Datasheet

INA3221
SBOS576A –MAY 2012–REVISED JUNE 2013 www.ti.com
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with
appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more
susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.
PACKAGING INFORMATION
(1)
PRODUCT PACKAGE-LEAD PACKAGE DESIGNATOR PACKAGE MARKING
INA3221AIRGV QFN-16 RGV INA3221
(1) For the most current package and ordering information see the Package Option Addendum at the end of this document, or see the
device product folder at www.ti.com.
ABSOLUTE MAXIMUM RATINGS
(1)
Over operating free-air temperature range, unless otherwise noted.
VALUE UNIT
Voltage Supply, V
S
6 V
Differential (VIN+) – (VIN–)
(2)
–26 to +26 V
IN+, IN–
Analog inputs Common-mode –0.3 to +26 V
VBUS, VPU 26 V
Critical, warning, power valid 6 V
Digital outputs
Timing control 26V V
Data line, SDA (GND – 0.3) to +6 V
Serial bus
Clock line, SCL (GND – 0.3) to (V
S
+ 0.3) V
Input, into any pin 5 mA
Current
Open-drain, digital output 10 mA
Storage –65 to +150 °C
Temperature
Junction +150 °C
Human body model (HBM) 2500 V
Electrostatic discharge (ESD) ratings Charged-device model (CDM) 1000 V
Machine model (MM) 200 V
(1) Stresses above these ratings may cause permanent damage. Exposure to absolute maximum conditions for extended periods may
degrade device reliability. These are stress ratings only, and functional operation of the device at these or any other conditions beyond
those specified is not implied.
(2) VIN+ and VIN– can have a differential voltage of –26 V to +26 V; however, the voltage at these pins must not exceed the range of
–0.3 V to +26 V.
2 Submit Documentation Feedback Copyright © 2012–2013, Texas Instruments Incorporated
Product Folder Links: INA3221