Datasheet

ManualsBrandsTEXAS INSTRUMENTS ManualsDev KitsPCB design board

Product

Folder

Sample &

Buy

Technical

Documents

Tools &

Software

Support &

Community

Reference

Design

An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,

intellectual property matters and other important disclaimers. PRODUCTION DATA.

CC1310

SWRS181C –SEPTEMBER 2015–REVISED OCTOBER 2016

CC1310 SimpleLink™ Ultra-Low-Power Sub-1 GHz Wireless MCU

1 Device Overview

1.1 Features

• Microcontroller

– Powerful ARM

Cortex

-M3 Processor

– EEMBC CoreMark

Score: 142

– EEMBC ULPBench™ Score: 158

– Clock Speed up to 48-MHz

– 32KB, 64KB, and 128KB of In-System

Programmable Flash

– 8KB of SRAM for Cache

(or as General-Purpose RAM)

– 20KB of Ultra-Low-Leakage SRAM

– 2-Pin cJTAG and JTAG Debugging

– Supports Over-the-Air (OTA) Update

• Ultra-Low-Power Sensor Controller

– Can Run Autonomously From the Rest of the

System

– 16-Bit Architecture

– 2KB of Ultra-Low-Leakage SRAM for Code and

Data

• Efficient Code-Size Architecture, Placing Parts of

TI-RTOS, Drivers, and Bootloader in ROM

• RoHS-Compliant Package

– 7-mm × 7-mm RGZ VQFN48 (30 GPIOs)

– 5-mm × 5-mm RHB VQFN32 (15 GPIOs)

– 4-mm × 4-mm RSM VQFN32 (10 GPIOs)

• Peripherals

– All Digital Peripheral Pins Can Be Routed to

Any GPIO

– Four General-Purpose Timer Modules

(Eight 16-Bit or Four 32-Bit Timers, PWM Each)

– 12-Bit ADC, 200 ksamples/s, 8-Channel Analog

MUX

– Continuous Time Comparator

– Ultra-Low-Power Clocked Comparator

– Programmable Current Source

– UART

– 2× SSI (SPI, MICROWIRE, TI)

– I

C, I2S

– Real-Time Clock (RTC)

– AES-128 Security Module

– True Random Number Generator (TRNG)

– Support for Eight Capacitive Sensing Buttons

– Integrated Temperature Sensor

SPACER

• External System

– On-Chip Internal DC-DC Converter

– Seamless Integration With the SimpleLink™

CC1190 Range Extenders

• Low Power

– Wide Supply Voltage Range: 1.8 to 3.8 V

– RX: 5.4 mA

– TX at +10 dBm: 13.4 mA

– Active-Mode MCU 48 MHz Running Coremark:

2.5 mA (51 µA/MHz)

– Active-Mode MCU: 48.5 CoreMark/mA

– Active-Mode Sensor Controller at 24 MHz:

0.4 mA + 8.2 µA/MHz

– Sensor Controller, One Wakeup Every Second

Performing One 12-Bit ADC Sampling: 0.95 µA

– Standby: 0.7 µA (RTC Running and RAM and

CPU Retention)

– Shutdown: 185 nA (Wakeup on Extexternernal

Events)

• RF Section

– Excellent Receiver Sensitivity –124 dBm Using

Long-Range Mode, –110 dBm at 50 kbps

(Sub-1 GHz)

– Excellent Selectivity (±100 kHz): 56 dB

– Excellent Blocking Performance (±10 MHz):

90 dB

– Programmable Output Power up to +15 dBm

– Single-Ended or Differential RF Interface

– Suitable for Systems Targeting Compliance With

Worldwide Radio Frequency Regulations

• ETSI EN 300 220, EN 303 204 (Europe)

• FCC CFR47 Part 15 (US)

• ARIB STD-T108 (Japan)

– Wireless M-Bus and Selected IEEE

802.15.4g

PHY

• Tools and Development Environment

– Full-Feature and Low-Cost Development Kits

– Multiple Reference Designs for Different RF

Configurations

– Packet Sniffer PC Software

– Sensor Controller Studio

– SmartRF™ Studio

– SmartRF Flash Programmer 2

– IAR Embedded Workbench

for ARM

– Code Composer Studio™

Summary of content (66 pages)

