Datasheet
ISO1176T
SLLSE28F –OCTOBER 2010–REVISED OCTOBER 2012
www.ti.com
REGULATORY INFORMATION
VDE UL
Certified according to DIN EN 60747-5-2 (VDE 0884 Part 2) Recognized under 1577 Component Recognition Program
Basic Insulation Single / Basic Isolation Voltage, 2500 V
RMS
(1)
Maximum Transient Overvoltage, 4242 V
PK
Maximum Surge Voltage, 4242 V
PK
Maximum Working Voltage, 566 V
PK
File Number: Pending File Number: Pending
(1) Production tested ≥ 3000 V
rms
for 1 second in accordance with UL 1577.
IEC SAFETY LIMITING VALUES
Safety limiting intends to prevent potential damage to the isolation barrier upon failure of input or output circuitry.
A failure of the IO can allow low resistance to ground or the supply and, without current limiting, dissipate
sufficient power to overheat the die and damage the isolation barrier potentially leading to secondary system
failures.
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
Safety input, output, or supply
I
S
DW-16 θ
JA
= 76°C/W, V
I
= 5.5 V, T
J
= 170°C, T
A
= 25°C 347 mA
current
T
S
Maximum case temperature DW-16 150 °C
The safety-limiting constraint is the absolute maximum junction temperature specified in the absolute maximum
ratings table. The power dissipation and junction-to-air thermal impedance of the device installed in the
application hardware determines the junction temperature. The assumed junction-to-air thermal resistance in the
Thermal Characteristics table is that of a device installed on a High-K Test Board for Leaded Surface Mount
Packages. The power is the recommended maximum input voltage times the current. The junction temperature is
then the ambient temperature plus the power times the junction-to-air thermal resistance.
THERMAL INFORMATION
ISO1176T
THERMAL METRIC
(1)
UNITS
DW-16
θ
JA
Junction-to-ambient thermal resistance 76
θ
JC(top)
Junction-to-case(top) thermal resistance 37.9
θ
JB
Junction-to-board thermal resistance 44.6
°C/W
ψ
JT
Junction-to-top characterization parameter 12.1
ψ
JB
Junction-to-board characterization parameter 37.9
θ
JC(bottom)
Junction-to-case(bottom) thermal resistance n/a
(1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.
14 Submit Documentation Feedback Copyright © 2010–2012, Texas Instruments Incorporated
Product Folder Links :ISO1176T