Product Folder Sample & Buy Technical Documents Tools & Software Support & Community CC1350 SWRS183 – JUNE 2016 CC1350 SimpleLink™ Ultra-Low-Power Dual-Band Wireless MCU 1 Device Overview 1.1 Features 1 • World's First Dual-Band (Sub-1 GHz and 2.
CC1350 SWRS183 – JUNE 2016 www.ti.com • Tools and Development Environment – Full-Feature and Low-Cost Development Kits – Multiple Reference Designs for Different RF Configurations – Packet Sniffer PC Software 1.2 • • • • • • • • Sensor Controller Studio SmartRF™ Studio SmartRF Flash Programmer 2 IAR Embedded Workbench® for ARM Code Composer Studio™ Applications 315-, 433-, 470-, 500-, 779-, 868-, 915-, 920-MHz and 2.
CC1350 www.ti.com 1.4 SWRS183 – JUNE 2016 Functional Block Diagram Figure 1-1 shows a block diagram for the CC1350 device.
CC1350 SWRS183 – JUNE 2016 www.ti.com Table of Contents 1 2 3 Device Overview ......................................... 1 6.2 Main CPU ........................................... 31 1.1 Features .............................................. 1 6.3 RF Core ............................................. 32 1.2 Applications ........................................... 2 6.4 Sensor Controller 1.3 Description ............................................ 2 6.5 Memory ..............................
CC1350 www.ti.com SWRS183 – JUNE 2016 3 Device Comparison Table 3-1. Device Family Overview DEVICE PHY SUPPORT FLASH (KB) RAM (KB) GPIOs PACKAGE SIZE CC1350F128RGZ Proprietary, Wireless M-Bus, IEEE 802.15.4g, Bluetooth low energy 128 20 30 7 mm × 7 mm 3.1 Related Products Wireless Connectivity The wireless connectivity portfolio offers a wide selection of low power RF solutions suitable for a broad range of application.
CC1350 SWRS183 – JUNE 2016 www.ti.com 4 Terminal Configuration and Functions 25 JTAG_TCKC 26 DIO_16 27 DIO_17 29 DIO_19 28 DIO_18 31 DIO_21 30 DIO_20 34 VDDS_DCDC 33 DCDC_SW 32 DIO_22 35 RESET_N Pin Diagram – RGZ Package 36 DIO_23 4.
CC1350 www.ti.com 4.2 SWRS183 – JUNE 2016 Signal Descriptions – RGZ Package Table 4-1. Signal Descriptions – RGZ Package PIN NAME TYPE NO. DESCRIPTION DCDC_SW 33 Power Output from internal DC-DC (1) (2) DCOUPL 23 Power 1.
CC1350 SWRS183 – JUNE 2016 www.ti.com Table 4-1. Signal Descriptions – RGZ Package (continued) PIN NAME TYPE NO. DESCRIPTION VDDR_RF 48 Power 1.7-V to 1.95-V supply, connect to output of internal DC-DC (5) (2) VDDS 44 Power 1.8-V to 3.8-V main chip supply (1) VDDS2 13 Power 1.8-V to 3.8-V DIO supply (1) VDDS3 22 Power 1.8-V to 3.8-V DIO supply (1) VDDS_DCDC 34 Power 1.8-V to 3.
CC1350 www.ti.com SWRS183 – JUNE 2016 5 Specifications 5.1 Absolute Maximum Ratings over operating free-air temperature range (unless otherwise noted) (1) (2) VDDS (3) MIN MAX UNIT –0.3 4.1 V –0.3 VDDS + 0.3, max 4.1 V –0.3 VDDR + 0.3, max 2.25 V Voltage scaling enabled –0.3 VDDS Voltage scaling disabled, internal reference –0.3 1.49 Voltage scaling disabled, VDDS as reference –0.3 VDDS / 2.
CC1350 SWRS183 – JUNE 2016 5.4 www.ti.com Power Consumption Summary Measured on the Texas Instruments CC1310EM-7XD-7793 reference design unless otherwise noted. Tc = 25°C, VDDS = 3.6 V with DC-DC enabled, unless otherwise noted. Using boost mode (increasing VDDR to 1.95 V), will increase currents in this table by 15% (does not apply to TX 14-dBm setting where this current is already included). PARAMETER Icore Core current consumption TEST CONDITIONS TYP Reset.
