Datasheet

SimpleLink™ Ultra-Low-Power
Dual-Band Wireless MCU
DEVICE
PREFIX
CC1310
X = Experimental device
Blank = Qualified device
XXX
PACKAGE
RGZ = 48-pin VQFN (Very Thin Quad Flatpack No-Lead)
RHB = 32-pin
RSM =
VQFN
32-pin VQFN
(R/T)
R = Large Reel
T = Small Reel
Fxxx
FLASH SIZE
32KB
64KB
128KB
41
CC1310
www.ti.com SWRS181C –SEPTEMBER 2015–REVISED OCTOBER 2016
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Product Folder Links: CC1310
Device and Documentation SupportCopyright © 2015–2016, Texas Instruments Incorporated
8 Device and Documentation Support
TI offers an extensive line of development tools. Tools and software to evaluate the performance of the
device, generate code, and develop solutions are listed in the following.
8.1 Device Nomenclature
To designate the stages in the product development cycle, TI assigns prefixes to all part numbers and/or
date-code. Each device has one of three prefixes/identifications: X, P, or null (no prefix) (for example,
CC1310 is in production; therefore, no prefix/identification is assigned).
Device development evolutionary flow:
X Experimental device that is not necessarily representative of the final device's electrical
specifications and may not use production assembly flow.
P Prototype device that is not necessarily the final silicon die and may not necessarily meet
final electrical specifications.
null Production version of the silicon die that is fully qualified.
Production devices have been characterized fully, and the quality and reliability of the device have been
demonstrated fully. TI's standard warranty applies.
Predictions show that prototype devices (X or P) have a greater failure rate than the standard production
devices. Texas Instruments recommends that these devices not be used in any production system
because their expected end-use failure rate still is undefined. Only qualified production devices are to be
used.
TI device nomenclature also includes a suffix with the device family name. This suffix indicates the
package type (for example, RGZ).
For orderable part numbers of CC1310 devices in the RSM (4-mm × 4-mm), RHB (5-mm × 5-mm) or RGZ
(7-mm × 7-mm) package types, see the Package Option Addendum of this document, the TI website
(www.ti.com), or contact your TI sales representative.
Figure 8-1. Device Nomenclature