PAGE 1
Product Folder Sample & Buy Technical Documents Tools & Software Support & Community Reference Design CC1310 SWRS181C – SEPTEMBER 2015 – REVISED OCTOBER 2016 CC1310 SimpleLink™ Ultra-Low-Power Sub-1 GHz Wireless MCU 1 Device Overview 1.
PAGE 2
CC1310 SWRS181C – SEPTEMBER 2015 – REVISED OCTOBER 2016 1.2 • • • • • • • Applications 315-, 433-, 470-, 500-, 779-, 868-, 915-, 920-MHz ISM and SRD Systems Low-Power Wireless Systems With 50-kHz to 5-MHz Channel Spacing Home and Building Automation Wireless Alarm and Security Systems Industrial Monitoring and Control Smart Grid and Automatic Meter Reading Wireless Healthcare Applications 1.3 www.ti.com • • • • • • • Wireless Sensor Networks Active RFID IEEE 802.15.
PAGE 3
CC1310 www.ti.com 1.4 SWRS181C – SEPTEMBER 2015 – REVISED OCTOBER 2016 Functional Block Diagram Figure 1-1 shows a block diagram for the CC1310 device.
PAGE 4
CC1310 SWRS181C – SEPTEMBER 2015 – REVISED OCTOBER 2016 www.ti.com Table of Contents 1 Device Overview ......................................... 1 5.17 DC Characteristics .................................. 23 1.1 Features .............................................. 1 5.18 Thermal Characteristics ............................. 24 1.2 Applications ........................................... 2 5.19 Timing and Switching Characteristics ............... 24 1.3 Description ........................
PAGE 5
CC1310 www.ti.com SWRS181C – SEPTEMBER 2015 – REVISED OCTOBER 2016 2 Revision History NOTE: Page numbers for previous revisions may differ from page numbers in the current version. Changes from October 28, 2015 to October 27, 2016 • • • • • • • • • • • • • • • • Page Added 32KB and 64KB to the Features bullet for in-system programmable flash .......................................... 1 Changed to the correct pin count in the Features bullet RoHS-Compliant Package ........................................
PAGE 6
CC1310 SWRS181C – SEPTEMBER 2015 – REVISED OCTOBER 2016 www.ti.com 3 Device Comparison Table 3-1 lists the device family overview. Table 3-1. Device Family Overview DEVICE PHY SUPPORT FLASH (KB) RAM (KB) GPIOs CC1310F128RGZ Proprietary, Wireless M-Bus, IEEE 802.15.4g 128 20 30 CC1310F64RGZ Proprietary, Wireless M-Bus, IEEE 802.15.4g 64 16 30 CC1310F32RGZ Proprietary, Wireless M-Bus, IEEE 802.15.4g 32 16 30 CC1310F128RHB Proprietary, Wireless M-Bus, IEEE 802.15.
PAGE 7
CC1310 www.ti.com SWRS181C – SEPTEMBER 2015 – REVISED OCTOBER 2016 4 Terminal Configuration and Functions 4.1 Pin Diagram – RSM Package 17 VSS 18 DCDC_SW 19 VDDS_DCDC 20 VSS 21 RESET_N 22 DIO_5 23 DIO_6 24 DIO_7 Figure 4-1 shows the RSM pinout diagram.
PAGE 8
CC1310 SWRS181C – SEPTEMBER 2015 – REVISED OCTOBER 2016 4.2 www.ti.com Signal Descriptions – RSM Package Table 4-1. Signal Descriptions – RSM Package PIN NAME NO. TYPE DESCRIPTION DCDC_SW 18 Power Output from internal DC-DC (1) DCOUPL 12 Power 1.
PAGE 9
