Datasheet

20k
100k
40k
100k
40k
R
1
100
ADS8325
ADC
D
OUT
DCLOCK
CS
REF
V
REF
5V
+IN
IN
V+
V+
GND
C
1
1000pF
SENSE
REF 2
REF 1
V
IN
+IN
IN
INA159
REF 1
IN
+IN
V
REF 2
V+
OUT
SENSE
1
2
3
4
8
7
6
5
INA159
TOP VIEW
MSOP
INA159-EP
SBOS443 NOVEMBER 2008 ..........................................................................................................................................................................................
www.ti.com
Figure 1. Typical Application
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with
appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more
susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.
ORDERING INFORMATION
(1)
ORDERABLE PART PACKAGE
TEMPERATURE PACKAGE LEAD TOP-SIDE MARKING
NUMBER
(2)
DESIGNATOR
-55 ° C to 125 ° C INA159AMDGKTEP MSOP-8 Tape and reel DGK OAA
(1) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI
web site at www.ti.com.
(2) Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at
www.ti.com/sc/package .
2 Submit Documentation Feedback Copyright © 2008, Texas Instruments Incorporated
Product Folder Link(s): INA159-EP