS158B – FEBRUARY 2015 – REVISED JULY 2016 www.ti.com Table 4-2. Signal Descriptions – RHB Package (continued) NAME NO. TYPE RESET_N 19 Digital input RF_N 2 RF I/O Negative RF input signal to LNA during RX Negative RF output signal to PA during TX RF_P 1 RF I/O Positive RF input signal to LNA during RX Positive RF output signal to PA during TX RX_TX 3 RF I/O Optional bias pin for the RF LNA VDDR 29 Power 1.7-V to 1.
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CC2650 www.ti.com 17 VSS 18 DCDC_SW 19 VDDS_DCDC 20 VSS 21 RESET_N 22 DIO_5 23 DIO_6 Pin Diagram – RSM Package 24 DIO_7 4.5 SWRS158B – FEBRUARY 2015 – REVISED JULY 2016 DIO_8 25 16 DIO_4 DIO_9 26 15 DIO_3 VDDS 27 14 JTAG_TCKC VDDR 28 13 JTAG_TMSC VSS 29 12 DCOUPL X24M_N 30 11 VDDS2 X24M_P 31 10 DIO_2 Note: 5 6 7 8 X32K_Q1 X32K_Q2 VSS DIO_0 3 VSS 4 2 RF_N RX_TX 1 9 RF_P VDDR_RF 32 DIO_1 I/O pins marked in bold have high drive capabilities.
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CC2650 SWRS158B – FEBRUARY 2015 – REVISED JULY 2016 www.ti.com Table 4-3. Signal Descriptions – RSM Package (continued) NAME NO. TYPE DESCRIPTION RX_TX 4 RF I/O Optional bias pin for the RF LNA VDDR 28 Power 1.7-V to 1.95-V supply, typically connect to output of internal DC-DC. (2) (3) (2) (4) VDDR_RF 32 Power 1.7-V to 1.95-V supply, typically connect to output of internal DC-DC VDDS 27 Power 1.8-V to 3.8-V main chip supply (1) VDDS2 11 Power 1.8-V to 3.
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CC2650 www.ti.com SWRS158B – FEBRUARY 2015 – REVISED JULY 2016 5 Specifications 5.1 Absolute Maximum Ratings over operating free-air temperature range (unless otherwise noted) (1) (2) MIN MAX Supply voltage (VDDS, VDDS2, and VDDS3) VDDR supplied by internal DC-DC regulator or internal GLDO. VDDS_DCDC connected to VDDS on PCB. UNIT –0.3 4.1 V Supply voltage (VDDS (3) and VDDR) External regulator mode (VDDS and VDDR pins connected on PCB) –0.3 2.25 V Voltage on any digital pin (4) (5) –0.
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CC2650 SWRS158B – FEBRUARY 2015 – REVISED JULY 2016 5.4 www.ti.com Power Consumption Summary Measured on the TI CC2650EM-5XD reference design with Tc = 25°C, VDDS = 3.0 V with internal DC-DC converter, unless otherwise noted. PARAMETER Icore Core current consumption TEST CONDITIONS MIN TYP Reset. RESET_N pin asserted or VDDS below Power-on-Reset threshold 100 Shutdown. No clocks running, no retention 150 Standby. With RTC, CPU, RAM and (partial) register retention. RCOSC_LF 1 Standby.
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CC2650 www.ti.com 5.6 SWRS158B – FEBRUARY 2015 – REVISED JULY 2016 1-Mbps GFSK (Bluetooth low energy Technology) – RX Measured on the TI CC2650EM-5XD reference design with Tc = 25°C, VDDS = 3.0 V, fRF = 2440 MHz, unless otherwise noted. PARAMETER TEST CONDITIONS MIN TYP MAX UNIT Receiver sensitivity Differential mode. Measured at the CC2650EM-5XD SMA connector, BER = 10–3 –97 dBm Receiver sensitivity Single-ended mode.
