Datasheet
ISO3080, ISO3086
ISO3082, ISO3088
www.ti.com
SLOS581E – MAY 2008–REVISED SEPTEMBER 2011
Table 1. Driver Function Table
(1)
ENABLE
INPUT
INPUT
OUTPUTS
(1)
(D)
V
CC1
V
CC2
(DE)
Y / A Z / B
PU PU H H H L
PU PU L H L H
PU PU X L hi-Z hi-Z
PU PU X OPEN hi-Z hi-Z
PU PU OPEN H H L
PD PU X X hi-Z hi-Z
PU PD X X hi-Z hi-Z
PD PD X X hi-Z hi-Z
(1) Driver output pins are Y & Z for full-duplex devices and A & B for half-duplex devices.
Table 2. Receiver Function Table
(1)
DIFFERENTIAL INPUT ENABLE OUTPUT
V
CC1
V
CC2
V
ID
= (V
A
– V
B
) (RE) (R)
PU PU –0.01 V ≤ V
ID
L H
PU PU –0.2 V < V
ID
< –0.01 V L ?
PU PU V
ID
≤ –0.2 V L L
PU PU X H hi-Z
PU PU X OPEN hi-Z
PU PU Open circuit L H
PU PU Short Circuit L H
PU PU Idle (terminated) bus L H
PD PU X X hi-Z
PU PD X L H
(1) PU = Powered Up; PD = Powered Down; H = Logic High; L= Logic Low; X = Irrelevant, hi-Z = High
Impedance (off), ? = Indeterminate
PACKAGE CHARACTERISTICS
over recommended operating conditions (unless otherwise noted)
PARAMETER
(1)
TEST CONDITIONS MIN TYP MAX UNIT
Shortest terminal to terminal distance through
L(I01) Minimum air gap (Clearance) 8.34 mm
air
Shortest terminal to terminal distance across
L(I02) Minimum external tracking (Creepage) 8.1 mm
the package surface
Tracking resistance (Comparative Tracking
CTI DIN IEC 60112 / VDE 0303 Part 1 ≥175 V
Index)
Minimum Internal Gap (Internal Clearance) Distance through the insulation 0.008 mm
Input to output, V
IO
= 500 V, all pins on each
R
IO
Isolation resistance side of the barrier tied together creating a >10
12
Ω
two-terminal device
C
IO
Barrier capacitance Input to output VI = 0.4 sin (4E6πt) 2 pF
C
I
Input capacitance to ground VI = 0.4 sin (4E6πt) 2 pF
(1) Creepage and clearance requirements should be applied according to the specific equipment isolation standards of an application. Care
should be taken to maintain the creepage and clearance distance of a board design to ensure that the mounting pads of the isolator on
the printed circuit board do not reduce this distance.
Creepage and clearance on a printed circuit board become equal according to the measurement techniques shown in the Isolation
Glossary. Techniques such as inserting grooves and/or ribs on a printed circuit board are used to help increase these specifications.
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