CC1310 www.ti.com 4.3 SWRS181C – SEPTEMBER 2015 – REVISED OCTOBER 2016 Pin Diagram – RHB Package 17 DCDC_SW 18 VDDS_DCDC 19 RESET_N 20 DIO_7 21 DIO_8 22 DIO_9 23 DIO_10 24 DIO_11 Figure 4-2 shows the RHB pinout diagram. DIO_12 25 16 DIO_6 DIO_13 26 15 DIO_5 DIO_14 27 14 JTAG_TCKC VDDS 28 13 JTAG_TMSC VDDR 29 12 DCOUPL X24M_P 30 11 VDDS2 X24M_N 31 10 DIO_4 1 2 3 4 5 6 7 8 RF_P RX_TX X32K_Q1 X32K_Q2 DIO_0 DIO_1 DIO_2 9 RF_N VDDR_RF 32 DIO_3 Figure 4-2.
PAGE 10
CC1310 SWRS181C – SEPTEMBER 2015 – REVISED OCTOBER 2016 4.4 www.ti.com Signal Descriptions – RHB Package Table 4-2. Signal Descriptions – RHB Package PIN NAME TYPE NO. DESCRIPTION DCDC_SW 17 Power Output from internal DC-DC (1) DCOUPL 12 Power 1.
PAGE 11
CC1310 www.ti.com 4.5 SWRS181C – SEPTEMBER 2015 – REVISED OCTOBER 2016 Pin Diagram – RGZ Package 25 JTAG_TCKC 26 DIO_16 27 DIO_17 29 DIO_19 28 DIO_18 31 DIO_21 30 DIO_20 33 DCDC_SW 32 DIO_22 35 RESET_N 34 VDDS_DCDC 36 DIO_23 Figure 4-3 shows the RGZ pinout diagram.
PAGE 12
CC1310 SWRS181C – SEPTEMBER 2015 – REVISED OCTOBER 2016 4.6 www.ti.com Signal Descriptions – RGZ Package Table 4-3. Signal Descriptions – RGZ Package PIN NAME TYPE NO. DESCRIPTION DCDC_SW 33 Power Output from internal DC-DC (1) (2) DCOUPL 23 Power 1.
PAGE 13
CC1310 www.ti.com SWRS181C – SEPTEMBER 2015 – REVISED OCTOBER 2016 Table 4-3. Signal Descriptions – RGZ Package (continued) PIN NAME NO. TYPE DESCRIPTION VDDR_RF 48 Power 1.7-V to 1.95-V supply, connect to output of internal DC-DC (2) (5) VDDS 44 Power 1.8-V to 3.8-V main chip supply (1) VDDS2 13 Power 1.8-V to 3.8-V DIO supply (1) VDDS3 22 Power 1.8-V to 3.8-V DIO supply (1) VDDS_DCDC 34 Power 1.8-V to 3.
PAGE 14
CC1310 SWRS181C – SEPTEMBER 2015 – REVISED OCTOBER 2016 www.ti.com 5 Specifications 5.1 Absolute Maximum Ratings over operating free-air temperature range (unless otherwise noted) (1) (2) VDDS (3) MIN MAX UNIT –0.3 4.1 V –0.3 VDDS + 0.3, max 4.1 V –0.3 VDDR + 0.3, max 2.25 V Voltage scaling enabled –0.3 VDDS Voltage scaling disabled, internal reference –0.3 1.49 Voltage scaling disabled, VDDS as reference –0.3 VDDS / 2.
PAGE 15
CC1310 www.ti.com 5.4 SWRS181C – SEPTEMBER 2015 – REVISED OCTOBER 2016 Power Consumption Summary Measured on the Texas Instruments CC1310EM-7XD-7793 reference design unless otherwise noted. Tc = 25°C, VDDS = 3.6 V with DC-DC enabled, unless otherwise noted. Using boost mode (increasing VDDR to 1.95 V), will increase currents in this table by 15% (does not apply to TX 14-dBm setting where this current is already included). PARAMETER Icore Core current consumption TEST CONDITIONS TYP Reset.
PAGE 16
CC1310 SWRS181C – SEPTEMBER 2015 – REVISED OCTOBER 2016 5.6 www.ti.com Receive (RX) Parameters, 861 MHz to 1054 MHz Measured on the Texas Instruments CC1310EM-7XD-7793 reference design with Tc = 25°C, VDDS = 3.0 V, DC-DC enabled, fRF = 868 MHz, unless otherwise noted. All measurements are performed at the antenna input with a combined RX and TX path. PARAMETER TEST CONDITIONS MIN Data rate Data rate offset tolerance, IEEE 802.15.
PAGE 17
