Datasheet

L293, L293D
QUADRUPLE HALF-H DRIVERS
SLRS008C − SEPTEMBER 1986 − REVISED NOVEMBER 2004
10
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
APPLICATION INFORMATION
3
4
5
6
7
8
1
2
9
10
11
12
13
14
15
16
+
+
+
+
D7
D8 D4
D3
L2 IL2
C1
D5
D1
D6 D2
V
CC1
L293
IL1/IL2 = 300 mA
0.22 µF
V
CC2
L1 IL1
D1−D8 = SES5001
Figure 6. Bipolar Stepping-Motor Control
mounting instructions
The Rthj-amp of the L293 can be reduced by soldering the GND pins to a suitable copper area of the printed
circuit board or to an external heat sink.
Figure 9 shows the maximum package power P
TOT
and the θ
JA
as a function of the side of two equal square
copper areas having a thickness of 35 µm (see Figure 7). In addition, an external heat sink can be used (see
Figure 8).
During soldering, the pin temperature must not exceed 260°C, and the soldering time must not exceed 12
seconds.
The external heatsink or printed circuit copper area must be connected to electrical ground.