CC1350 www.ti.com 5.5 SWRS183 – JUNE 2016 RF Characteristics over operating free-air temperature range (unless otherwise noted) PARAMETER MIN Frequency bands (1) (1) 5.6 TYP MAX (287) (351) (359) (439) (431) (527) (718) (878) 861 1054 2152 2635 UNIT MHz For more information, refer to CC1350 SimpleLink Wireless MCU Silicon Errata. Receive (RX) Parameters, Sub-1 GHz Measured on the Texas Instruments CC1350_7XD-Dual Band reference design with Tc = 25°C, VDDS = 3.
CC1350 SWRS183 – JUNE 2016 www.ti.com Receive (RX) Parameters, Sub-1 GHz (continued) Measured on the Texas Instruments CC1350_7XD-Dual Band reference design with Tc = 25°C, VDDS = 3.0 V, DC-DC enabled, fRF = 868 MHz, unless otherwise noted. All measurements are performed at the antenna input with a combined RX and TX path. PARAMETER TEST CONDITIONS MIN Spurious emissions 1 GHz to 13 GHz Radiated emissions measured according to ETSI EN (VCO leakage at 3.
CC1350 www.ti.com 5.7 SWRS183 – JUNE 2016 Transmit (TX) Parameters Sub-1 GHz Measured on the Texas Instruments CC1310EM-7XD-7793 reference design with Tc = 25°C, VDDS = 3.0 V, DC-DC enabled, fRF = 868 MHz, unless otherwise noted. All measurements are performed at the antenna input with a combined RX and TX path. PARAMETER TEST CONDITIONS MIN TYP MAX UNIT Maximum output power, boost mode VDDR = 1.95 V Minimum VDDS for boost mode is 2.
CC1350 SWRS183 – JUNE 2016 5.8 www.ti.com 1-Mbps GFSK (Bluetooth low energy) – RX Measured on the TI CC1350_7XD-Dual Band reference design with Tc = 25°C, VDDS = 3.0 V, fRF = 2440 MHz, unless otherwise noted. All tests with Bluetooth low energy PHY (1 Mbps), 37 byte payload unless otherwise noted. PARAMETER TEST CONDITIONS MIN TYP MAX UNIT Receiver sensitivity Differential mode.
CC1350 www.ti.com SWRS183 – JUNE 2016 1-Mbps GFSK (Bluetooth low energy) – RX (continued) Measured on the TI CC1350_7XD-Dual Band reference design with Tc = 25°C, VDDS = 3.0 V, fRF = 2440 MHz, unless otherwise noted. All tests with Bluetooth low energy PHY (1 Mbps), 37 byte payload unless otherwise noted. PARAMETER Spurious emissions, 1 to 12.75 GHz TEST CONDITIONS MIN TYP Conducted measurement in a 50-Ω single-ended load.
CC1350 SWRS183 – JUNE 2016 www.ti.com 5.11 Thermal Characteristics CC1350 RGZ (VQFN) THERMAL METRIC (1) UNIT (2) 48 PINS RθJA Junction-to-ambient thermal resistance 29.6 °C/W RθJC(top) Junction-to-case (top) thermal resistance 15.7 °C/W RθJB Junction-to-board thermal resistance 6.2 °C/W ψJT Junction-to-top characterization parameter 0.3 °C/W ψJB Junction-to-board characterization parameter 6.2 °C/W RθJC(bot) Junction-to-case (bottom) thermal resistance 1.
CC1350 www.ti.com SWRS183 – JUNE 2016 5.12.3 Clock Specifications 5.12.3.1 24-MHz Crystal Oscillator (XOSC_HF) Measured on the Texas Instruments CC1310EM-7XD-7793 reference design with Tc = 25°C, VDDS = 3.0 V, unless otherwise noted. (1) MIN TYP Crystal frequency 24 ESR equivalent series resistance 20 LM Motional inductance, relates to the load capacitance that is used for the crystal (CL in Farads) CL Crystal load capacitance UNIT MHz Ω 60 < 1.