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CC2650 SWRS158B – FEBRUARY 2015 – REVISED JULY 2016 5.7 www.ti.com 1-Mbps GFSK (Bluetooth low energy Technology) – TX Measured on the TI CC2650EM-5XD reference design with Tc = 25°C, VDDS = 3.0 V, fRF = 2440 MHz, unless otherwise noted.
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CC2650 www.ti.com 5.9 SWRS158B – FEBRUARY 2015 – REVISED JULY 2016 2-Mbps GFSK (Bluetooth 5) – TX Measured on the TI CC2650EM-5XD reference design with Tc = 25°C, VDDS = 3.0 V, fRF = 2440 MHz, unless otherwise noted.
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CC2650 SWRS158B – FEBRUARY 2015 – REVISED JULY 2016 www.ti.com 5.11 5-Mbps (Proprietary) – TX Measured on the TI CC2650EM-5XD reference design with Tc = 25°C, VDDS = 3.0 V, fRF = 2440 MHz, unless otherwise noted.
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CC2650 www.ti.com SWRS158B – FEBRUARY 2015 – REVISED JULY 2016 5.12 IEEE 802.15.4 (Offset Q-PSK DSSS, 250 kbps) – RX Measured on the TI CC2650EM-5XD reference design with Tc = 25°C, VDDS = 3.0 V, unless otherwise noted. PARAMETER TEST CONDITIONS MIN TYP MAX UNIT Receiver sensitivity Differential mode. Measured at the CC2650EM-5XD SMA connector, PER = 1% –100 dBm Receiver sensitivity Single-ended mode.
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CC2650 SWRS158B – FEBRUARY 2015 – REVISED JULY 2016 www.ti.com IEEE 802.15.4 (Offset Q-PSK DSSS, 250 kbps) – TX (continued) Measured on the TI CC2650EM-5XD reference design with Tc = 25°C, VDDS = 3.0 V, unless otherwise noted.
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CC2650 www.ti.com SWRS158B – FEBRUARY 2015 – REVISED JULY 2016 5.16 48-MHz RC Oscillator (RCOSC_HF) Measured on the TI CC2650EM-5XD reference design with Tc = 25°C, VDDS = 3.0 V, unless otherwise noted. PARAMETER TEST CONDITIONS MIN TYP Frequency UNIT 48 Uncalibrated frequency accuracy ±1% Calibrated frequency accuracy (1) ±0.25% Start-up time (1) MAX MHz 5 µs Accuracy relative to the calibration source (XOSC_HF). 5.
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CC2650 SWRS158B – FEBRUARY 2015 – REVISED JULY 2016 www.ti.com ADC Characteristics (continued) Tc = 25°C, VDDS = 3.0 V and voltage scaling enabled, unless otherwise noted.(1) PARAMETER (5) 22 TEST CONDITIONS MIN TYP 50 MAX UNIT clockcycles Conversion time Serial conversion, time-to-output, 24-MHz clock Current consumption Internal 4.3-V equivalent reference (2) 0.66 mA Current consumption VDDS as reference 0.
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CC2650 www.ti.com SWRS158B – FEBRUARY 2015 – REVISED JULY 2016 5.19 Temperature Sensor Measured on the TI CC2650EM-5XD reference design with Tc = 25°C, VDDS = 3.0 V, unless otherwise noted. PARAMETER TEST CONDITIONS MIN Resolution TYP MAX 4 Range UNIT °C –40 85 °C Accuracy ±5 °C Supply voltage coefficient (1) 3.2 °C/V (1) Automatically compensated when using supplied driver libraries. 5.20 Battery Monitor Measured on the TI CC2650EM-5XD reference design with Tc = 25°C, VDDS = 3.
