Datasheet

R
G
R
G
+IN
+V
S
V
OUT
REF
1
2
3
4
8
7
6
5
-IN
-V
S
INA827
www.ti.com SBOS631A –JUNE 2012–REVISED JULY 2013
THERMAL INFORMATION
INA827
THERMAL METRIC
(1)
DGK (MSOP) UNITS
8 PINS
θ
JA
Junction-to-ambient thermal resistance 215.4
θ
JCtop
Junction-to-case (top) thermal resistance 66.3
θ
JB
Junction-to-board thermal resistance 97.8
°C/W
ψ
JT
Junction-to-top characterization parameter 10.5
ψ
JB
Junction-to-board characterization parameter 96.1
θ
JCbot
Junction-to-case (bottom) thermal resistance N/A
(1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.
PIN CONFIGURATION
DGK PACKAGE
MSOP-8
(TOP VIEW)
PIN DESCRIPTIONS
NAME NO. DESCRIPTION
–IN 1 Negative input
+IN 4 Positive input
REF 6 Reference input. This pin must be driven by low impedance.
R
G
2, 3 Gain setting pin. Place a gain resistor between pin 2 and pin 3.
V
OUT
7 Output
–V
S
5 Negative supply
+V
S
8 Positive supply
Copyright © 2012–2013, Texas Instruments Incorporated Submit Documentation Feedback 5
Product Folder Links: INA827