CC1310 www.ti.com SWRS181C – SEPTEMBER 2015 – REVISED OCTOBER 2016 Receive (RX) Parameters, 861 MHz to 1054 MHz (continued) Measured on the Texas Instruments CC1310EM-7XD-7793 reference design with Tc = 25°C, VDDS = 3.0 V, DC-DC enabled, fRF = 868 MHz, unless otherwise noted. All measurements are performed at the antenna input with a combined RX and TX path. PARAMETER TEST CONDITIONS MIN TYP MAX UNIT Wanted signal 3 dB above sensitivity limit.
PAGE 18
CC1310 SWRS181C – SEPTEMBER 2015 – REVISED OCTOBER 2016 www.ti.com Receive (RX) Parameters, 431 MHz to 527 MHz (continued) Measured on the Texas Instruments CC1310EM-7XD-4251 reference design with Tc = 25°C, VDDS = 3.0 V, DC-DC enabled, fRF = 433.92 MHz, unless otherwise noted. All measurements are performed at the antenna input with a combined RX and TX path. This frequency band is supported on die Revision B and later.
PAGE 19
CC1310 www.ti.com SWRS181C – SEPTEMBER 2015 – REVISED OCTOBER 2016 Transmit (TX) Parameters, 861 MHz to 1054 MHz (continued) Measured on the Texas Instruments CC1310EM-7XD-7793 reference design with Tc = 25°C, VDDS = 3.0 V, DC-DC enabled, fRF = 868 MHz, unless otherwise noted. All measurements are performed at the antenna input with a combined RX and TX path. PARAMETER Spurious emissions out-of-band, 915 MHz (1) Spurious emissions out-of-band, 920.6 MHz (1) 5.
PAGE 20
CC1310 SWRS181C – SEPTEMBER 2015 – REVISED OCTOBER 2016 www.ti.com 5.10 PLL Parameters Measured on the Texas Instruments CC1310EM-7XD-7793 reference design with Tc = 25°C, VDDS = 3.
PAGE 21
CC1310 www.ti.com SWRS181C – SEPTEMBER 2015 – REVISED OCTOBER 2016 ADC Characteristics (continued) Tc = 25°C, VDDS = 3.0 V, DC-DC disabled. Input voltage scaling enabled, unless otherwise noted.(1) PARAMETER TEST CONDITIONS MIN TYP MAX UNIT (2) Reference voltage Equivalent fixed internal reference(voltage scaling enabled) For best accuracy, the ADC conversion should be initiated through the TI-RTOS API in order to include the gain/offset compensation factors stored in FCFG1.
PAGE 22
CC1310 SWRS181C – SEPTEMBER 2015 – REVISED OCTOBER 2016 www.ti.com 5.15 Low-Power Clocked Comparator Tc = 25°C, VDDS = 3.0 V, unless otherwise noted. PARAMETER TEST CONDITIONS MIN Input voltage range TYP 0 Clock frequency MAX UNIT VDDS 32.8 V kHz Internal reference voltage, VDDS / 2 1.49 to 1.51 V Internal reference voltage, VDDS / 3 1.01 to 1.03 V Internal reference voltage, VDDS / 4 0.78 to 0.79 V Internal reference voltage, DCOUPL / 1 1.25 to 1.
PAGE 23
CC1310 www.ti.com SWRS181C – SEPTEMBER 2015 – REVISED OCTOBER 2016 5.17 DC Characteristics PARAMETER TEST CONDITIONS MIN TYP 1.32 1.54 MAX UNIT TA = 25°C, VDDS = 1.8 V GPIO VOH at 8-mA load IOCURR = 2, high-drive GPIOs only GPIO VOL at 8-mA load IOCURR = 2, high-drive GPIOs only GPIO VOH at 4-mA load IOCURR = 1 GPIO VOL at 4-mA load IOCURR = 1 0.21 GPIO pullup current Input mode, pullup enabled, Vpad = 0 V 71.7 µA GPIO pulldown current Input mode, pulldown enabled, Vpad = VDDS 21.
PAGE 24
CC1310 SWRS181C – SEPTEMBER 2015 – REVISED OCTOBER 2016 www.ti.com DC Characteristics (continued) PARAMETER TEST CONDITIONS MIN TYP MAX UNIT TA = 25°C, VDDS = 3.8 V GPIO pullup current Input mode, pullup enabled, Vpad = 0 V 277 µA GPIO pulldown current Input mode, pulldown enabled, Vpad = VDDS 113 µA GPIO high/low input transition, no hysteresis IH = 0, transition between reading 0 and reading 1 1.
