Datasheet

OUT
A2
A1
B2
B1
IN-
IN+
GND
NC
(1)
NC
(1)
NC
(1)
IN+
IN+
IN-
IN-
NC
(1)
8
9
10
5
4
3
1 2
7 6
GND
OUT
INA216
www.ti.com SBOS503C –JUNE 2010– REVISED NOVEMBER 2011
THERMAL INFORMATION
INA216A1YFF,
INA216A2YFF
INA216A3YFF,
THERMAL METRIC
(1)
UNITS
INA216A4YFF
YFF
4 PINS
θ
JA
Junction-to-ambient thermal resistance 160
θ
JC(top)
Junction-to-case(top) thermal resistance 75
θ
JB
Junction-to-board thermal resistance 76
°C/W
ψ
JT
Junction-to-top characterization parameter 3
ψ
JB
Junction-to-board characterization parameter 74
θ
JC(bottom)
Junction-to-case(bottom) thermal resistance n/a
(1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.
THERMAL INFORMATION
INA216A1RSW,
INA216A2RSW
INA216A3RSW,
THERMAL METRIC
(1)
UNITS
INA216A4RSW
RSW
10 PINS
θ
JA
Junction-to-ambient thermal resistance 114.9
θ
JC(top)
Junction-to-case(top) thermal resistance 66.3
θ
JB
Junction-to-board thermal resistance 21.4
°C/W
ψ
JT
Junction-to-top characterization parameter 1.9
ψ
JB
Junction-to-board characterization parameter 21.4
θ
JC(bottom)
Junction-to-case(bottom) thermal resistance N/A
(1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.
PIN CONFIGURATIONS
RSW PACKAGE
YFF PACKAGE
ThinQFN-10
WCSP-4
(TOP VIEW)
(TOP VIEW)
(2) Bump side down. Drawing not to scale.
(3) Power supply is derived from shunt
(minimum common-mode range = 1.8V)
(1) No internal connection.
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Product Folder Link(s): INA216