Datasheet
ISO3086T
SLLSE27C –JANUARY 2011– REVISED JULY 2011
www.ti.com
REGULATORY INFORMATION
VDE UL
Certified according to DIN EN / IEC 60747-5-2 (VDE 0884 Part 2) Recognized under 1577 Component Recognition Program
Basic Insulation Single / Basic Isolation Voltage, 2500 V
RMS
(1)
Maximum Transient Overvoltage, 4242 V
PK
Maximum Surge Voltage, 4242 V
PK
Maximum Working Voltage, 566 V
PK
File Number: 40016131 (Approval Pending) File Number: E181974 (Approval Pending)
(1) Production tested ≥ 3000 V
RMS
for 1 second in accordance with UL 1577.
IEC SAFETY LIMITING VALUES
Safety limiting intends to prevent potential damage to the isolation barrier upon failure of input or output circuitry.
A failure of the IO can allow low resistance to ground or the supply. Without current limiting, sufficient power is
dissipated to overheat the die; and, damage the isolation barrier—potentially leading to secondary system
failures.
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
I
S
Safety input, output, or supply current θ
JA
= 80.5°C/W, V
I
= 5.5 V, T
J
= 170°C, T
A
= 25°C 327 mA
DW-16
T
S
Maximum case temperature 150 °C
The safety-limiting constraint is the absolute maximum junction temperature specified in the absolute maximum
ratings table. The power dissipation and junction-to-air thermal impedance of the device installed in the
application hardware determines the junction temperature. The assumed junction-to-air thermal resistance in the
Thermal Characteristics table is that of a device installed on a High-K Test Board for Leaded Surface Mount
Packages. The power is the recommended maximum input voltage times the current. The junction temperature is
then the ambient temperature plus the power times the junction-to-air thermal resistance.
THERMAL INFORMATION
ISO3086T
THERMAL METRIC
(1)
DW UNITS
16 PINS
θ
JA
Junction-to-ambient thermal resistance 80.5
θ
JC(TOP)
Junction-to-case(top) thermal resistance 43.8
θ
JB
Junction-to-board thermal resistance 49.7
°C/W
ψ
JT
Junction-to-top characterization parameter 13.8
ψ
JB
Junction-to-board characterization parameter 41.4
θ
JC(BOTTOM)
Junction-to-case(bottom) thermal resistance n/a
P
D
(2)
V
CC1
= V
CC2
= 5.5V, T
J
= 150°C, R
L
= 54Ω, C
L
= 50pF (Driver), C
L
= 15pF
490 mW
(Receiver), Input a 10 MHz 50% duty cycle square wave to Driver and Receiver
(1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.
(2) P
D
= Maximum device power dissipation
12 Copyright © 2011, Texas Instruments Incorporated