CC1350 SWRS183 – JUNE 2016 www.ti.com 5.12.4 Flash Memory Characteristics Tc = 25°C, VDDS = 3.0 V, unless otherwise noted. PARAMETER TEST CONDITIONS MIN Supported flash erase cycles before failure TYP MAX 100 Flash page or sector erase current UNIT k Cycles Average delta current 12.6 mA Flash page or sector erase time (1) 8 ms Flash page or sector size 4 KB 8.
CC1350 www.ti.com SWRS183 – JUNE 2016 5.12.6 Temperature Sensor Measured on the Texas Instruments CC1310EM-7XD-7793 reference design with Tc = 25°C, VDDS = 3.0 V, unless otherwise noted. PARAMETER TEST CONDITIONS MIN TYP Resolution Range –40 Supply voltage coefficient (1) UNIT °C 85 Accuracy (1) MAX 4 °C ±5 °C 3.2 °C/V Automatically compensated when using supplied driver libraries. 5.12.
CC1350 SWRS183 – JUNE 2016 www.ti.com 5.12.10 Programmable Current Source Tc = 25°C, VDDS = 3.0 V, unless otherwise noted. PARAMETER TEST CONDITIONS MIN Current source programmable output range Resolution Current consumption (1) (1) TYP MAX UNIT 0.25 to 20 µA 0.25 µA 23 µA Including current source at maximum programmable output Additionally, the bias module must be enabled when running in standby mode. 5.12.11 DC Characteristics PARAMETER TEST CONDITIONS MIN TYP 1.32 1.
CC1350 www.ti.com SWRS183 – JUNE 2016 5.12.12 Synchronous Serial Interface (SSI) Characteristics Tc = 25°C, VDDS = 3.0 V, unless otherwise noted. PARAMETER NO. PARAMETER S1 S2 (1) S3 (1) (1) MIN TYP 12 MAX UNIT 65024 system clocks tclk_per SSIClk cycle time tclk_high SSIClk high time 0.5 tclk_per tclk_low SSIClk low time 0.5 tclk_per Refer to SSI timing diagrams Figure 5-1, Figure 5-2, and Figure 5-3. S1 S2 SSIClk S3 SSIFss SSITx SSIRx MSB LSB 4 to 16 bits Figure 5-1.
CC1350 SWRS183 – JUNE 2016 www.ti.com S1 S2 SSIClk (SPO = 0) S3 SSIClk (SPO = 1) SSITx (Master) MSB SSIRx (Slave) MSB LSB LSB SSIFss Figure 5-3.
CC1350 www.ti.com SWRS183 – JUNE 2016 5.13 Typical Characteristics 7 5 6 4.5 Current Consumption (PA) Current Consumption (mA) Active Mode Current 4 3.5 3 2.5 2.3 2.8 VDDS (V) 3.3 3 2 0 -40 3.8 -20 0 20 40 60 Temperature (qC) D007 Figure 5-4. Active Mode (MCU) Current Consumption vs Supply Voltage (VDDS) 80 100 110 D037 Figure 5-5. Standby MCU Current Consumption, 32-kHz Clock, RAM and MCU Retention 2 1.5 Differential Nonlinearity (LSB) Integral Nonlinearity (LSB) 4 1 2 1.
CC1350 SWRS183 – JUNE 2016 www.ti.com 5.13.1 Typical Characteristics – Sub-1 GHz -100 -100 -102 -102 Sensitivity (dBm) Sensitivity (dBm) Unless otherwise stated, all performance figures represent an average over six typical parts at room temperature and with the internal DC-DC converter enabled. -104 -106 -108 -106 -108 -110 -110 -112 863 -104 865 867 869 871 Frequency (MHz) 873 -112 903 875 876 908 913 918 Frequency (MHz) D001 Figure 5-10.
CC1350 www.ti.com SWRS183 – JUNE 2016 8 8 7.5 7.5 7 7 Current (mA) Current (mA) Unless otherwise stated, all performance figures represent an average over six typical parts at room temperature and with the internal DC-DC converter enabled. 6.5 6 5.5 5.5 5 4.5 4.5 -20 0 20 40 60 Temperature (qC) 80 4 -40 100 110 11 11 10 10 Current (mA) 12 9 8 7 5 2.6 2.8 3 Voltage (V) 3.2 3.4 3.6 4 1.8 3.
