Datasheet

Pin 1 (RF P)
Pin 2 (RF N)
Pin 3 (RXTX)
Pin 1 (RF P)
Pin 2 (RF N)
Pin 1 (RF P)
Pin 2 (RF N)
Red = Not Necessary if Internal Bias is Used
Red = Not Necessary if Internal Bias is Used
Differential Operation
Single-Ended Operation
Single-Ended
Operation With
Antenna Diversity
Pin 3 (RXTX)
CC13xx
(GND exposed die
attached pad)
Pin 3 (RXTX)
Pin 1 (RF P)
Pin 2 (RF N)
24-MHz XTAL
(Load Capacitors
on Chip)
Optional Inductor.
Only Needed for
DCDC Operation
DC Block
DC Block
DC Block
Red = Not Necessary if Internal Bias is Used
Antenna
(50 )
Antenna
(50 )
Antenna
(50 )
Antenna
(50 )
DC Block
Copyright © 2016, Texas Instruments Incorporated
39
CC1310
www.ti.com SWRS181C –SEPTEMBER 2015–REVISED OCTOBER 2016
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Product Folder Links: CC1310
Application, Implementation, and LayoutCopyright © 2015–2016, Texas Instruments Incorporated
7 Application, Implementation, and Layout
NOTE
Information in the following Applications section is not part of the TI component specification,
and TI does not warrant its accuracy or completeness. TI’s customers are responsible for
determining suitability of components for their purposes. Customers should validate and test
their design implementation to confirm system functionality.
Few external components are required for the operation of the CC1310 device. Figure 7-1 shows a typical
application circuit.
The board layout greatly influences the RF performance of the CC1310 device.
On the Texas Instruments CC1310EM-7XD-7793 reference design, the optimal differential impedance
seen from the RF pins into the balun and filter and antenna is 44 + j15.
Figure 7-1 does not show decoupling capacitors for power pins. For a complete reference design, see the product
folder on www.ti.com.
Figure 7-1. Differential Reference Design