Datasheet

0
25
50
75
100
125
150
175
200
225
250
275
300
0 50 100 150 200
T -CaseTemperature-°C
C
SafetyLimitingCurrent-mA
V at3.6V
CC1,2
ISO15, ISO35
ISO15M, ISO35M
www.ti.com SLOS580F – MAY 2008– REVISED JANUARY 2012
IEC SAFETY LIMITING VALUES
Safety limiting intends to prevent potential damage to the isolation barrier upon failure of input or output circuitry.
A failure of the IO can allow low resistance to ground or the supply and, without current limiting, dissipate
sufficient power to overheat the die and damage the isolation barrier potentially leading to secondary system
failures.
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
θ
JA
= 212°C/W, V
I
= 5.5 V,
I
S
Safety input, output, or supply current DW-16 210 mA
T
J
= 170°C, T
A
= 25°C
T
S
Maximum case temperature DW-16 150 °C
The safety-limiting constraint is the absolute maximum junction temperature specified in the absolute maximum
ratings table. The power dissipation and junction-to-air thermal impedance of the device installed in the
application hardware determines the junction temperature. The assumed junction-to-air thermal resistance in the
Thermal Characteristics table is that of a device installed in the JESD51-3, Low Effective Thermal Conductivity
Test Board for Leaded Surface Mount Packages and is conservative. The power is the recommended maximum
input voltage times the current. The junction temperature is then the ambient temperature plus the power times
the junction-to-air thermal resistance.
THERMAL CHARACTERISTICS
over recommended operating conditions (unless otherwise noted)
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
Low-K Thermal Resistance
(1)
168
θ
JA
Junction-to-Air °C/W
High-K Thermal Resistance 96.1
θ
JB
Junction-to-Board Thermal Resistance 61 °C/W
θ
JC
Junction-to-Case Thermal Resistance 48 °C/W
V
CC1
= V
CC2
= 5.25 V, T
J
= 150°C, C
L
= 15 pF,
P
D
Device Power Dissipation 220 mW
Input a 20 MHz 50% duty cycle square wave
(1) Tested in accordance with the Low-K or High-K thermal metric definitions of EIA/JESD51-3 for leaded surface mount packages.
Figure 14. DW-16 θ
JC
Thermal Derating Curve per IEC 60747-5-2
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