Datasheet
INA330
2
SBOS260
www.ti.com
SPECIFIED
PACKAGE TEMPERATURE PACKAGE ORDERING TRANSPORT
PRODUCT PACKAGE-LEAD DESIGNATOR
(1)
RANGE MARKING NUMBER MEDIA, QUANTITY
INA330 MSOP-10 DGS –40°C to +85°C TLB INA330AIDGST Tape and Reel, 250
" """"INA330AIDGSR Tape and Reel, 2500
NOTE: (1) For the most current specifications and package information, refer to our web site at www.ti.com.
PACKAGE/ORDERING INFORMATION
ABSOLUTE MAXIMUM RATINGS
(1)
Supply Voltage .................................................................................. +5.5V
Signal Input Terminals:
(Pins 1, 2, 3, 6, and 10) Voltage
(2)
......................... –0.5V to (V+) + 0.5V
Current
(2)
............................................... ±10mA
Output Short-Circuit
(3)
.............................................................. Continuous
Operating Temperature Range ....................................... –40°C to +125°C
Storage Temperature Range .......................................... –65°C to +150°C
Junction Temperature .................................................................... +150°C
Lead Temperature (soldering, 10s) ............................................... +300°C
NOTES: (1) Stresses above these ratings may cause permanent damage.
Exposure to absolute maximum conditions for extended periods may degrade
device reliability. These are stress ratings only, and functional operation of the
device at these or any other conditions beyond those specified is not implied.
(2) Input terminals are diode clamped to the power-supply rails. Input signals that
can swing more than 0.5V beyond the supply rails should be current limited to
10mA or less. (3) Short-circuit to ground.
Top View MSOP
PIN CONFIGURATION
1
2
3
4
5
10
9
8
7
6
I
1
(R
THERM
)
V+
V
O
I
O
(R
G
)
Enable
I
2
(R
SET
)
V
2
V
1
GND
(Connect to V+)
INA330
ELECTROSTATIC
DISCHARGE SENSITIVITY
This integrated circuit can be damaged by ESD. Texas Instru-
ments recommends that all integrated circuits be handled with
appropriate precautions. Failure to observe proper handling
and installation procedures can cause damage.
ESD damage can range from subtle performance degradation
to complete device failure. Precision integrated circuits may be
more susceptible to damage because very small parametric
changes could cause the device not to meet its published
specifications.