CC1350 SWRS183 – JUNE 2016 www.ti.com 80 80 70 70 60 60 50 50 Selectivity (dB) Selectivity (dB) Unless otherwise stated, all performance figures represent an average over six typical parts at room temperature and with the internal DC-DC converter enabled. 40 30 20 10 0 -8 -6 -4 -2 0 2 4 Frequency Offset (MHz) 6 8 -10 -10 10 15 14.5 14.5 14 13.5 13 12.5 -4 -2 0 2 4 Frequency Offset (MHz) 6 8 10 D014 14 13.5 13 12.
CC1350 www.ti.com SWRS183 – JUNE 2016 15 15 14.5 14.5 14 14 13.5 13.5 Current (mA) Current (mA) Unless otherwise stated, all performance figures represent an average over six typical parts at room temperature and with the internal DC-DC converter enabled. 13 12.5 12 11.5 11 11 10.5 10.5 2.3 2.5 2.7 2.9 3.1 Voltage (V) 3.3 3.5 10 2.1 3.7 25.5 25.5 25 25 Current (mA) 26 24.5 24 23.5 2.7 2.9 3.1 Voltage (V) 3.3 3.5 3.7 D020 24.5 24 23.
CC1350 SWRS183 – JUNE 2016 www.ti.com 40 40 38 38 36 36 34 34 Current (mA) Current (mA) Unless otherwise stated, all performance figures represent an average over six typical parts at room temperature and with the internal DC-DC converter enabled. 32 30 28 32 30 28 26 26 24 24 22 2.1 2.3 2.5 2.7 2.9 3.1 Voltage (V) 3.3 3.5 22 2.1 3.7 2.3 2.5 2.7 D025 Figure 5-34. TX Current With Maximum Output Power vs Voltage, 868 MHz 2.9 3.1 Voltage (V) 3.3 3.5 3.7 D026 Figure 5-35.
CC1350 www.ti.com SWRS183 – JUNE 2016 Unless otherwise stated, all performance figures represent an average over six typical parts at room temperature and with the internal DC-DC converter enabled. -80 8 -81 7.5 -83 Current (mA) Sensitivity (dBm) -82 -84 -85 -86 -87 -88 7 6.5 6 5.5 -89 -90 1.8 2 2.2 2.4 2.6 2.8 3 Voltage (V) 3.2 3.4 3.6 5 -40 3.8 Figure 5-38. RX Bluetooth low energy Sensitivity vs Voltage, 2440 MHz 70 13 60 10 9 8 80 100 110 D030 40 30 20 10 7 0 6 2 2.2 2.
CC1350 SWRS183 – JUNE 2016 www.ti.com Unless otherwise stated, all performance figures represent an average over six typical parts at room temperature and with the internal DC-DC converter enabled. 10 Output Power (dBm) 9.5 9 8.5 8 7.5 7 2.1 2.3 2.5 2.7 2.9 3.1 Voltage (V) 3.3 3.5 3.7 D035 Figure 5-44.
CC1350 www.ti.com SWRS183 – JUNE 2016 6 Detailed Description 6.1 Overview Figure 1-1 shows a block diagram of the core modules of the CC13xx product family. 6.2 Main CPU The CC1350 SimpleLink Wireless MCU contains an ARM Cortex-M3 (CM3) 32-bit CPU, which runs the application and the higher layers of the protocol stack.
CC1350 SWRS183 – JUNE 2016 6.3 www.ti.com RF Core The RF core is a highly flexible and capable radio system that interfaces the analog RF and baseband circuits, handles data to and from the system side, and assembles the information bits in a given packet structure. The RF core can autonomously handle the time-critical aspects of the radio protocols, thus offloading the main CPU and leaving more resources for the user application. The RF core offers a high-level, command-based API to the main CPU.
CC1350 www.ti.com 6.4 SWRS183 – JUNE 2016 Sensor Controller The Sensor Controller contains circuitry that can be selectively enabled in standby mode. The peripherals in this domain may be controlled by the Sensor Controller Engine, which is a proprietary power-optimized CPU. This CPU can read and monitor sensors or perform other tasks autonomously; thereby significantly reducing power consumption and offloading the main CM3 CPU.
