Datasheet

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2.3 PCB Layout and Construction

The ISO1176/35T/3086TEVM PCB is a 4-layer board. The top and bottom layers (Figure 10 and

Figure 12) contain signal routing. The remaining layers (Figure 11 and Figure 13) are power and ground

planes. These are split planes to keep the Vcc1/GND1 separate from Vcc2/GND2. The I/O traces are

designed to have a characteristic impedance of 50 Ω.

Figure 10. PCB Top Layer

ISO1176T/35T/3086T Evaluation Module SLLU122A–April 2010–Revised July 2010