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CC2650 SWRS158B – FEBRUARY 2015 – REVISED JULY 2016 5.22 www.ti.com Low-Power Clocked Comparator Tc = 25°C, VDDS = 3.0 V, unless otherwise noted. PARAMETER TEST CONDITIONS Input voltage range MIN TYP MAX 0 VDDS Clock frequency 32 UNIT V kHz Internal reference voltage, VDDS / 2 1.49 – 1.51 V Internal reference voltage, VDDS / 3 1.01 – 1.03 V Internal reference voltage, VDDS / 4 0.78 – 0.79 V Internal reference voltage, DCOUPL / 1 1.25 – 1.
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CC2650 www.ti.com SWRS158B – FEBRUARY 2015 – REVISED JULY 2016 S1 S2 SSIClk S3 SSIFss SSITx SSIRx MSB LSB 4 to 16 bits Figure 5-1. SSI Timing for TI Frame Format (FRF = 01), Single Transfer Timing Measurement S2 S1 SSIClk S3 SSIFss SSITx MSB LSB 8-bit control SSIRx 0 MSB LSB 4 to 16 bits output data Figure 5-2.
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CC2650 SWRS158B – FEBRUARY 2015 – REVISED JULY 2016 www.ti.com S1 S2 SSIClk (SPO = 0) S3 SSIClk (SPO = 1) SSITx (Master) MSB SSIRx (Slave) MSB LSB LSB SSIFss Figure 5-3. SSI Timing for SPI Frame Format (FRF = 00), With SPH = 1 5.25 DC Characteristics PARAMETER TEST CONDITIONS MIN TYP 1.32 1.54 MAX UNIT TA = 25°C, VDDS = 1.
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CC2650 www.ti.com SWRS158B – FEBRUARY 2015 – REVISED JULY 2016 DC Characteristics (continued) PARAMETER TEST CONDITIONS MIN TYP MAX UNIT TA = 25°C, VDDS = 3.0 V GPIO VOH at 8-mA load IOCURR = 2, high-drive GPIOs only 2.68 V GPIO VOL at 8-mA load IOCURR = 2, high-drive GPIOs only 0.33 V GPIO VOH at 4-mA load IOCURR = 1 2.72 V GPIO VOL at 4-mA load IOCURR = 1 0.28 V TA = 25°C, VDDS = 3.
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CC2650 SWRS158B – FEBRUARY 2015 – REVISED JULY 2016 www.ti.com 5.
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CC2650 www.ti.com SWRS158B – FEBRUARY 2015 – REVISED JULY 2016 5.29 Typical Characteristics -95 -94 -96 -97 Sensitivity (dBm) Sensitivity (dBm) -95 -96 -97 -98 -99 -100 -101 -98 -102 Sensitivity 4XS Sensitivity 5XD -99 -40 -30 -20 -10 0 10 20 30 40 Temperature (qC) 50 60 70 -103 -40 -30 -20 -10 80 Figure 5-4. BLE Sensitivity vs Temperature 0 10 20 30 40 Temperature (qC) 50 60 70 80 Figure 5-5. IEEE 802.15.4 Sensitivity vs Temperature -95 -95 IEEE 802.15.
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CC2650 SWRS158B – FEBRUARY 2015 – REVISED JULY 2016 www.ti.com 6 6 5 5 4 4XS 2-dBm Setting 5XD 5-dBm Setting 3 2 Output power (dBm) Output Power (dBm) Typical Characteristics (continued) 4 3 2 1 1 0 -40 -30 -20 -10 0 10 20 30 40 Temperature (qC) 50 60 70 5XD 5 dBm Setting 4XS 2 dBm Setting 80 Figure 5-10. TX Output Power vs Temperature 0 1.8 2.3 2.8 VDDS (V) 3.8 D003 Figure 5-11.