CC1350 SWRS183 – JUNE 2016 www.ti.com Table 6-1. GPIOs Connected to the Sensor Controller (1) (1) 6.5 ANALOG CAPABLE 7-mm × 7-mm RGZ DIO NUMBER Y 30 Y 29 Y 28 Y 27 Y 26 Y 25 Y 24 Y 23 N 7 N 6 N 5 N 4 N 3 N 2 N 1 Up to 15 pins can be connected to the Sensor Controller. Up to eight of these pins can be connected to analog modules. Memory The flash memory provides nonvolatile storage for code and data. The flash memory is in-system programmable.
CC1350 www.ti.com 6.7 SWRS183 – JUNE 2016 Power Management To minimize power consumption, the CC1350 supports a number of power modes and powermanagement features (see Table 6-2). Table 6-2. Power Modes SOFTWARE CONFIGURABLE POWER MODES ACTIVE IDLE STANDBY SHUTDOWN RESET PIN HELD CPU Active Off Off Off Off Flash On Available Off Off Off SRAM On On On Off Off Radio Available Available Off Off Off MODE Supply System Current On On Duty Cycled Off Off 1.2 mA + 25.
CC1350 SWRS183 – JUNE 2016 6.8 www.ti.com Clock Systems The CC1350 supports two external and two internal clock sources. A 24-MHz external crystal is required as the frequency reference for the radio. This signal is doubled internally to create a 48-MHz clock. The 32.768-kHz crystal is optional. The low-speed crystal oscillator is designed for use with a 32.768-kHz watch-type crystal. The internal high-speed RC oscillator (48-MHz) can be used as a clock source for the CPU subsystem.
CC1350 www.ti.com SWRS183 – JUNE 2016 The device includes a direct memory access (µDMA) controller. The µDMA controller provides a way to offload data-transfer tasks from the CM3 CPU, thus allowing for more efficient use of the processor and the available bus bandwidth. The µDMA controller can perform transfer between memory and peripherals.
CC1350 SWRS183 – JUNE 2016 www.ti.com 7 Application, Implementation, and Layout NOTE Information in the following Applications section is not part of the TI component specification, and TI does not warrant its accuracy or completeness. TI’s customers are responsible for determining suitability of components for their purposes. Customers should validate and test their design implementation to confirm system functionality. Few external components are required for the operation of the CC1350 device.
CC1350 www.ti.com SWRS183 – JUNE 2016 8 Device and Documentation Support TI offers an extensive line of development tools. Tools and software to evaluate the performance of the device, generate code, and develop solutions are listed in the following. 8.1 Device Nomenclature To designate the stages in the product development cycle, TI assigns prefixes to all part numbers and/or date-code.
CC1350 SWRS183 – JUNE 2016 8.2 www.ti.com Tools and Software Development Kit: Simplelink CC1350 LaunchPad Bluetooth and Sub-1GHz Long Range Wireless Development Kit SPACER The CC1350 LaunchPad combines a Bluetooth Smart with a Sub-1 GHz radio for the ultimate combination of easy mobile phone integration with long range connectivity including a 32-bit ARM Cortex-M3 processor on a single chip. The CC1350 device is a wireless MCU targeting low power, long range wireless applications.
CC1350 www.ti.com 8.3 SWRS183 – JUNE 2016 Documentation Support To receive notification of documentation updates, navigate to the device product folder on ti.com (CC1350). In the upper right corner, click on Alert me to register and receive a weekly digest of any product information that has changed. For change details, review the revision history included in any revised document.
CC1350 SWRS183 – JUNE 2016 8.7 www.ti.com Community Resources The following links connect to TI community resources. Linked contents are provided "AS IS" by the respective contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of Use. TI E2E™ Online Community TI's Engineer-to-Engineer (E2E) Community. Created to foster collaboration among engineers. At e2e.ti.
CC1350 www.ti.com SWRS183 – JUNE 2016 8.11 Glossary TI Glossary This glossary lists and explains terms, acronyms, and definitions. 9 Mechanical Packaging and Orderable Information 9.1 Packaging Information The following pages include mechanical packaging and orderable information. This information is the most current data available for the designated devices. This data is subject to change without notice and revision of this document.
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PACKAGE OPTION ADDENDUM www.ti.com 3-Jul-2016 Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties.
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IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest issue. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and complete.