Datasheet

ISO1050
SLLS983H –JUNE 2009–REVISED JUNE 2013 www.ti.com
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with
appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more
susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.
AVAILABLE OPTIONS
PRODUCT RATED ISOLATION PACKAGE MARKED AS ORDERING NUMBER
ISO1050DUB (rail)
ISO1050DUB 2500 V
RMS
DUB-8 ISO1050
ISO1050DUBR (reel)
ISO1050DW (rail)
ISO1050DW 5000 V
RMS
DW-16 ISO1050
ISO1050DWR (reel)
PIN FUNCTIONS
PIN
PACKAGE TYPE DESCRIPTION
NAME
DW DUB
V
CC1
1 1 Supply Digital side supply voltage (3 to 5.5V)
GND1 2 NA GND1 Digital side ground connection
RXD 3 2 O CAN receive data output (LOW for dominant and HIGH for recessive bus states)
NC 4 NA NC No connect
NC 5 NA NC No connect
TXD 6 3 I CAN transmit data input (LOW for dominant and HIGH for recessive bus states)
GND1 7 4 GND1 Digital side ground connection
GND1 8 NA GND1 Digital side ground connection
GND2 9 5 GND2 Transceiver side ground connection
GND2 10 NA GND2 Transceiver side ground connection
NC 11 NA NC No connect
CANL 12 6 I/O Low level CAN bus line
CANH 13 7 I/O High level CAN bus line
NC 14 NA NC No connect
GND2 15 NA GND2 Transceiver side ground connection
V
CC2
16 8 Supply Transceiver side supply voltage (5V)
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