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CC2650 www.ti.com SWRS158B – FEBRUARY 2015 – REVISED JULY 2016 Typical Characteristics (continued) 3.1 Active Mode Current Consumpstion (mA) 12 TX Current (mA) 10 8 6 4 2 5XD 5 dBm Setting 4XS 2 dBm Setting 0 -40 -30 -20 -10 0 10 20 30 40 Temperature (qC) 50 60 70 Active Mode Current 3.05 3 2.95 2.9 2.85 -40 -30 -20 -10 80 50 60 70 80 D006 4 5 Standby Mode Current Active Mode Current 3.5 4.5 3 4 Current (uA) Current Consumption (mA) 10 20 30 40 Temperature (qC) Figure 5-17.
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CC2650 SWRS158B – FEBRUARY 2015 – REVISED JULY 2016 www.ti.com Typical Characteristics (continued) 10.5 1007.5 ENOB Internal Reference (No Averaging) ENOB Internal Reference (32 Samples Averaging) 10.4 1007 10.3 10.2 ENOB ADC Code 1006.5 1006 10.1 10 9.9 1005.5 9.8 1005 9.7 1004.5 -40 -30 -20 -10 0 10 20 30 40 Temperature (qC) 50 60 70 9.6 1k 80 10k Sampling Frequency (Hz) D013 Figure 5-22.
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CC2650 www.ti.com SWRS158B – FEBRUARY 2015 – REVISED JULY 2016 Typical Characteristics (continued) 3.5 3 2.5 2 DNL 1.5 1 0.5 0 -0.5 -1 ADC Code 4200 4000 3800 3600 3400 3200 3000 2800 2600 2400 2200 2000 1800 1600 1400 1200 1000 800 600 400 200 0 -1.5 D010 Figure 5-25.
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CC2650 SWRS158B – FEBRUARY 2015 – REVISED JULY 2016 www.ti.com 6 Detailed Description 6.1 Overview The core modules of the CC26xx product family are shown in the Section 6.2. 6.
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CC2650 www.ti.com 6.3 SWRS158B – FEBRUARY 2015 – REVISED JULY 2016 Main CPU The SimpleLink CC2650 Wireless MCU contains an ARM Cortex-M3 (CM3) 32-bit CPU, which runs the application and the higher layers of the protocol stack. The CM3 processor provides a high-performance, low-cost platform that meets the system requirements of minimal memory implementation, and low-power consumption, while delivering outstanding computational performance and exceptional system response to interrupts.
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CC2650 SWRS158B – FEBRUARY 2015 – REVISED JULY 2016 6.5 www.ti.com Sensor Controller The Sensor Controller contains circuitry that can be selectively enabled in standby mode. The peripherals in this domain may be controlled by the Sensor Controller Engine which is a proprietary power-optimized CPU. This CPU can read and monitor sensors or perform other tasks autonomously, thereby significantly reducing power consumption and offloading the main CM3 CPU.
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CC2650 www.ti.com SWRS158B – FEBRUARY 2015 – REVISED JULY 2016 Table 6-1. GPIOs Connected to the Sensor Controller (1) ANALOG CAPABLE 7 × 7 RGZ DIO NUMBER 5 × 5 RHB DIO NUMBER Y 30 14 Y 29 13 Y 28 12 Y 27 11 9 Y 26 9 8 Y 25 10 7 Y 24 8 6 Y 23 7 5 N 7 4 2 N 6 3 1 N 5 2 0 N 4 1 N 3 0 N 2 N 1 N 0 (1) 6.6 4 × 4 RSM DIO NUMBER Depending on the package size, up to 16 pins can be connected to the Sensor Controller.
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CC2650 SWRS158B – FEBRUARY 2015 – REVISED JULY 2016 6.8 www.ti.com Power Management To minimize power consumption, the CC2650 device supports a number of power modes and power management features (see Table 6-2). Table 6-2.
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CC2650 www.ti.com SWRS158B – FEBRUARY 2015 – REVISED JULY 2016 The Sensor Controller is an autonomous processor that can control the peripherals in the Sensor Controller independently of the main CPU, which means that the main CPU does not have to wake up, for example, to execute an ADC sample or poll a digital sensor over SPI. The main CPU saves both current and wake-up time that would otherwise be wasted.