PAGE 25
CC1310 www.ti.com SWRS181C – SEPTEMBER 2015 – REVISED OCTOBER 2016 5.19.3 Clock Specifications 5.19.3.1 24-MHz Crystal Oscillator (XOSC_HF) Measured on the Texas Instruments CC1310EM-7XD-7793 reference design with Tc = 25°C, VDDS = 3.0 V, unless otherwise noted. (1) MIN TYP Crystal frequency 24 ESR equivalent series resistance 20 LM motional inductance, relates to the load capacitance that is used for the crystal (CL in Farads) CL crystal load capacitance UNIT MHz Ω 60 < 1.
PAGE 26
CC1310 SWRS181C – SEPTEMBER 2015 – REVISED OCTOBER 2016 www.ti.com 5.19.4 Flash Memory Characteristics Tc = 25°C, VDDS = 3.0 V, unless otherwise noted. PARAMETER TEST CONDITIONS MIN Supported flash erase cycles before failure TYP MAX 100 Flash page or sector erase current Average delta current UNIT k Cycles 12.6 mA Flash page or sector erase time (1) 8 ms Flash page or sector size 4 KB 8.
PAGE 27
CC1310 www.ti.com SWRS181C – SEPTEMBER 2015 – REVISED OCTOBER 2016 S2 S1 SSIClk S3 SSIFss SSITx MSB LSB 8-bit control SSIRx 0 MSB LSB 4 to 16 bits output data Figure 5-2. SSI Timing for MICROWIRE Frame Format (FRF = 10), Single Transfer S1 S2 SSIClk (SPO = 0) S3 SSIClk (SPO = 1) SSITx (Master) MSB SSIRx (Slave) MSB LSB LSB SSIFss Figure 5-3.
PAGE 28
CC1310 SWRS181C – SEPTEMBER 2015 – REVISED OCTOBER 2016 www.ti.com 5.20 Typical Characteristics 7 5 6 4.5 Current Consumption (PA) Current Consumption (mA) Active Mode Current 4 3.5 3 2.5 2.3 2.8 VDDS (V) 3.3 2 -20 0 20 40 60 Temperature (qC) D007 80 100 110 D037 Figure 5-5. Standby MCU Current Consumption, 32-kHz Clock, RAM and MCU Retention 2 1.5 Differential Nonlinearity (LSB) Integral Nonlinearity (LSB) 3 0 -40 3.8 Figure 5-4.
PAGE 29
CC1310 www.ti.com SWRS181C – SEPTEMBER 2015 – REVISED OCTOBER 2016 -106 -106.5 -107 Sensitivity (dBm) -107.5 -108 -108.5 -109 -109.5 -110 -110.5 -111 863 80 70 70 60 60 50 50 Selectivity (dB) Selectivity (dB) 80 30 20 867 869 871 Frequency (MHz) 873 875 876 D011 Figure 5-11. RX (50-kbps) Sensitivity vs Frequency Figure 5-10.
PAGE 30
CC1310 SWRS181C – SEPTEMBER 2015 – REVISED OCTOBER 2016 www.ti.com 11 -106.2 10.5 Current Consumption (mA) Sensitivity (dBm) -106.8 -107.4 -108 -108.6 -109.2 -109.8 10 9.5 9 8.5 8 7.5 7 6.5 6 -110.4 5.5 -111 -40 -30 -20 -10 0 5 1.8 10 20 30 40 50 60 70 80 90 Temperaure (°C) D016 -106 23 -106.5 22.9 -107 22.8 -107.5 22.7 -108 -108.5 -109 -110 22.2 22.1 2.4 2.6 2.8 3 VDDS (V) 3.2 3.4 3.6 3.2 3.4 3.6 3.8 D019 22.4 -110.5 2.2 2.6 2.8 3 VDDS (V) 22.5 22.3 2 2.4 22.
PAGE 31
CC1310 www.ti.com SWRS181C – SEPTEMBER 2015 – REVISED OCTOBER 2016 40 14.8 35 Output Power (dBm) Current Consumption (mA) 14.7 30 25 14.6 14.5 14.4 14.3 14.2 14.1 20 2.1 2.3 2.5 2.7 2.9 3.1 VDDS (V) 3.3 3.5 14 2.1 3.7 2.3 2.5 2.7 D021 Figure 5-22. TX Current Consumption Maximum Output Power vs Supply Voltage 868 MHz 2.9 3.1 VDDS (V) 3.3 3.5 3.7 D022 Figure 5-23. TX Maximum Output Power vs Supply Voltage 915 MHz 11 10.8 Output Power (dBm) 10.6 10.4 10.2 10 9.8 9.6 9.4 9.2 1.
PAGE 32
