Datasheet

INA326, INA327
2
SBOS222D
www.ti.com
SPECIFIED
PACKAGE TEMPERATURE PACKAGE ORDERING TRANSPORT
PRODUCT PACKAGE-LEAD DESIGNATOR RANGE MARKING NUMBER MEDIA, QUANTITY
INA326 MSOP-8 DGK –40°C to +85°C B26 INA326EA/250 Tape and Reel, 250
" """"INA326EA/2K5 Tape and Reel, 2500
INA327 MSOP-10 DGS –40°C to +85°C B27 INA327EA/250 Tape and Reel, 250
" """"INA327EA/2K5 Tape and Reel, 2500
NOTE: (1) For the most current package and ordering information, download the latest version of this data sheet and see the Package Option Addendum located
at the end of the data sheet.
PACKAGE/ORDERING INFORMATION
(1)
ABSOLUTE MAXIMUM RATINGS
(1)
Supply Voltage .................................................................................. +5.5V
Signal Input Terminals: Voltage
(2)
..............................–0.5V to (V+) + 0.5V
Current
(2)
................................................... ±10mA
Output Short-Circuit ................................................................. Continuous
Operating Temperature Range ....................................... –40°C to +125°C
Storage Temperature Range .......................................... –65°C to +150°C
Junction Temperature .................................................................... +150°C
Lead Temperature (soldering, 10s) ............................................... +300°C
NOTES: (1) Stresses above these ratings may cause permanent damage.
Exposure to absolute maximum conditions for extended periods may degrade
device reliability. These are stress ratings only, and functional operation of the
device at these or any other conditions beyond those specified is not implied.
(2) Input terminals are diode clamped to the power-supply rails. Input signals that
can swing more than 0.5V beyond the supply rails should be current limited to
10mA or less.
ELECTROSTATIC
DISCHARGE SENSITIVITY
This integrated circuit can be damaged by ESD. Texas
Instruments recommends that all integrated circuits be handled
with appropriate precautions. Failure to observe proper han-
dling and installation procedures can cause damage.
ESD damage can range from subtle performance degrada-
tion to complete device failure. Precision integrated circuits
may be more susceptible to damage because very small
parametric changes could cause the device not to meet its
published specifications.
1
2
3
4
8
7
6
5
R
1
V+
V
O
R
2
R
1
V
IN−
V
IN+
V−
INA326
MSOP- 8
1
2
3
4
5
10
9
8
7
6
R
1
V+
V
O
R
2
Enable
R
1
V
IN−
V
IN+
V−
(Connect to V+)
INA327
MSOP- 10
Top View
PIN CONFIGURATION