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CC2650 SWRS158B – FEBRUARY 2015 – REVISED JULY 2016 www.ti.com The device includes a direct memory access (µDMA) controller. The µDMA controller provides a way to offload data transfer tasks from the CM3 CPU, allowing for more efficient use of the processor and the available bus bandwidth. The µDMA controller can perform transfer between memory and peripherals.
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CC2650 www.ti.com SWRS158B – FEBRUARY 2015 – REVISED JULY 2016 7 Application, Implementation, and Layout NOTE Information in the following applications sections is not part of the TI component specification, and TI does not warrant its accuracy or completeness. TI's customers are responsible for determining suitability of components for their purposes. Customers should validate and test their design implementation to confirm system functionality. 7.
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CC2650 SWRS158B – FEBRUARY 2015 – REVISED JULY 2016 www.ti.com Figure 7-2 shows the various supply voltage configuration options. Not all power supply decoupling capacitors or digital I/Os are shown. Exact pin positions will vary between the different package options. For a detailed overview of power supply decoupling and wiring, see the TI reference designs and the CC26xx technical reference manual (Section 8.3).
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CC2650 www.ti.com 7.
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CC2650 SWRS158B – FEBRUARY 2015 – REVISED JULY 2016 7.2.1 www.ti.com Layout Figure 7-4.
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CC2650 www.ti.com 7.
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CC2650 SWRS158B – FEBRUARY 2015 – REVISED JULY 2016 7.3.1 www.ti.com Layout Figure 7-6.
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CC2650 www.ti.com SWRS158B – FEBRUARY 2015 – REVISED JULY 2016 8 Device and Documentation Support 8.1 Device Nomenclature To designate the stages in the product development cycle, TI assigns prefixes to all part numbers and date-code. Each device has one of three prefixes/identifications: X, P, or null (no prefix) (for example, CC2650 is in production; therefore, no prefix/identification is assigned).
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CC2650 SWRS158B – FEBRUARY 2015 – REVISED JULY 2016 8.2 www.ti.com Tools and Software TI offers an extensive line of development tools, including tools to evaluate the performance of the processors, generate code, develop algorithm implementations, and fully integrate and debug software and hardware modules.
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CC2650 www.ti.com 8.3 SWRS158B – FEBRUARY 2015 – REVISED JULY 2016 Documentation Support To receive notification of documentation updates, navigate to the device product folder on ti.com (CC2650). In the upper right corner, click on Alert me to register and receive a weekly digest of any product information that has changed. For change details, review the revision history included in any revised document.
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CC2650 SWRS158B – FEBRUARY 2015 – REVISED JULY 2016 8.7 www.ti.com Additional Information Texas Instruments offers a wide selection of cost-effective, low-power RF solutions for proprietary and standard-based wireless applications for use in industrial and consumer applications. The selection includes RF transceivers, RF transmitters, RF front ends, and Systems-on-Chips as well as various software solutions for the sub-1-GHz and 2.4-GHz frequency bands.
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PACKAGE OPTION ADDENDUM www.ti.
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PACKAGE OPTION ADDENDUM www.ti.com 30-Nov-2015 (6) Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish value exceeds the maximum column width. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided.
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PACKAGE MATERIALS INFORMATION www.ti.com 30-Nov-2015 TAPE AND REEL INFORMATION *All dimensions are nominal Device Package Package Pins Type Drawing CC2650F128RGZR VQFN RGZ 48 SPQ Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) B0 (mm) K0 (mm) P1 (mm) W Pin1 (mm) Quadrant 2500 330.0 16.4 7.3 7.3 1.1 12.0 16.0 Q2 CC2650F128RGZT VQFN RGZ 48 250 180.0 16.4 7.3 7.3 1.1 12.0 16.0 Q2 CC2650F128RHBR VQFN RHB 32 3000 330.0 12.4 5.3 5.3 1.1 8.0 12.