CC1310 SWRS181C – SEPTEMBER 2015 – REVISED OCTOBER 2016 www.ti.com 6 Detailed Description 6.1 Overview Figure 1-1 shows a block diagram of the core modules of the CC13xx product family. 6.2 Main CPU The CC1310 SimpleLink Wireless MCU contains an ARM Cortex-M3 (CM3) 32-bit CPU, which runs the application and the higher layers of the protocol stack.
PAGE 33
CC1310 www.ti.com 6.3 SWRS181C – SEPTEMBER 2015 – REVISED OCTOBER 2016 RF Core The RF core is a highly flexible and capable radio system that interfaces the analog RF and baseband circuits, handles data to and from the system side, and assembles the information bits in a given packet structure. The RF core can autonomously handle the time-critical aspects of the radio protocols, thus offloading the main CPU and leaving more resources for the user application.
PAGE 34
CC1310 SWRS181C – SEPTEMBER 2015 – REVISED OCTOBER 2016 6.4 www.ti.com Sensor Controller The Sensor Controller contains circuitry that can be selectively enabled in standby mode. The peripherals in this domain may be controlled by the Sensor Controller Engine, which is a proprietary power-optimized CPU. This CPU can read and monitor sensors or perform other tasks autonomously; thereby significantly reducing power consumption and offloading the main CM3 CPU.
PAGE 35
CC1310 www.ti.com SWRS181C – SEPTEMBER 2015 – REVISED OCTOBER 2016 Table 6-1. GPIOs Connected to the Sensor Controller (1) CC13x0 ANALOG CAPABLE 7 × 7 RGZ DIO NUMBER 5 × 5 RHB DIO NUMBER Y 30 14 Y 29 13 Y 28 12 Y 27 11 9 Y 26 9 8 Y 25 10 7 Y 24 8 6 Y 23 7 5 N 7 4 2 N 6 3 1 N 5 2 0 N 4 1 N 3 0 N 2 N 1 N 0 (1) 6.5 4 × 4 RSM DIO NUMBER Depending on the package size, up to 15 pins can be connected to the Sensor Controller.
PAGE 36
CC1310 SWRS181C – SEPTEMBER 2015 – REVISED OCTOBER 2016 6.7 www.ti.com Power Management To minimize power consumption, the CC1310 device supports a number of power modes and powermanagement features (see Table 6-2). Table 6-2.
PAGE 37
CC1310 www.ti.com SWRS181C – SEPTEMBER 2015 – REVISED OCTOBER 2016 The Sensor Controller is an autonomous processor that can control the peripherals in the Sensor Controller independent of the main CPU. This means that the main CPU does not have to wake up, for example to execute an ADC sample or poll a digital sensor over SPI, thus saving both current and wakeup time that would otherwise be wasted.
PAGE 38
CC1310 SWRS181C – SEPTEMBER 2015 – REVISED OCTOBER 2016 www.ti.com The device includes a direct memory access (µDMA) controller. The µDMA controller provides a way to offload data-transfer tasks from the CM3 CPU, thus allowing for more efficient use of the processor and the available bus bandwidth. The µDMA controller can perform transfer between memory and peripherals.
PAGE 39
CC1310 www.ti.com SWRS181C – SEPTEMBER 2015 – REVISED OCTOBER 2016 7 Application, Implementation, and Layout NOTE Information in the following Applications section is not part of the TI component specification, and TI does not warrant its accuracy or completeness. TI’s customers are responsible for determining suitability of components for their purposes. Customers should validate and test their design implementation to confirm system functionality.
