Datasheet
ISO5500
SLLSE64C –SEPTEMBER 2011–REVISED JUNE 2013
www.ti.com
ABSOLUTE MAXIMUM RATINGS
over operating free-air temperature range (unless otherwise noted)
VALUE
UNIT
MIN MAX
Supply voltage, V
CC1
–0.5 6 V
Total output supply voltage, V
OUT(total)
(V
CC2
– V
EE-P
) –0.5 35 V
35 – V
Positive output supply Voltage, V
OUT+
(V
CC2
– V
E
) –0.5
(V
E
– V
EE-P
)
Negative output supply voltage, V
OUT-
(V
E
– V
EE-P
) –0.5 V
CC2
V
DESAT V
E
– 0.5 V
CC2
Voltage at
V
IN+
, V
IN–
, RESET –0.5 6 V
Peak gate drive output voltage V
o(peak)
–0.5 V
CC2
V
Collector voltage, V
C
–0.5 V
CC2
V
Output current , I
O
(1)
±2.8 A
FAULT output current, I
FL
±20 mA
Human Body Model ESDA / JEDEC JS-001-2012 ±4 kV
Electrostatic Charged Device JEDEC JESD22-C101E ±1.5 kV
All pins
Discharge, ESD Model
Machine Model JEDEC JESD22-A115-A ±200 V
Maximum junction temperature, T
J
170 °C
Maximum storage temperature, T
STG
-65 150 °C
(1) Maximum pulse width = 10 μs, maximum duty cycle = 0.2%.
THERMAL INFORMATION
ISO5500
THERMAL METRIC
(1)
UNITS
DW (16) PIN
θ
JA
Junction-to-ambient thermal resistance 76
θ
JCtop
Junction-to-case (top) thermal resistance 34
θ
JB
Junction-to-board thermal resistance 36
°C/W
ψ
JT
Junction-to-top characterization parameter 8
ψ
JB
Junction-to-board characterization parameter 35
θ
JCbot
Junction-to-case (bottom) thermal resistance n/a
T
SHDN+
185 °C
Thermal Shutdown
T
SHDN-
173 °C
T
SHDN-HYS
Thermal Shutdown Hysteresis 12 °C
P
D
Power Dissipation See Equation 2 through Equation 6 592 mW
(1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.
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