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PACKAGE MATERIALS INFORMATION www.ti.com 30-Nov-2015 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) CC2650F128RGZR VQFN RGZ 48 2500 367.0 367.0 38.0 CC2650F128RGZT VQFN RGZ 48 250 210.0 185.0 35.0 CC2650F128RHBR VQFN RHB 32 3000 367.0 367.0 35.0 CC2650F128RHBT VQFN RHB 32 250 210.0 185.0 35.0 CC2650F128RSMR VQFN RSM 32 3000 367.0 367.0 35.0 CC2650F128RSMT VQFN RSM 32 250 210.0 185.0 35.
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IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest issue. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and complete.
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BoosterPack Ecosystem Meet the CC2650 BoosterPack plug-in modules plug into the header pins on the LaunchPad to allow you to explore different applications that your favorite TI MCU can enable. There is a broad range of application-specific and general purpose BoosterPacks available from both Texas Instruments and third parties. Stack multiple BoosterPacks on a single LaunchPad to greatly enhance the functionality of your design.
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A closer look at your new LaunchPad Development Kit Featured wireless MCU: CC2650: Low-power, multi-protocol, 2.4GHz wireless MCU What's in the box? QSG CC2650 LaunchPad This Quick Start Guide Micro-USB Cable Software available @ dev.ti.
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STANDARD TERMS AND CONDITIONS FOR EVALUATION MODULES 1. Delivery: TI delivers TI evaluation boards, kits, or modules, including any accompanying demonstration software, components, or documentation (collectively, an “EVM” or “EVMs”) to the User (“User”) in accordance with the terms and conditions set forth herein. Acceptance of the EVM is expressly subject to the following terms and conditions. 1.
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FCC Interference Statement for Class B EVM devices NOTE: This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential installation. This equipment generates, uses and can radiate radio frequency energy and, if not installed and used in accordance with the instructions, may cause harmful interference to radio communications.
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【無線電波を送信する製品の開発キットをお使いになる際の注意事項】開発キットの中には技術基準適合証明を受けていないものがあります。技術適合証明を受けていないもののご使用に際しては、電波法遵守のため、以下のいずれかの措置を取っていただく必要がありますのでご注意ください。 1. 2. 3. 電波法施行規則第6条第1項第1号に基づく平成18年3月28日総務省告示第173号で定められた電波暗室等の試験設備でご使用いただく。実験局の免許を取得後ご使用いただく。技術基準適合証明を取得後ご使用いただく。なお、本製品は、上記の「ご使用にあたっての注意」を譲渡先、移転先に通知しない限り、譲渡、移転できないものとします。上記を遵守頂けない場合は、電波法の罰則が適用される可能性があることをご留意ください。日本テキサス・インスツルメンツ株式会社東京都新宿区西新宿６丁目２４番１号西新宿三井ビル 3.3.3 Notice for EVMs for Power Line Communication: Please see http://www.tij.co.
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SPACER 6. Disclaimers: 6.1 EXCEPT AS SET FORTH ABOVE, EVMS AND ANY WRITTEN DESIGN MATERIALS PROVIDED WITH THE EVM (AND THE DESIGN OF THE EVM ITSELF) ARE PROVIDED "AS IS" AND "WITH ALL FAULTS." TI DISCLAIMS ALL OTHER WARRANTIES, EXPRESS OR IMPLIED, REGARDING SUCH ITEMS, INCLUDING BUT NOT LIMITED TO ANY IMPLIED WARRANTIES OF MERCHANTABILITY OR FITNESS FOR A PARTICULAR PURPOSE OR NON-INFRINGEMENT OF ANY THIRD PARTY PATENTS, COPYRIGHTS, TRADE SECRETS OR OTHER INTELLECTUAL PROPERTY RIGHTS. 6.
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IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest issue. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and complete.