PAGE 40
CC1310 SWRS181C – SEPTEMBER 2015 – REVISED OCTOBER 2016 7.1 www.ti.com TI Design Humidity and Temp Sensor Node for Sub-1 GHz Star Networks Enabling 10+ Year Coin Cell Battery Life This TI Design uses TI's nano-power system timer, boost converter, SimpleLink ultra-low-power Sub-1 GHz wireless MCU platform, and humidity-sensing technologies to demonstrate an ultra-low-power method to duty-cycle sensor end nodes leading to extremely long battery life.
PAGE 41
CC1310 www.ti.com SWRS181C – SEPTEMBER 2015 – REVISED OCTOBER 2016 8 Device and Documentation Support TI offers an extensive line of development tools. Tools and software to evaluate the performance of the device, generate code, and develop solutions are listed in the following. 8.1 Device Nomenclature To designate the stages in the product development cycle, TI assigns prefixes to all part numbers and/or date-code.
PAGE 42
CC1310 SWRS181C – SEPTEMBER 2015 – REVISED OCTOBER 2016 8.2 www.ti.com Tools and Software Development Kit: SimpleLink™ CC1310 Sub-1 GHz Wireless Microcontroller (MCU) LaunchPad™ Development Kit The SimpleLink™ Sub-1 GHz CC1310 wireless microcontroller (MCU) LaunchPad™ development kit is the first LaunchPad kit with a Sub-1 GHz radio, which offers long-range connectivity, combined with a 32-bit ARM® Cortex®-M3 processor on a single chip.
PAGE 43
CC1310 www.ti.com 8.3 SWRS181C – SEPTEMBER 2015 – REVISED OCTOBER 2016 Documentation Support To receive notification of documentation updates, navigate to the device product folder on ti.com (CC1310). In the upper right corner, click on Alert me to register and receive a weekly digest of any product information that has changed. For change details, review the revision history included in any revised document.
PAGE 44
CC1310 SWRS181C – SEPTEMBER 2015 – REVISED OCTOBER 2016 8.7 www.ti.com Community Resources The following links connect to TI community resources. Linked contents are provided "AS IS" by the respective contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of Use. TI E2E™ Online Community The TI engineer-ro-engineer (E2E) community was created to foster collaboration among engineers. At e2e.ti.
PAGE 45
CC1310 www.ti.com SWRS181C – SEPTEMBER 2015 – REVISED OCTOBER 2016 8.11 Glossary TI Glossary This glossary lists and explains terms, acronyms, and definitions. 9 Mechanical, Packaging, and Orderable Information 9.1 Packaging Information The following pages include mechanical packaging and orderable information. This information is the most current data available for the designated devices. This data is subject to change without notice and revision of this document.
PAGE 46
PACKAGE OPTION ADDENDUM www.ti.
PAGE 47
PACKAGE OPTION ADDENDUM www.ti.com Orderable Device 24-Nov-2015 Status (1) CC1310F64RSMT ACTIVE Package Type Package Pins Package Drawing Qty VQFN RSM 32 250 Eco Plan Lead/Ball Finish MSL Peak Temp (2) (6) (3) Green (RoHS & no Sb/Br) CU NIPDAU Level-3-260C-168 HR Op Temp (°C) Device Marking (4/5) -40 to 85 CC1310 F64 (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs.
