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Circuit Layout and Bill of Materials www.ti.com
5 Circuit Layout and Bill of Materials
Figure 5 shows the silk screen as well as the top and bottom layers of the two-layer board, with the actual
dc-dc converter capturing an area of 20 mm × 14 mm only.
Figure 5. Board Layout: Silk Screen (Left), Top Layer (Middle), Bottom Layer (Right)
Figure 6 shows a picture of the actual board.
Figure 6. Reference Design Board: Top View
Table 2 shows the final bill of materials.
Table 2. Bill of Materials
Designator Part No. Manufacturer Value Package/Size
U1 ISO35T TI Full-duplex XCVR DW-16
U2 TPS76333 TI 3.3-V LDO DBV-5
D1, D2 MBR0520L Fairchild 0.4-W Schottky diode SOD123
C2, C3, C5 C0402C104K4RACTU KEMET 0.1-µF/16V/X7R (ceramic) 0402 (1 × 0,5 mm
2
)
C1, C4 GRM21BR61C106KE15L Murata 10-µF/16V/X5R (ceramic) 0805 (2 × 1,25 mm
2
)
C6 T491A475K016AT KEMET 4.7-µF/16V (tantalum) 3,2 × 1,6 mm
2
T1 DA2303-AL Coilcraft 1:1.5 10 × 12 mm
2
J1, J2 MPT 0,5 / 6-2,54 Phoenix-Contact 6-position terminal block 6,2 × 15,7 mm
2
empty para
4
Isolated, Full-Duplex, 1-Mbps, 3.3-V to 3.3-V RS-485 Interface SLUU470B– December 2010– Revised June 2011
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