Datasheet

16
CC1350
SWRS183 –JUNE 2016 www.ti.com
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Specifications Copyright © 2016, Texas Instruments Incorporated
(1) For more information about traditional and new thermal metrics, see Semiconductor and IC Package Thermal Metrics.
(2) °C/W = degrees Celsius per watt.
5.11 Thermal Characteristics
THERMAL METRIC
(1)
CC1350
UNIT
(2)
RGZ
(VQFN)
48 PINS
R
θJA
Junction-to-ambient thermal resistance 29.6 °C/W
R
θJC(top)
Junction-to-case (top) thermal resistance 15.7 °C/W
R
θJB
Junction-to-board thermal resistance 6.2 °C/W
ψ
JT
Junction-to-top characterization parameter 0.3 °C/W
ψ
JB
Junction-to-board characterization parameter 6.2 °C/W
R
θJC(bot)
Junction-to-case (bottom) thermal resistance 1.9 °C/W
5.12 Timing and Switching Characteristics
5.12.1 Reset Timing
MIN TYP MAX UNIT
RESET_N low duration 1 µs
5.12.2 Switching Characteristics: Wakeup and Timing
Measured on the Texas Instruments CC1310EM-7XD-7793 reference design with T
c
= 25°C, V
DDS
= 3.0 V, unless otherwise
noted. The times listed here do not include RTOS overhead.
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
MCU, Idle → Active 14 µs
MCU, Standby → Active 174 µs
MCU, Shutdown → Active 1097 µs