PAGE 48
PACKAGE MATERIALS INFORMATION www.ti.com 25-Apr-2016 TAPE AND REEL INFORMATION *All dimensions are nominal Device Package Package Pins Type Drawing CC1310F128RGZR VQFN RGZ 48 SPQ Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) B0 (mm) K0 (mm) P1 (mm) W Pin1 (mm) Quadrant 2500 330.0 16.4 7.3 7.3 1.1 12.0 16.0 Q2 CC1310F128RGZT VQFN RGZ 48 250 180.0 16.4 7.3 7.3 1.1 12.0 16.0 Q2 CC1310F128RHBR VQFN RHB 32 3000 330.0 12.4 5.3 5.3 1.1 8.0 12.
PAGE 49
PACKAGE MATERIALS INFORMATION www.ti.com 25-Apr-2016 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) CC1310F128RGZR VQFN RGZ 48 2500 367.0 367.0 38.0 CC1310F128RGZT VQFN RGZ 48 250 210.0 185.0 35.0 CC1310F128RHBR VQFN RHB 32 3000 367.0 367.0 35.0 CC1310F128RHBT VQFN RHB 32 250 210.0 185.0 35.0 CC1310F128RSMR VQFN RSM 32 3000 367.0 367.0 35.0 CC1310F128RSMT VQFN RSM 32 250 210.0 185.0 35.
PAGE 50
PAGE 51
PAGE 52
PAGE 53
PAGE 54
PAGE 55
PAGE 56
PAGE 57
PAGE 58
PAGE 59
IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest issue. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and complete.
PAGE 60
SWRU477
PAGE 61
PAGE 62
STANDARD TERMS AND CONDITIONS FOR EVALUATION MODULES 1. Delivery: TI delivers TI evaluation boards, kits, or modules, including any accompanying demonstration software, components, or documentation (collectively, an “EVM” or “EVMs”) to the User (“User”) in accordance with the terms and conditions set forth herein. Acceptance of the EVM is expressly subject to the following terms and conditions. 1.
PAGE 63
FCC Interference Statement for Class B EVM devices NOTE: This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential installation. This equipment generates, uses and can radiate radio frequency energy and, if not installed and used in accordance with the instructions, may cause harmful interference to radio communications.
PAGE 64
【無線電波を送信する製品の開発キットをお使いになる際の注意事項】開発キットの中には技術基準適合証明を受けていないものがあります。技術適合証明を受けていないもののご使用に際しては、電波法遵守のため、以下のいずれかの措置を取っていただく必要がありますのでご注意ください。 1. 2. 3. 電波法施行規則第6条第1項第1号に基づく平成18年3月28日総務省告示第173号で定められた電波暗室等の試験設備でご使用いただく。実験局の免許を取得後ご使用いただく。技術基準適合証明を取得後ご使用いただく。なお、本製品は、上記の「ご使用にあたっての注意」を譲渡先、移転先に通知しない限り、譲渡、移転できないものとします。上記を遵守頂けない場合は、電波法の罰則が適用される可能性があることをご留意ください。日本テキサス・インスツルメンツ株式会社東京都新宿区西新宿６丁目２４番１号西新宿三井ビル 3.3.3 Notice for EVMs for Power Line Communication: Please see http://www.tij.co.
PAGE 65
SPACER 6. Disclaimers: 6.1 EXCEPT AS SET FORTH ABOVE, EVMS AND ANY WRITTEN DESIGN MATERIALS PROVIDED WITH THE EVM (AND THE DESIGN OF THE EVM ITSELF) ARE PROVIDED "AS IS" AND "WITH ALL FAULTS." TI DISCLAIMS ALL OTHER WARRANTIES, EXPRESS OR IMPLIED, REGARDING SUCH ITEMS, INCLUDING BUT NOT LIMITED TO ANY IMPLIED WARRANTIES OF MERCHANTABILITY OR FITNESS FOR A PARTICULAR PURPOSE OR NON-INFRINGEMENT OF ANY THIRD PARTY PATENTS, COPYRIGHTS, TRADE SECRETS OR OTHER INTELLECTUAL PROPERTY RIGHTS. 6.
PAGE 66
IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest issue. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and complete.